EP0331161A1
Expired / Lapsed
EP
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Method for fabricating multilayer circuits
Assignee: EIDP Inc
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Filing: 1989-03-02
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Granted: —
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Expires: 2009-03-02
Abstract
Abstract Method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes whereby - an unpierced dielectric green tape (3) is laminated on an insulating substrate (1) provided with a conductive pattern (2) - vias (4) are forming in the dielectric tape (3). - vias (4) are filled with conductive metallizations. - conductive pattern (5) is applied to the dielectric tape (3). - the assembly is fired (eventually after each strep). - the sequence of streps is repeated until the desired number of circuit layers has been obtained.
Inventors
- 👤 Joseph Richard Rellick
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 04:26
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2203/00; H05K2203/06; H05K2203/068; H05K2203/10; H05K2203/107; H05K3/0011; H05K3/0017; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1057; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163; Y10T29/49165
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
171 words
A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) providing a dimensionally stable electrically insulative substrate; (b) applying to the substrate a patterned conductive layer; (c) firing the patterned conductive layer; (d) laminating to the fired patterned conductive layer and exposed areas of the substrate a layer of dielectric green tape; (e) forming vias in selected positions through the layer of dielectric green tape in registration with the fired patterned conductive layer of step (c): (f) firing the laminated dielectric green tape layer; (g) filling the vias in the fired dielectric tape layer with a conductive metallization; (h) firing the filled vias in the dielectric tape layer; (i) applying a patterned conductive layer to the fired dielectric green tape layer in registry with the vias therein; (j) firing the patterned conductive layer; and (k) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (d) through (j) until the desired number of circuit layers has been obtained.
Claim 2
Independent Claim
171 words
A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) providing a dimensionally stable electrically insulative substrate; (b) applying to the substrate a patterned conductive layer; (c) firing the patterned conductive layer; (d) laminating to the fired patterned conductive layer and exposed areas of the substrate a layer of dielectric green tape; (e) forming vias in selected positions through the layer of dielectric green tape in registration with the fired patterned conductive layer of step (c): (f) firing the laminated dielectric green tape layer; (g) filling the vias in the fired dielectric tape layer with a conductive metallization; (h) firing the filled vias in the dielectric tape layer; (i) applying a patterned conductive layer to the fired dielectric green tape layer in registry with the vias therein; (j) firing the patterned conductive layer; and (k) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (d) through (j) until the desired number of circuit layers has been obtained.
Claim 3
Dependent Claim
21 words
The method of claim 1 in which step (f) is omitted and the via fill metallizations are co-fired in step (h).
Claim 4
Dependent Claim
32 words
The method of claim 1 in which steps (f) and (h) are eliminated and the dielectric green tape layer, via fill metallizations and overlying patterned conductive layer are co-fired in step (j).
Claim 5
Dependent Claim
26 words
The method of claim 1 in which step (h) is omitted and the via fill metallizations and overlying patterned conductive layer are co-fired in step (j).
Claim 6
Independent Claim
229 words
A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) providing a dimensionally stable substrate; (b) laminating to a surface of the substrate a layer of dielectric green tape; (c) optionally forming vias in the laminated green tape; (d) firing the laminated dielectric green tape layer; (e) filling any vias in the laminated dielectric tape with a conductive metallization; (f) firing any filled vias in the fired dielectric tape layer; (g) applying to the fired dielectric tape layer a patterned conductive layer; (h) firing the patterned conductive layer; (i) laminating a dielectric green tape layer to the fired patterned conductive layer and exposed areas of the underlying dielectric tape layer; (j) forming vias in the laminated green tape layer of step (i); (k) firing the laminated green tape layer which was applied in step (j); (l) filling the vias in the fired green tape layer from step (k) with a conductive metallization; (m) firing the filled vias contained in the fired dielectric tape layer from step (1); (n) applying to the fired dielectric tape layer from step (m) a patterned conductive layer; (o) firing the patterned conductive layer from step (n); and (p) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (i) through (o) until the desired number of circuit layers has been obtained.
Claim 7
Independent Claim
229 words
A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) providing a dimensionally stable substrate; (b) laminating to a surface of the substrate a layer of dielectric green tape; (c) optionally forming vias in the laminated green tape; (d) firing the laminated dielectric green tape layer; (e) filling any vias in the laminated dielectric tape with a conductive metallization; (f) firing any filled vias in the fired dielectric tape layer; (g) applying to the fired dielectric tape layer a patterned conductive layer; (h) firing the patterned conductive layer; (i) laminating a dielectric green tape layer to the fired patterned conductive layer and exposed areas of the underlying dielectric tape layer; (j) forming vias in the laminated green tape layer of step (i); (k) firing the laminated green tape layer which was applied in step (j); (l) filling the vias in the fired green tape layer from step (k) with a conductive metallization; (m) firing the filled vias contained in the fired dielectric tape layer from step (1); (n) applying to the fired dielectric tape layer from step (m) a patterned conductive layer; (o) firing the patterned conductive layer from step (n); and (p) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (i) through (o) until the desired number of circuit layers has been obtained.
Claim 8
Dependent Claim
30 words
The method of claim 5 in which steps (f) and (m) are omitted and the via fill metallizations and patterned conductive layers are co-fired in steps (h) and (o), respectively.
Claim 9
Dependent Claim
31 words
The method of claim 5 in which steps (d) and (k) are omitted and the laminated green tape layers and via fill metallizations are co-fired in steps (f) and (m), respectively.
Claim 10
Dependent Claim
36 words
The method of claim 5 in which steps (d), (f), (k) and (m) are omitted and the laminated green tape layers, via fill metallizations and patterned conductive layers are co-fired in steps (h) and (o), respectively.
References Cited (Backward Citations)
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