EP0330512A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Producing electronic components with the aid of lead frames
Assignee: Fujitsu Ltd
•
Filing: 1989-02-24
•
Granted: —
•
Expires: 2009-02-24
Abstract
Abstract A lead frame (10) includes an outside frame portion having a central opening (14) and a rectangular mount portion (16) supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array (22₁,...22₄) disposed along a side of the mount portion, the lead elements included in the array being connected to each other by a common tie bar element (24), and two expandable tie bar elements (26) extending between the outside frame portion and each of the lead element arrays to support each lead element array from the outside frame portion, each of the expandable tie bar elements including a portion shaped so that it can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolytic plating process thereof, thereby facilitating production of a uniform plated layer.
Inventors
- 👤 Toshiaki Suzuki
- 👤 Yoji Murakami
- 👤 Masao Kobayashi
- 👤 Osamu Yamauchi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 20:22
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/01; H10W70/04; H10W70/048; H10W70/411; H10W70/456; H10W70/457; H10W90/00; H10W90/811; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W74/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
122 words
A lead frame, for use in producing an electronic component, consisting of a sheet-form unit apertured so as to leave a mounting portion (16) located between respective apertures (14), but supported by remaining portions (18) of the said unit that connect the said mounting portion to an outer frame portion (12) surrounding the said apertures and mounting portion, and so as to leave a set of lead elements (22₁, 22₂, 22₃, 22₄) arrayed alongside the said mounting portion but interconnected, at respective ends remote from that portion, by a common tie-bar element (24), the said array being supported from the said outer frame portion by flexible link means (26) extending in a non-rectilinear manner so as to permit expansion by deformation thereof.
Claim 2
Dependent Claim
122 words
A lead frame, for use in producing an electronic component, consisting of a sheet-form unit apertured so as to leave a mounting portion (16) located between respective apertures (14), but supported by remaining portions (18) of the said unit that connect the said mounting portion to an outer frame portion (12) surrounding the said apertures and mounting portion, and so as to leave a set of lead elements (22₁, 22₂, 22₃, 22₄) arrayed alongside the said mounting portion but interconnected, at respective ends remote from that portion, by a common tie-bar element (24), the said array being supported from the said outer frame portion by flexible link means (26) extending in a non-rectilinear manner so as to permit expansion by deformation thereof.
Claim 3
Dependent Claim
131 words
A lead frame for use in a production of an electric component, comprising: an outside frame portion having an central opening formed therein; a mount portion supported by said outside frame portion and disposed within said central opening thereof, and on which an electronic element is to be mounted; at least one lead element array disposed along a side of said mount portion, respectively, all lead elements included in said array being connected to each other by a common tie bar element; and at least two expandable tie bar elements extending between said outside frame portion and said lead element array, to support said lead element array by said outside frame portion, each of said expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof.
Claim 4
Dependent Claim
131 words
A lead frame for use in a production of an electric component, comprising: an outside frame portion having an central opening formed therein; a mount portion supported by said outside frame portion and disposed within said central opening thereof, and on which an electronic element is to be mounted; at least one lead element array disposed along a side of said mount portion, respectively, all lead elements included in said array being connected to each other by a common tie bar element; and at least two expandable tie bar elements extending between said outside frame portion and said lead element array, to support said lead element array by said outside frame portion, each of said expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof.
Claim 5
Dependent Claim
58 words
A lead frame as set forth in Claim 2, wherein said common tie bar element is integrated with outer ends of said lead elements included in said array, each of said expandable tie bar elements being connected to said outside frame portion at one end thereof and to said common tie bar element at the other end thereof.
Claim 6
Dependent Claim
74 words
A lead frame as set forth in Claim 2, wherein one of said expandable tie bar elements is connected to said outside frame portion at one end thereof and to an outermost one of the lead elements in said array at the other end, the other expandable tie bar element being connected to said outside frame portion and to the other outermost one of the lead elements in said array at the other end.
Claim 7
Dependent Claim
37 words
A lead frame as set forth in Claim 2, wherein said expandable tie bar elements for supporting said lead element array by said outside frame portion are disposed symmetrically to a center of said lead element array.
Claim 8
Dependent Claim
155 words
A method of manufacturing an electronic component, using a lead frame as claimed in claim 1 comprising: mounting an electronic element on the said mounting portion of the lead frame; establishing electrical connections between respective terminals of the said electronic element and respective nearer end portions of the said lead elements; encapsulating the said mounting portion with the said electronic element and the said nearer end portions of the lead elements within a sealed structure; bending the said remote ends of the lead elements out of the main plane of the said lead frame so that the said flexible link means are expanded but maintain connection between the said lead element array and the said outer frame portion; and plating the said remote ends of the lead elements by means of an electrolytic plating process in which the plating current is passed by way of the said outer frame portion and the flexible link means.
Claim 9
Independent Claim
149 words
A method of producing an electronic component using a lead frame including an outside frame portion having a central opening formed therein, a mount portion supported by the outside frame portion and disposed within said central opening thereof, and at least one lead element array disposed along a side of the mount portion, respectively, which comprises the steps of: mounting an electronic element on the mount portion of said lead frame; sealing the mount portion of said lead frame, said electronic element mounted thereon, and the inner end portions of the lead elements included in said lead element array with a suitable material; bending outer portions of said lead elements extending from the sealed portion by a press; performing an electrolytic-plating process to coat the bent lead elements of said lead frame with a suitable alloy layer; and trimming the bent and plated lead elements of said lead frame.
Claim 10
Independent Claim
149 words
A method of producing an electronic component using a lead frame including an outside frame portion having a central opening formed therein, a mount portion supported by the outside frame portion and disposed within said central opening thereof, and at least one lead element array disposed along a side of the mount portion, respectively, which comprises the steps of: mounting an electronic element on the mount portion of said lead frame; sealing the mount portion of said lead frame, said electronic element mounted thereon, and the inner end portions of the lead elements included in said lead element array with a suitable material; bending outer portions of said lead elements extending from the sealed portion by a press; performing an electrolytic-plating process to coat the bent lead elements of said lead frame with a suitable alloy layer; and trimming the bent and plated lead elements of said lead frame.
Claim 11
Dependent Claim
18 words
A method as set forth in claim 7, wherein said bending step is performed before the mounting step.
Claim 12
Dependent Claim
144 words
A method of producing an electronic component using a lead frame as set forth in claim 2, comprising the step: mounting an electronic element on the mount portion of said lead frame; sealing the mount portion of said lead frame, said electronic element mounted thereon, and the inner end portions of the lead elements of said lead frame with a suitable material; bending outer portions of the lead elements extending from the sealed portion by a press, the shaped portions of said expandable tie bar elements for supporting said lead element array from said outside frame portion being expanded to maintain the connection between the lead element array and said outside frame portion; performing an electrolytic-plating process to coat the bent lead elements of said lead frame with a suitable alloy layer; and trimming the bent and plated lead elements of said lead frame.
Claim 13
Dependent Claim
18 words
A method as set forth in claim 9, wherein said bending step is performed before the mounting step.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.