EP0338706A2 — A carrier assembly and a process for producing a …

Claim 1

Independent Claim 142 words

A carrier assembly for releasably supporting a semi-conductor package including a package body and a plurality of leads extending from the body, the carrier assembly comprising a rigid carrier (82) having retaining means (118, 120) arranged for releasably securing a semi-conductor package against vertical movement relative to the carrier, and being characterised by inter-connection means (16) for attachment to the leads of the semi-conductor package at the end portions thereof for substantially fixing the end portions with respect to one another, and a first registration means (34, 36) provided by the inter-connection means and a second registration means (110, 112) provided by the carrier, the first and second registration means being positioned to engage one another to secure the inter-connection means against transverse movement relative to the carrier whereby to align the end portions of the leads with respect to the carrier.

Claim 2

Dependent Claim 142 words

A carrier assembly for releasably supporting a semi-conductor package including a package body and a plurality of leads extending from the body, the carrier assembly comprising a rigid carrier (82) having retaining means (118, 120) arranged for releasably securing a semi-conductor package against vertical movement relative to the carrier, and being characterised by inter-connection means (16) for attachment to the leads of the semi-conductor package at the end portions thereof for substantially fixing the end portions with respect to one another, and a first registration means (34, 36) provided by the inter-connection means and a second registration means (110, 112) provided by the carrier, the first and second registration means being positioned to engage one another to secure the inter-connection means against transverse movement relative to the carrier whereby to align the end portions of the leads with respect to the carrier.

Claim 3

Dependent Claim 55 words

An assembly according to claim 1, characterised in that the carrier and the inter-connection means are constructed substantially of dielectric materials, and in that the carrier has a surface (100, 102, 104, 106) positioned to engage the leads of a semi-conductor package and thereby to co-operate with the retaining means for securing the semi-conductor package.

Claim 4

Dependent Claim 21 words

An assembly according to claim 2, characterised in that the surface is substantially planar for engaging the leads in a plane.

Claim 5

Dependent Claim 72 words

An assembly according to any of claims 1 to 3 characterised in that the first registration means comprises a registration opening formed through the inter-connection means, and in that the second registration means comprises a pin integral with the carrier, the pin having a profile corresponding to the shape of the registration opening whereby the pin when extending through the registration opening tends to align the inter-connection means relative to the carrier.

Claim 6

Dependent Claim 91 words

An assembly according to any of claims 1 to 3 characterised in that the first registration means comprises a plurality of registration openings formed through the inter-connection means, and in that the second registration means comprises a plurality of pins integral with the carrier, each of the pins being associated with a respective one of the registration openings and having a profile corresponding to the shape of the associated registration openings whereby the pins when extending through the associated registration openings tend to align the inter-connection means relative to the carrier.

Claim 7

Dependent Claim 21 words

An assembly according to any preceding claim characterised in that the inter-connection means comprises a frame for surrounding the semi-conductor package.

Claim 8

Dependent Claim 39 words

An assembly according to claim 6 characterised in that the inter-connection means comprises a further frame (46) similar to the first frame, and adhesive means (42) for securing the two frames with the leads of the semi-conductor package therebetween.

Claim 9

Dependent Claim 29 words

An assembly according to claim 7 characterised in that the first and further frames are rectangular and in that the first registration means are provided at opposite corners thereof.

Claim 10

Dependent Claim 46 words

An assembly according to claim 7 or 8 characterised in that metallic sheet members (66, 68, 70, 72) are provided for attachment between the first and further frames at the opposite corners, and in that the first registration means are provided by the metallic sheet members.

Claim 11

Dependent Claim 104 words

A carrier according to any preceding claim characterised in that the retaining means comprise first and second channels (114, 116) formed in a portion (108) of the carrier, first and second retaining members (118, 120) mounted in the first and second channels respectively for linear movement towards and away from a central region of the carrier, and biasing means (134, 136) for urging the first and second retaining members towards the central region whereby to cause the retaining members to engage the semi-conductor package body when the body is positioned at the central region so as to locate the body relative to the carrier.

Claim 12

Dependent Claim 56 words

An assembly according to claim 10 characterised in that each of the retaining members comprises a retainer body (148) slidable within the associated channel, a leg (150) extending from the retainer body, and a beak (152) extending from one end of the leg, the beak having an inclined surface (154) positioned to engage the package body.

Claim 13

Dependent Claim 14 words

An assembly according to any preceding claim in combination with a semi-conductor package (47).

Claim 14

Dependent Claim 63 words

A carrier for use in an assembly according to any preceding claim, the carrier being characterised by a rigid support (82), retaining means (118, 120) arranged for releasably securing a semi-conductor package against movement in a direction vertically of the rigid support, and registration means (110, 112) for engagement with corresponding registration means provided by means attached to leads of the semi-conductor package.

