EP0320997A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device having a lead frame
Assignee: Toshiba Corp
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Filing: 1988-12-19
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Granted: —
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Expires: 2008-12-19
Abstract
Abstract A bedless semiconductor device is provided with a plurality of inner leads (1) substantially radially arranged around the pellet mounting area, an insulating sheet (3) arranged on the pellet mounting area of a lead frame so as to adhesively fix inner lead tip portions and a semiconductor pellet (2) mounted on the mounting portion, wherein each tip portion of at least every other inner lead is provided with a broader portion (1a) broader than the width of each of the other inner lead tip portions (1b), the broader portion is positioned closer to the central portion of the lead frame than the other inner lead tip portions, and an opening (1c) or a thin portion (1d) is provided within the broader portion (1a).
Inventors
- 👤 Jun-Ichi Ohno
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 19:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W70/421; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W74/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
120 words
A semiconductor device comprising a plurality of inner leads (1) substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet (3) arranged on said pellet mounting area so as to adhesively fix inner lead tip portions and a semiconductor pellet (2) mounted on said insulating sheet (3), characterized in that each tip portion of at least every other inner lead is provided with a broader portion (1a) which is broader than the width of each of other inner lead tip portions (1b), that said broader portion is positioned closer to the central portion of the lead frame than other inner lead tip portions, and that an opening (1c) is provided within said broader portion (1a).
Claim 2
Dependent Claim
120 words
A semiconductor device comprising a plurality of inner leads (1) substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet (3) arranged on said pellet mounting area so as to adhesively fix inner lead tip portions and a semiconductor pellet (2) mounted on said insulating sheet (3), characterized in that each tip portion of at least every other inner lead is provided with a broader portion (1a) which is broader than the width of each of other inner lead tip portions (1b), that said broader portion is positioned closer to the central portion of the lead frame than other inner lead tip portions, and that an opening (1c) is provided within said broader portion (1a).
Claim 3
Dependent Claim
16 words
A semiconductor device as set forth in claim 1, wherein said insulating sheet consists of polyimide.
Claim 4
Dependent Claim
120 words
A semiconductor device comprising a plurality of inner leads (1) substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet (2) arranged on said pellet mounting area so as to adhesively fix inner lead tip portions and a semiconductor pellet (2) mounted on said mounting portion, characterized in that each tip portion of at least every other inner lead is provided with a broader portion (1a) which is broader than the width of each of other inner lead tip portions (1b), that said broader portion is positioned closer to the central portion of the lead frame than other inner lead tip portions, and that a thin portion (1d) is provided within said broader portion (1a).
Claim 5
Dependent Claim
120 words
A semiconductor device comprising a plurality of inner leads (1) substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet (2) arranged on said pellet mounting area so as to adhesively fix inner lead tip portions and a semiconductor pellet (2) mounted on said mounting portion, characterized in that each tip portion of at least every other inner lead is provided with a broader portion (1a) which is broader than the width of each of other inner lead tip portions (1b), that said broader portion is positioned closer to the central portion of the lead frame than other inner lead tip portions, and that a thin portion (1d) is provided within said broader portion (1a).
Claim 6
Dependent Claim
16 words
A semiconductor device as set forth in claim 3, wherein said insulating sheet consists of polyimide.
References Cited (Backward Citations)
No citation records indexed.
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