Subassembly for optoelectronic devices

Claim 2

A subassembly for an optoelectronic device comprising a semiconductor base having a major surface characterized by a first groove in said surface adapted to receive a portion of an optical fiber, said first groove having side walls and an end face formed by crystallographic planes which are oblique to said surface, an insulative layer formed on at least a portion of said surface, and metal contacts disposed on said layer, at least one of said contacts overlapping said end face and forming a reflector, said device being disposed over said reflector and connected to said contacts, so that said reflector directs light between said device and said fiber.

Claim 3

The subassembly of claim 1 wherein said base has a second groove arranged in tandem with said first groove and extending to the exterior of said subassembly, said fiber having a larger diameter portion which fits into said second groove and a narrower diameter portion which fits into said first groove.

Claim 4

The subassembly of claim 2 wherein the length of said grooves permits the end of said fiber to abut said reflector.

Claim 5

The subassembly of claim 1 further including a semiconductor lid disposed on said base, said lid having a major surface and a cavity therein for receiving said device, and further having a third groove therein aligned with said first groove, thereby forming an elongated channel for receiving said fiber.

Claim 6

The subassembly of claim 4 wherein said lid has an opening in communication with said cavity and a conformal coating, inserted through said opening, covers said device.

Claim 7

The subassembly of claim 4 including said fiber attached thereto and wherein said lid has an opening in communication with said elongated channel and an adhesive, inserted through said opening, secures said fiber to said subassembly.

Claim 8

The subassembly of claim 4 wherein exterior major surfaces of said base and lid are metalized.

Claim 9

The subassembly of claims 1-6 or 7 wherein said semiconductor comprises single crystal silicon, said major surface is a (100) crystallographic plane and said end face is a (111) crystallographic plane.

Claim 10

The subassembly of claims 1-6 or 7 wherein device is a photodiode.

Claim 11

A subassembly for an optoelectronic device comprising a semiconductor base having a major surface, characterized by and insulative layer on said surface, metal contacts disposed on said layer, said device being located on said surface and connected to said contacts, and a semiconductor lid having a cavity, said lid being disposed over said base so that said device is positioned in said cavity, at least one dimension of said lid parallel to said surface being less than the corresponding dimension of said base, so that segments of said contacts extend from under said lid to the exterior of said subassembly, and said subassembly having channel means for receiving an optical fiber for carrying light between said device and the exterior of said subassembly.

Claim 12

A subassembly for an optoelectronic device comprising a semiconductor base having a major surface, characterized by and insulative layer on said surface, metal contacts disposed on said layer, said device being located on said surface and connected to said contacts, and a semiconductor lid having a cavity, said lid being disposed over said base so that said device is positioned in said cavity, at least one dimension of said lid parallel to said surface being less than the corresponding dimension of said base, so that segments of said contacts extend from under said lid to the exterior of said subassembly, and said subassembly having channel means for receiving an optical fiber for carrying light between said device and the exterior of said subassembly.

Claim 13

The subassembly of claim 10 wherein said lid has an opening in communication with said cavity, and a conformal coating, inserted through said opening, covers said device.

Claim 14

The subassembly of claim 10 including said fiber attached thereto and wherein said lid has an opening in communication with said channel means and an adhesive, inserted through said opening, secures said fiber to said subassembly.

Claim 15

The subassembly of claim 12 wherein said channel means comprises a groove in said base and a groove in said lid, said grooves facing, and being aligned with, one another and having side walls which are crystallographic planes.

Claim 16

The subassembly of claim 13 wherein said channel means comprises a reflector and a third groove in tandem with the groove in said base, said third groove having a crystallographic end face on which said reflector is disposed, said device being positioned over said reflector which directs light between said device and said fiber.

Claim 17

The subassembly of claims 10-13 or 14 wherein said base and lid comprise single crystal silicon.

