Convection-cooling arrangement for electrical components, particularly of integrated circuits with semiconductors

Abstract

Abstract The convection cooling arrangement for electronic components (8) arranged in groups on printed-circuit boards (2) has a two-piece cooling body (7). The upper part (9) of the cooling body (7) is a board (4) which has large surface area structures on the side facing away from the components. The lower part (3) of the cooling body (7), which is arranged on the components (8) to be cooled, consists of two plastic-metal composite films (10, 11), which are connected fixedly to one another at least in the edge region, and which form an intermediate space filled with a highly thermally-conductive flexible material. The plastic-metal composite film (10), resting on the components (8), has recesses (12), produced by deep-drawing, which are matched to the position and shape of the components (8). <IMAGE>

Inventors

• 👤 Hans-Jürgen Dipl.-Ing. Richter

Bibliographic Details