Claim 15

Dependent Claim 206 words

A process for producing an assembly comprising a carrier (82) and a semi-conductor package (47) releasably mounted on the carrier, characterised by the steps of providing a semi-conductor package (47) having a package body (44, 48), a plurality of electrically conductive leads (50) extending outwardly from the package body, and an electrically conductive frame (56) attached to end portions of the leads remote from the package body; forming at least one registration opening (74, 76) through the conductive frame at a selected location thereof; providing a dielectric frame (16); forming at least one alignment opening (34, 36) through the dielectric frame; fastening the dielectric frame to the leads of the semi-conductor package in a position such that the at least one alignment opening is aligned with the at least one registration opening; removing portions (58, 60, 62, 64) of the conductive frame to isolate the selected location from the leads; providing a rigid carrier (82) having releasable retaining means (118, 120) and at least one registration pin (110, 112); and releasably mounting the semi-conductor package and the dielectric frame on the rigid carrier with the retaining means engaging the package body and the at least one registration pin engaged within the at least one registration opening.

Claim 16

Dependent Claim 206 words

A process for producing an assembly comprising a carrier (82) and a semi-conductor package (47) releasably mounted on the carrier, characterised by the steps of providing a semi-conductor package (47) having a package body (44, 48), a plurality of electrically conductive leads (50) extending outwardly from the package body, and an electrically conductive frame (56) attached to end portions of the leads remote from the package body; forming at least one registration opening (74, 76) through the conductive frame at a selected location thereof; providing a dielectric frame (16); forming at least one alignment opening (34, 36) through the dielectric frame; fastening the dielectric frame to the leads of the semi-conductor package in a position such that the at least one alignment opening is aligned with the at least one registration opening; removing portions (58, 60, 62, 64) of the conductive frame to isolate the selected location from the leads; providing a rigid carrier (82) having releasable retaining means (118, 120) and at least one registration pin (110, 112); and releasably mounting the semi-conductor package and the dielectric frame on the rigid carrier with the retaining means engaging the package body and the at least one registration pin engaged within the at least one registration opening.

Claim 17

Dependent Claim 79 words

A process according to claim 14 characterised by the further steps of providing a second dielectric frame (46); forming at least one second alignment opening (34, 36) through the second dielectric frame; and prior to removing the portions of the conductive frame, fastening the second dielectric frame to the first dielectric frame with the leads and the conductive frame positioned therebetween and with the at least one second alignment opening aligned with the at least one first alignment opening.

Claim 18

Dependent Claim 48 words

A process according to claim 15 characterised in that the at least one first alignment opening, the at least one second alignment opening, and the at least one registration opening are circular with the alignment openings being slightly larger in diameter than the at least one registration opening.

Claim 19

Dependent Claim 45 words

A process according to claim 15 or 16 characterised in that the fastening of the second dielectric frame to the first dielectric frame is achieved by utilising a pressure sensitive adhesive (42), and by pressing the dielectric frames towards one another with the adhesive therebetween.

Claim 20

Dependent Claim 165 words

A process for manufacturing an assembly comprising a carrier and a leaded semi-conductor package releasably mounted on the carrier, characterised by the steps of providing a leaded semi-conductor package (47) including a package body (44, 48), a plurality of electrically conductive leads (50) extending outwardly from the package body, and an electrically conductive frame (56) attached to end portions of the leads remote from the package body; forming a pair of registration openings (74, 76) through the conductive frame at first and second select locations thereon; forming a pair of first alignment openings (34, 36) through a first dielectric frame (16); fastening the first dielectric frame to the leads in a select position to align each first alignment opening with one of the registration openings; and removing portions of the conductive frame other than the select locations, whereby the select locations are integrally supported with respect to the end portions of the leads by the first dielectric frame and are electrically isolated from the leads.

Claim 21

Dependent Claim 165 words

A process for manufacturing an assembly comprising a carrier and a leaded semi-conductor package releasably mounted on the carrier, characterised by the steps of providing a leaded semi-conductor package (47) including a package body (44, 48), a plurality of electrically conductive leads (50) extending outwardly from the package body, and an electrically conductive frame (56) attached to end portions of the leads remote from the package body; forming a pair of registration openings (74, 76) through the conductive frame at first and second select locations thereon; forming a pair of first alignment openings (34, 36) through a first dielectric frame (16); fastening the first dielectric frame to the leads in a select position to align each first alignment opening with one of the registration openings; and removing portions of the conductive frame other than the select locations, whereby the select locations are integrally supported with respect to the end portions of the leads by the first dielectric frame and are electrically isolated from the leads.

A carrier assembly and a process for producing a carrier assembly for a semi-conductor package

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