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EP0333149A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Ceramic composite and method of preparation thereof

Assignee: Hitachi Ltd
•
Filing: 1989-03-15
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Granted: —
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Expires: 2009-03-15
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Abstract

Abstract A ceramic composite in which a barrier layer of at least one metal selected from those of Groups Va and VIa of the periodic table is provided on the surface of a carbide, nitride, oxide or boride ceramic member (2), and a soldering material (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table or a soldering material (4) comprising Ni as the principal component is metallized or joined thereonto is obtained by forming the barrier on the surface of the ceramic member (2) by means of vapor deposition, sputtering, chemical vapor deposition, chemical plating or like methods and forming a soldering material layer (4) on the barrier layer by heating it at a temperature not below the melting point of the soldering material (4).

Inventors

  • 👤 Hisanori Okamura
  • 👤 Masahiko Sakamoto
  • 👤 Hirosi Akiyama
  • 👤 Mutuo Kamoshita
  • 👤 Takao Funamoto

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 13:07
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/622; C04B35/64; C04B35/645; C04B37/00; C04B37/003; C04B37/006; C04B37/02; C04B37/023; C04B37/026; C04B2237/00; C04B2237/02; C04B2237/12; C04B2237/122; C04B2237/123; C04B2237/125; C04B2237/126; C04B2237/127; C04B2237/30; C04B2237/32; C04B2237/36; C04B2237/365; C04B2237/40; C04B2237/403; C04B2237/405; C04B2237/406; C04B2237/407; C04B2237/50; C04B2237/70; C04B2237/708; C04B2237/72; C04B2237/86

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 73 words
A ceramic composite in which a barrier layer of at least one metal selected from those of Groups Va and VIa of the periodic table is provided on the surface of a ceramic member (2), and a soldering material (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table or a soldering material (4) comprising Ni as the principal component is provided thereon.
Claim 2
Dependent Claim 73 words
A ceramic composite in which a barrier layer of at least one metal selected from those of Groups Va and VIa of the periodic table is provided on the surface of a ceramic member (2), and a soldering material (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table or a soldering material (4) comprising Ni as the principal component is provided thereon.
Claim 3
Dependent Claim 31 words
A ceramic composite according to claim 1, wherein the soldering material (4) contains 0.5-30% by weight of at least one element selected from those of Group IVa of the periodic table.
Claim 4
Dependent Claim 31 words
A ceramic composite according to claim 1, wherein the soldering material (4) contains 0.5-20% by weight of at least one element selected from those of Group IVa of the periodic table.
Claim 5
Dependent Claim 17 words
A ceramic composite according to claim 1, wherein said metal layer has a thickness of 0.1-10 µm.
Claim 6
Dependent Claim 54 words
A ceramic composite according to claim 1, wherein the remaining component of the soldering material (4) containing the element of Group IVa is a metal, or an alloy comprising as the principal compo­nent at least two thereof, selected from the group consisting of Cu, Ag, Ni, Cr, Pd, Pt, Al, Si, Co and Mn.
Claim 7
Dependent Claim 46 words
A ceramic composite article comprising the ceramic composite according to claim 1 and another member joined thereonto with or without the aid of another soldering material (4) comprising a hard solder or soft solder free of any element of Group IVa of the periodic table therebetween.
Claim 8
Dependent Claim 48 words
A silicon carbide ceramic composite, in which there are joined, respectively, a Cr-containing layer onto the surface of a silicon carbide member(2), and a solder­ing material layer (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table thereonto.
Claim 9
Dependent Claim 48 words
A silicon carbide ceramic composite, in which there are joined, respectively, a Cr-containing layer onto the surface of a silicon carbide member(2), and a solder­ing material layer (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table thereonto.
Claim 10
Dependent Claim 49 words
A silicon carbide ceramic composite article which comprises the ceramic composite according to claim 7 and another member joined thereonto with or without the aid of another soldering material (4) comprising a hard solder or soft solder free of any element of Group IVa of the periodic table therebetween.
Claim 11
Dependent Claim 18 words
A silicon carbide composite according to claim 7, wherein the Cr-containing layer has a thickness of 0.5-10 µm.
Claim 12
Dependent Claim 56 words
A silicon carbide composite according to claim 7, wherein the remaining component of the soldering material (4) containing the element of Group IVa of the periodic table is a metal, or an alloy compris­ing as the principal component at least two thereof, selected from the group consisting of Cu, Ag, Ni, Pd, Al, Si, and Mn.
Claim 13
Dependent Claim 12 words
A heater which comprises the silicon carbide composite according to claim 8.
Claim 14
Dependent Claim 15 words
A package for a semiconductor which comprises the silicon carbide composite according to claim 8.
Claim 15
Independent Claim 102 words
A method of preparation of a ceramic com­posite comprising the steps of (1) forming a barrier layer of at least one metal selected from those of Groups Va and VIa of the periodic table on the surface of a ceramic member(2) and (2) providing thereon a soldering material (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table or a soldering material (4) comprising Ni as the principal component, and heating it at a temperature not below the melting point of the soldering material (4) to form a soldering material layer (4).
Claim 16
Independent Claim 102 words
A method of preparation of a ceramic com­posite comprising the steps of (1) forming a barrier layer of at least one metal selected from those of Groups Va and VIa of the periodic table on the surface of a ceramic member(2) and (2) providing thereon a soldering material (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table or a soldering material (4) comprising Ni as the principal component, and heating it at a temperature not below the melting point of the soldering material (4) to form a soldering material layer (4).
Claim 17
Dependent Claim 36 words
A method of preparation of a ceramic composite according to claim 13, wherein the soldering material (4) contains 0.5-30% by weight of at least one element selected from those of Group IVa of the periodic table.
Claim 18
Dependent Claim 36 words
A method of preparation of a ceramic com­posite according to claim 13, wherein the soldering material 4) contains 0.5-20% by weight of at least one element selected from those of Group IVa of the periodic table.
Claim 19
Dependent Claim 83 words
A method of preparation of a silicon carbide ceramic composite according to claim 7, comprising the steps of (1) forming a Cr-containing layer on the surface of a silicon carbide ceramic member (2), and (2) providing thereon a soldering material (4) containing 0.5-70% by weight of at least one element selected from those of Group IVa of the periodic table, and heating it at a temperature not below the melting point of the soldering material (4) to form a soldering material layer (4).
Claim 20
Dependent Claim 37 words
A method of preparation of a silicon carbide composite according to claim 16, wherein the solder­ing materiai (4) contains 0.5-30% by weight of at least one element selected from those of Group IVa of the periodic table.
Claim 21
Dependent Claim 37 words
A method of preparation of a silicon carbide composite according to claim 16, wherein the soldering material 4) contains 0.5-20% by weight of at least one element selected from those of Group IVa of the period­ic table.
Claim 22
Dependent Claim 28 words
A method of preparation according to claim 13, wherein the barrier layer of metal is formed by means of vapor deposition, sputtering, chemical vapor deposition or chemical plating.
Claim 23
Dependent Claim 41 words
A method of preparation according to claim 13, wherein the barrier layer of metal is formed by printing or coating a Cr powder in the form of paste and then heating it in a non-oxidizing atmosphere or in vacuo at 800-1200°C.

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