EP0329317A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device having an insulating sheet
Assignee: Hitachi Ltd
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Filing: 1989-02-06
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Granted: —
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Expires: 2009-02-06
Abstract
Abstract A semiconductor device has an insulating filmy resin sheet (2) stuck on the principal surface of a semiconductor chip (4) formed with circuits. The inner lead portions (15) of a lead frame (14) are arranged on the insulating sheet (2), so that the semiconductor chip having the highest possible density of integration may be received in a standardized package. The inner lead portions (15) lie within a sealing member (6) and are substantially entirely arrayed over the semiconductor chip (4). The fore ends of the inner lead portions (15) and the external terminals of the semiconductor chip (4) are electrically connected on the shorter latus side of the semiconductor chip (4) by pieces of bonding wire (5).
Inventors
- 👤 Toshihiro Yasuhara
- 👤 Masachika Masuda
- 👤 Gen Murakami
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 20:20
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W42/25; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/417; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W74/144; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/381; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
134 words
A semiconductor device comprising: a rectangular semiconductor chip having external terminals on a principal surface thereof; an insulator sheet which is bonded to the principal surface of the semiconductor chip; a plurality of leads which extend on said insulator sheet so as to overlie the principal surface of the semiconductor chip each of the leads including an inner lead part and an outer lead part; pieces of metallic fine wire which electrically connect the external terminals and free ends of the inner lead parts; and a sealing member which encapsulates the semiconductor chip, the insulator sheet, the inner lead parts and the metallic fine wire pieces; the external terminals being located on shorter latus sides of the semiconductor chip, and the free ends of the inner lead parts are located near the external terminals.
Claim 2
Dependent Claim
134 words
A semiconductor device comprising: a rectangular semiconductor chip having external terminals on a principal surface thereof; an insulator sheet which is bonded to the principal surface of the semiconductor chip; a plurality of leads which extend on said insulator sheet so as to overlie the principal surface of the semiconductor chip each of the leads including an inner lead part and an outer lead part; pieces of metallic fine wire which electrically connect the external terminals and free ends of the inner lead parts; and a sealing member which encapsulates the semiconductor chip, the insulator sheet, the inner lead parts and the metallic fine wire pieces; the external terminals being located on shorter latus sides of the semiconductor chip, and the free ends of the inner lead parts are located near the external terminals.
Claim 3
Dependent Claim
17 words
A semiconductor device according to claim 1, wherein the insulator sheet is of a polyimide type resin.
Claim 4
Dependent Claim
18 words
A semiconductor device according to claim 1 or claim 2, wherein the metallic fine wire is gold wire.
Claim 5
Dependent Claim
40 words
A semiconductor device according to any one of the preceding claims, having a first adhesive layer which bonds the semiconductor chip and the insulator sheet, and a second adhesive layer which bonds the insulator sheet and the inner lead portions.
Claim 6
Dependent Claim
26 words
A semiconductor device according to claim 4, wherein the first adhesive layer is of a multiple adhesive layer in which thermosetting polyimide type resins are stacked.
Claim 7
Dependent Claim
19 words
A semiconductor device according to claim 5, wherein the multiple adhesive layer is of polyimide pyromellite and polyketone imide.
Claim 8
Dependent Claim
22 words
A semiconductor device according to any one of claims 4 to 6, wherein the second adhesive layer is of a thermoplastic resin.
Claim 9
Dependent Claim
15 words
A semiconductor device according to claim 7, wherein the thermoplastic resin is polyether amide imide.
References Cited (Backward Citations)
No citation records indexed.
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