EP0340959A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
Assignee: Digital Equipment Corp
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Filing: 1989-04-24
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Granted: —
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Expires: 2009-04-24
Abstract
Abstract A package (10) for integrated circuit chips, or other electrical devices, provides mechanical shock and thermal protection for the chips, and in addition, protects the chips from electromagnetic interference and electrostatic discharge. The package includes a printed wiring board base (12) for reception of one or more circuit chips (24), and a conductive heat sink and cover (14). The conductive heat sink, in conjunction with a reference plane (18) in the wiring board base (16), acts as an EMI shield for the chips. The heat sink is covered with an insulating layer, on top of which, a conductive coating is placed. The conductive coating is electrically connected to the reference plane (18), and the two act to protect the chips from electrostatic discharges. Compliant pads support the chips, and a thermally conductive elastomer can be placed on top of each chip between the chips and the inner top surface of the heat sink. The chips are thereby held securely in position, and are thermally connected to the heat sink.
Inventors
- 👤 Charles R. Barker Iii
- 👤 Richard J. Casabona
- 👤 David M. Fenwick
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 21:00
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W40/00; H10W40/60; H10W40/611; H10W42/00; H10W42/20; H10W42/60; H10W40/20; H10W40/231; H10W40/233; H10W40/242; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
94 words
A package for one or more electrical devices comprising: a housing for reception of at least one electrical device; means on said housing to direct heat away from a received electrical device; means on said housing to compliantly and securely hold a received device in position to protect a received device from mechanical shock; means on said housing to shield a received device from electromagnetic interference, and conversely, to shield the exterior environment from the electromagmetic emissions from a received device; and, means on said housing to shield a received device from electrostatic discharge.
Claim 2
Dependent Claim
94 words
A package for one or more electrical devices comprising: a housing for reception of at least one electrical device; means on said housing to direct heat away from a received electrical device; means on said housing to compliantly and securely hold a received device in position to protect a received device from mechanical shock; means on said housing to shield a received device from electromagnetic interference, and conversely, to shield the exterior environment from the electromagmetic emissions from a received device; and, means on said housing to shield a received device from electrostatic discharge.
Claim 3
Dependent Claim
20 words
The package of claim 1, wherein said housing includes a sealed enclosure for reception of at least one electrical device.
Claim 4
Dependent Claim
37 words
The package of claim 1, wherein said means on said housing to direct heat away from a received electrical device comprises a heat sink and means to thermally connect said heat sink to a received electrical device.
Claim 5
Dependent Claim
33 words
The package of claim 3, wherein said means to thermally connect said heat sink to received electrical device comprises a thermally conductive material disposed between said heat sink and a received electrical device.
Claim 6
Dependent Claim
35 words
The package of claim 1, wherein said means to compliantly and securely hold a received device comprises at least a first compliant pad means disposed between a base of said housing and a received device.
Claim 7
Dependent Claim
28 words
The package of claim 5 further including at least a second compliant pad means disposed between an inner top surface of said heat sink, and a received device.
Claim 8
Dependent Claim
17 words
The package of claim 6, wherein said second compliant pad means is formed from thermally conductive material.
Claim 9
Dependent Claim
52 words
The package of claim 1, wherein said means on said housing to shield a received device from electromagnetic interference comprises: a base member including an electrically conductive ground plane; and, an electrically conductive cover member mechanically and electrically connected to said base member to form a shielded enclosure for a received device.
Claim 10
Dependent Claim
54 words
The package of claim 8, wherein said means on said housing to shield a received device from electrostatic discharge comprises: an insulating layer of material disposed on an exterior surface of said conductive cover member; and, a layer of electrically conductive material disposed on said insulating layer, and electrically connected to said base member.
Claim 11
Dependent Claim
167 words
A package for one or more electrical devices, such as integrated circuit chips, comprising; a housing including a base member and a heat sink cover member, said heat sink being made of electrically conductive material, and being mechanically attached to said base member, and electrically attached to a conductive layer in said base member, to form an enclosure for a received electrical device which shields a received device from electromagnetic interference, and shields the external environment from electromagnetic emissions generated by a receive device; compliant means disposed on said base member for supporting a received device in a mechanical shock protected manner; means to thermally contact said heat sink to a received device to provide protection of a received device from extreme temperatures; and, an insulating layer of material disposed on an exterior surface of said heat sink, and a conductive layer of conductive material disposed over said insulating layer, and electrically connected to said base member to provide protection of a received device from electrostatic discharge.
Claim 12
Dependent Claim
167 words
A package for one or more electrical devices, such as integrated circuit chips, comprising; a housing including a base member and a heat sink cover member, said heat sink being made of electrically conductive material, and being mechanically attached to said base member, and electrically attached to a conductive layer in said base member, to form an enclosure for a received electrical device which shields a received device from electromagnetic interference, and shields the external environment from electromagnetic emissions generated by a receive device; compliant means disposed on said base member for supporting a received device in a mechanical shock protected manner; means to thermally contact said heat sink to a received device to provide protection of a received device from extreme temperatures; and, an insulating layer of material disposed on an exterior surface of said heat sink, and a conductive layer of conductive material disposed over said insulating layer, and electrically connected to said base member to provide protection of a received device from electrostatic discharge.
References Cited (Backward Citations)
No citation records indexed.
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