EP0337485A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Film carrier for RF IC
Assignee: NTT Inc
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Filing: 1989-04-14
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Granted: —
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Expires: 2009-04-14
Abstract
Abstract A waveguide film carrier includes an insulating flexible substrate (1A), RF (3), bias supply (4) and ground (5) electrodes formed on the insulating flexible substrate, and conductive leads (6) connected to the electrodes. An opening portion (2) corresponding to a bare-chip semiconductor element (9) to be mounted is formed in a portion of the insulating flexible substrate. The leads are formed to project in the opening portion at positions corresponding to electrode pads of the bare-chip semiconductor element to be mounted. The leads are formed on an outer peripheral portion of the insulating substrate to project at positions corresponding to the internal connection terminals of the package. The waveguide film carrier further includes at least one waveguide. The waveguide is constituted by the RF electrodes for contributing to RF signal propagation, the ground electrodes and the insulating flexible substrate.
Inventors
- 👤 Hisashi Tomimuro
- 👤 Fuminori Ishitsuka
- 👤 Nobuo Sato
- 👤 Takaaki Osaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 19:21
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W44/00; H10W44/20; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W44/203; H10W44/216; H10W70/68; H10W70/682; H10W72/071; H10W72/077; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
155 words
A waveguide film carrier which has an insulating flexible substrate, RF, bias supply and ground electrodes formed on said insulating flexible substrate, and conductive leads connected to said electrodes, and which mounts a bare-chip semiconductor element in a package and RF-connecting electrode pads of said bare-chip semiconductor element to internal connection terminals of said package, wherein an opening portion corresponding to said bare-chip semiconductor element to be mounted is formed in a portion of said insulating flexible substrate, said leads are formed to project in said opening portion at positions corresponding to said electrode pads of said bare-chip semiconductor element to be mounted, said leads are formed on an outer peripheral portion of said insulating substrate to project at positions corresponding to said internal connection terminals of said package, and further comprising at least one waveguide constituted by said RF electrodes for contributing to RF signal propagation, said ground electrodes and said insulating flexible substrate.
Claim 2
Dependent Claim
155 words
A waveguide film carrier which has an insulating flexible substrate, RF, bias supply and ground electrodes formed on said insulating flexible substrate, and conductive leads connected to said electrodes, and which mounts a bare-chip semiconductor element in a package and RF-connecting electrode pads of said bare-chip semiconductor element to internal connection terminals of said package, wherein an opening portion corresponding to said bare-chip semiconductor element to be mounted is formed in a portion of said insulating flexible substrate, said leads are formed to project in said opening portion at positions corresponding to said electrode pads of said bare-chip semiconductor element to be mounted, said leads are formed on an outer peripheral portion of said insulating substrate to project at positions corresponding to said internal connection terminals of said package, and further comprising at least one waveguide constituted by said RF electrodes for contributing to RF signal propagation, said ground electrodes and said insulating flexible substrate.
Claim 3
Dependent Claim
26 words
A film carrier according to claim 1, wherein said leads are formed to project on an extended plane on one surface of said insulating flexible substrate.
Claim 4
Dependent Claim
30 words
A film carrier according to claim 1, wherein said waveguide comprises a coplanar waveguide obtained by forming said RF and ground electrodes on one surface of said insulating flexible substrate.
Claim 5
Dependent Claim
30 words
A film carrier according to claim 1, wherein said waveguide comprises a slot line obtained by forming said RF and ground electrodes on one surface of said insulating flexible substrate.
Claim 6
Dependent Claim
56 words
A film carrier according to claim 1, wherein said waveguide comprises a microstrip line obtained by forming said RF and ground electrodes on both surfaces of said insulating flexible substrate, respectively, said electrodes formed on one surface on which said leads are formed being connected to said electrodes formed on the other surface via through holes.
Claim 7
Dependent Claim
41 words
A film carrier according to claim 1, wherein said waveguide comprises a shielded coplanar waveguide obtained by forming said RF and ground electrodes on one surface of said insulating flexible substrate and forming said ground electrodes on the other surface thereof.
Claim 8
Dependent Claim
21 words
A film carrier according to claim 1, wherein bumps consisting of gold are formed at distal end portions of said leads.
Claim 9
Dependent Claim
17 words
A film carrier according to claim 1, wherein said insulating flexible substrate consists of a polyimide resin.
Claim 10
Dependent Claim
89 words
An RF IC film carrier comprising: an insulating flexible substrate having an opening portion; a plurality of electrodes formed to be separated from each other on said flexible substrate; and a plurality of conductive leads for selectively connecting electrodes of a bare-chip semiconductor element to be located in said opening portion of said flexible substrate to said electrodes formed on said flexible substrate, wherein the other ends of said electrodes project outward from said flexible substrate, so that some of said electrodes and said flexible substrate constitute a waveguide.
Claim 11
Dependent Claim
89 words
An RF IC film carrier comprising: an insulating flexible substrate having an opening portion; a plurality of electrodes formed to be separated from each other on said flexible substrate; and a plurality of conductive leads for selectively connecting electrodes of a bare-chip semiconductor element to be located in said opening portion of said flexible substrate to said electrodes formed on said flexible substrate, wherein the other ends of said electrodes project outward from said flexible substrate, so that some of said electrodes and said flexible substrate constitute a waveguide.
Claim 12
Dependent Claim
26 words
A film carrier according to claim 9, wherein said electrodes include an RF electrode for contributing to propagation of an RF signal and a ground electrode.
Claim 13
Dependent Claim
22 words
A film carrier according to claim 9, wherein each of said electrodes is formed integrally with a corresponding one of said leads.
Claim 14
Dependent Claim
161 words
An RF IC comprising: a bare-chip semiconductor element; a package having a base portion, a projecting portion, formed integrally with said base portion, for forming a closed loop, and a connection conductor formed across said projecting portion; a cover for said package; and an RF IC film carrier including an insulating flexible substrate having an opening portion, a plurality of electrodes formed to be separated from each other on said flexible substrate, and a plurality of conductive leads for selectively connecting electrodes of said semiconductor element located in said opening portion of said flexible substrate to said electrodes formed on said flexible substrate, the other ends of said electrodes projecting outward from said flexible substrate, so that some of said electrodes and said flexible substrate constitute a waveguide, wherein said film carrier is housed in a region surrounded by said projecting portion of said package, and said electrodes on said film carrier are connected to said connection conductor of said package.
Claim 15
Dependent Claim
161 words
An RF IC comprising: a bare-chip semiconductor element; a package having a base portion, a projecting portion, formed integrally with said base portion, for forming a closed loop, and a connection conductor formed across said projecting portion; a cover for said package; and an RF IC film carrier including an insulating flexible substrate having an opening portion, a plurality of electrodes formed to be separated from each other on said flexible substrate, and a plurality of conductive leads for selectively connecting electrodes of said semiconductor element located in said opening portion of said flexible substrate to said electrodes formed on said flexible substrate, the other ends of said electrodes projecting outward from said flexible substrate, so that some of said electrodes and said flexible substrate constitute a waveguide, wherein said film carrier is housed in a region surrounded by said projecting portion of said package, and said electrodes on said film carrier are connected to said connection conductor of said package.
References Cited (Backward Citations)
No citation records indexed.
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