Claim 18

A subassembly for an optoelectronic device characterized by a first member which is transparent to light transmitted between said device and the exterior of said subassembly, said device being mounted on one side of said first member, a semiconductor lid mounted on said one side of said first member and hermetically sealed thereto, said lid having a cavity therein for receiving said device, a semiconductor second member mounted on another side of said first member, said second member having a groove therein adapted to receive an optical fiber, said groove having side walls and an oblique end face formed by crystallographic planes, and a reflector disposed on said end face to direct light between said fiber and said device and through said first member.

Claim 19

A subassembly for an optoelectronic device characterized by a first member which is transparent to light transmitted between said device and the exterior of said subassembly, said device being mounted on one side of said first member, a semiconductor lid mounted on said one side of said first member and hermetically sealed thereto, said lid having a cavity therein for receiving said device, a semiconductor second member mounted on another side of said first member, said second member having a groove therein adapted to receive an optical fiber, said groove having side walls and an oblique end face formed by crystallographic planes, and a reflector disposed on said end face to direct light between said fiber and said device and through said first member.

Claim 20

The subassembly of claim 16 wherein said device is a photodiode.

Claim 21

The subassembly of claim 16 wherein said lid and said second member comprise single crystal silicon.

Claim 22

The subassembly of claims 16,17 or 18 wherein said first member comprises a transparent glass.

Claim 23

The subassembly of claims 16,17 or 18 wherein said first member comprises silicon.

Claim 24

A subassembly for an optoelectronic device comprising a base on which said device is mounted, characterized by a semiconductor lid positioned over said base, said lid having a groove therein for receiving an optical fiber and a reflector formed on an end face of said groove to direct light between said fiber and said device.

Claim 25

A subassembly for an optoelectronic device comprising a base on which said device is mounted, characterized by a semiconductor lid positioned over said base, said lid having a groove therein for receiving an optical fiber and a reflector formed on an end face of said groove to direct light between said fiber and said device.

Claim 26

The subassembly of claim 21 wherein said base comprise a semiconductor substrate.

Claim 27

The subassembly of claim 21 wherein said base comprises a printed circuit board.

Claim 28

The subassembly of claims 21,22 or 23 further characterized by a semiconductor carrier having an aperture extending therethrough, said carrier being positioned between said base and said lid, and a lens mounted in said aperture so as to focus light between said reflector and said device.

Claim 29

The subassembly of claims 21, 22, 23 or 24 wherein said base has a recess into which said device is mounted, said reflector being positioned above said recess.

Claim 30

The subassembly of claims 21, 22, 23 or 24 wherein said aperture has an upper portion for holding said lens and a lower portion forming a cavity for receiving said device.

Claim 31

The subassembly of claims 21, 22, 23, or 24 wherein said device comprises a light emitting diode.

Claim 32

A subassembly comprising a semiconductor base, at least one optical or electronic chip mounted on said base, characterized by a semiconductor lid mounted on said base so as to cover said at least one chip, and means for aligning said lid and base to one another comprising at least one hole in each of said base and lid, said holes being positioned so that when they are aligned, then the base and lid are also aligned, and a sphere positioned in one of the holes so as to guide said holes into alignment.

Claim 33

A subassembly comprising a semiconductor base, at least one optical or electronic chip mounted on said base, characterized by a semiconductor lid mounted on said base so as to cover said at least one chip, and means for aligning said lid and base to one another comprising at least one hole in each of said base and lid, said holes being positioned so that when they are aligned, then the base and lid are also aligned, and a sphere positioned in one of the holes so as to guide said holes into alignment.

Claim 34

The subassembly of claim 28 wherein said base and lid each have at least two holes with pair of holes in the base and lid being positioned so that when the pairs are aligned, then the base and lid are aligned, and further including a sphere in one of the holes of each of said pairs.

Claim 35

The subassembly of claim 28 or 29 wherein the side walls of said holes are crystallographic planes.

Claim 36

The subassembly of claim 30 wherein said spheres are ball bearings.

Claim 37

The subassembly of claim 29 wherein said base comprises an elongated strip on which a plurality of said chips are positioned at intervals thereon, said lid comprises an elongated strip covering said chips, said holes are formed at opposite ends of said strips, and said strips are secured to one another and are segmentable into individual structures each incorporating at least one of said chips.