EP0346486A1
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EP
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Resin composition and solder resist resin composition
Assignee: Nippon Kayaku Co Ltd
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Filing: 1988-12-12
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Granted: —
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Expires: 2008-12-12
Abstract
Abstract A resin composition or a solder resist resin composition which comprises (A) an epoxy resin and/or (B) epoxy acrylate obtained by reaction 1 chemical equivalent of the epoxy group of an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, (C) a copolymer of styrene with maleic anhydride, (D) an unsaturated compound other than compound (B), and (E) a photopolymerization initiator.
Inventors
- 👤 Kazuyoshi Nawata
- 👤 Tetsuo Ohkubo
- 👤 Minoru Yokoshima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 02:14
CPC Classifications
C; C08; C08L; C08L63/00; C08F; C08F283/00; C08F283/10; C08F299/00; C08F299/02; C08F299/026; C08L63/10; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
53 words
A resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photo-polymerization initiator (E).
Claim 2
Dependent Claim
53 words
A resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photo-polymerization initiator (E).
Claim 3
Dependent Claim
55 words
A solder resist resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0,1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photopolymerization initiator (E).
Claim 4
Dependent Claim
55 words
A solder resist resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0,1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photopolymerization initiator (E).
Claim 5
Dependent Claim
94 words
A resin composition according to claim 1 or 2, wherein the amount of the component (A) is 0 to 40% by weight, the amount of the component (B) is 0 to 40% by weight, the sum of the amount of the component (A) and the component (B) is 5 to 50% by weight, the amount of the component (C) is 5 to 40% by weight, the amount of the component (D) is 20 to 90% by weight, and the amount of the component ( E ) is 0.1 to 1 5 % by weight.
Claim 6
Dependent Claim
21 words
A resin composition according to claim 1 or 2, wherein the component (A) and/or the component (B) is solid at 40°C.
Claim 7
Dependent Claim
98 words
A resin composition according to claim 1 or 2, wherein the component (D) is one or more compounds selected from the group consisting of a reaction product of a polybasic carboxylic anhydride with a reaction product of a novolak- or bisphenol-type epoxy resin with (meth)acrylic acid, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, carbitol (meth)acrylate, phenoxyethyl (meth)acrylate, acryloylmorpholine, tripropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane tripropoxy tri(meth)acrylate, neopentyl glycol hydroxypivalate di(meth)acrylate, dioxane glycol di(meth)acrylate, tris(hydroxyethyl)isocyanurate di(meth)acrylate, tris(hydroxyethyl)isocyanurate tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, phosphoric ester of 2-hydroxyethyl (meth)acrylate, and an equimolar reaction product of an acid anhydride with a hydroxyl-containing compound.
Claim 8
Dependent Claim
47 words
A resin composition according to claim 1 or 2, wherein the component (D) is one or more compounds selected from the group consisting of trimethylolpropane triacrylate, pentaerythritol triacrylate, tris(hydroxyethyl)isocyanurate diacrylate, neopentyl glycol hydroxypivalate diacrylate, carbitol acrylate, acryloylmorpholine, phosphoric ester of 2-hydroxyethyl (meth)acrylate, dipentaerythritol hexaacrylate, and dipentaerythritol pentaacrylate.
References Cited (Backward Citations)
No citation records indexed.
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