EP0324407A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Trimming process by a laser beam
Assignee: Toshiba Corp
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Filing: 1989-01-09
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Granted: —
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Expires: 2009-01-09
Abstract
Abstract A trimming process by a laser beam is disclosed. The trimming process comprises two steps. In a first step, a laser shield layer (12) is formed over an untrimmed region (11a) of a trimmed material (11) adjacent to a trimmed region (11c). The laser shield layer has a higher heat conductivity than the trimmed material and a large reflectivity for laser beam. In a second step, the trimmed material is cut off. To cut off, a laser beam is applied onto the upper surface of the trimmed region (11c) of the trimmed material to vaporize the trimmed material in the trimmed region.
Inventors
- 👤 Kaoru Imamura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 21:07
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/22; H01C17/24; H01C17/242; H10; H10D; H10D1/00; H10D1/40; H10D1/47; H10D1/474; H10P; H10P34/00; H10P34/40; H10P34/42
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
86 words
A trimming process by a laser beam comprising the steps of: forming a laser shield layer (12) over an untrimmed region (11a) of a trimmed material (11) adjacent to a trimmed region (11c), said laser shield layer having a higher heat conductivity than said trimmed material and a large reflectivity for laser beam; and cutting off said trimmed material by applying a laser beam onto the upper surface of said trimmed region (11c) of said trimmed material and vaporizing the trimmed material in said trimmed region.
Claim 2
Dependent Claim
86 words
A trimming process by a laser beam comprising the steps of: forming a laser shield layer (12) over an untrimmed region (11a) of a trimmed material (11) adjacent to a trimmed region (11c), said laser shield layer having a higher heat conductivity than said trimmed material and a large reflectivity for laser beam; and cutting off said trimmed material by applying a laser beam onto the upper surface of said trimmed region (11c) of said trimmed material and vaporizing the trimmed material in said trimmed region.
Claim 3
Dependent Claim
24 words
The trimming process according to claim 1, characterized in that said trimmed material is a resistor layer formed over an electrically insulating layer (10).
Claim 4
Dependent Claim
25 words
The trimming process according to claim 2, characterized in that said laser shield layer is directly mounted on said untrimmed region of said trimmed material.
Claim 5
Dependent Claim
24 words
The trimming process according to claim 2, characterized in that said insulating substrate is 1.2 µ thick and formed on a semiconductor substrate (5).
Claim 6
Dependent Claim
53 words
The trimming process according to claim 1, characterized in that said trimmed material includes a resistor film (11) formed on an electrically insulating layer (10), and an insulating film (25) is formed between said resistor film (11) and said laser shield layer (12), and electrically insulates said films (11, 12) one from another.
Claim 7
Dependent Claim
23 words
The trimming process according to claim 5, characterized in that said said insulating film (25) has a thickness of 1000 Å or less.
Claim 8
Dependent Claim
23 words
The trimming process according to any one of preceding claims, characterized in that said trimmed material is impurity doped polysilicone or nickel-chromium alloy.
Claim 9
Dependent Claim
21 words
The trimming process according to any one of preceding claims, characterized in that said laser shield layer is made of aluminum.
Claim 10
Dependent Claim
96 words
A trimming process by a laser beam comprising the steps of: forming a laser shield layer (12) over an electrical resistor layer (10), said laser shield layer having a higher heat conductivity than said resistor layer and a large reflectivity for laser beams, and further having an opening through which said resistor layer is exposed; electrically separating said resistor layer at said opening by applying a laser spot to said resistor layer through said opening, and vaporizing said resistor layer within said opening, the diameter of said laser spot being larger than that of said opening.
Claim 11
Dependent Claim
96 words
A trimming process by a laser beam comprising the steps of: forming a laser shield layer (12) over an electrical resistor layer (10), said laser shield layer having a higher heat conductivity than said resistor layer and a large reflectivity for laser beams, and further having an opening through which said resistor layer is exposed; electrically separating said resistor layer at said opening by applying a laser spot to said resistor layer through said opening, and vaporizing said resistor layer within said opening, the diameter of said laser spot being larger than that of said opening.
Claim 12
Dependent Claim
35 words
The trimming process according to claim 9, characterized in that the opening of the laser shielding layer (12) is a slot the width of which is slightly smaller than the diameter of the laser spot.
References Cited (Backward Citations)
No citation records indexed.
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