EP0317310A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Molded-in lead frames
Assignee: Advanced Interconnections Corp
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Filing: 1988-11-17
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Granted: —
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Expires: 2008-11-17
Abstract
Abstract This invention features lead frames, molded lead frames and adapters (10) and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements (12). The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin (26) through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
Inventors
- 👤 James V. Murphy
- 👤 Michael J. Murphy
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 01:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H05K7/00; H05K7/02; H05K7/10; H05K7/1015; H05K7/1023; H05K7/1053; H05K7/1061; H05K7/1092; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/442; H10W70/479; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/581
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
106 words
A lead frame suitable for use in an adapter or socket for connection of a chip to a board for carrying circuit components, said lead frame comprising, a frame and a circuit, said circuit comprising a plurality of electrical conducting elements, wherein said elements are held in position by said frame, and wherein each said element comprises an area within said element suitable for connecting a pin to said element to electrically connect said element with said board, wherein said lead frame can be molded in insulative material and trimmed to remove said frame to leave each said element electrically separate from each other said element.
Claim 2
Dependent Claim
106 words
A lead frame suitable for use in an adapter or socket for connection of a chip to a board for carrying circuit components, said lead frame comprising, a frame and a circuit, said circuit comprising a plurality of electrical conducting elements, wherein said elements are held in position by said frame, and wherein each said element comprises an area within said element suitable for connecting a pin to said element to electrically connect said element with said board, wherein said lead frame can be molded in insulative material and trimmed to remove said frame to leave each said element electrically separate from each other said element.
Claim 3
Dependent Claim
42 words
A molded lead frame comprising: the lead frame of claim 1 having electrically insulative material molded around said lead frame, and openings in said material and said lead frame suitable for receiving pins to electrically connect each said element with said board.
Claim 4
Dependent Claim
18 words
The molded frame of claim 2 further comprising a pin in a said element of said lead frame.
Claim 5
Dependent Claim
16 words
The molded frame of claim 2 further comprising a capacitor electrically connected between two said elements.
Claim 6
Dependent Claim
11 words
An adapter or socket comprising the lead frame of claim 1.
Claim 7
Dependent Claim
46 words
An element suitable for electrically connecting a chip with a printed circuit board, said element comprising a solder clad region, wherein said chip can be electrically connected with said clad region, and a pin electrically connected to said clad region and to said printed circuit board.
Claim 8
Dependent Claim
46 words
An element suitable for electrically connecting a chip with a printed circuit board, said element comprising a solder clad region, wherein said chip can be electrically connected with said clad region, and a pin electrically connected to said clad region and to said printed circuit board.
Claim 9
Dependent Claim
89 words
A lead frame comprising an electrical conducting element adapted to be mounted between two pins of a socket or adapter, said element having a removable bridge region dividing said element into two electrically separate regions, wherein a capacitor can be mounted between said regions, to electrically connect said regions when said bridge is removed from said lead frame, and wherein each said region comprises an area within said region suitable for positioning a pin through said region to electrically connect said region with a board for carrying circuit components.
Claim 10
Dependent Claim
89 words
A lead frame comprising an electrical conducting element adapted to be mounted between two pins of a socket or adapter, said element having a removable bridge region dividing said element into two electrically separate regions, wherein a capacitor can be mounted between said regions, to electrically connect said regions when said bridge is removed from said lead frame, and wherein each said region comprises an area within said region suitable for positioning a pin through said region to electrically connect said region with a board for carrying circuit components.
Claim 11
Dependent Claim
46 words
A molded lead frame comprising the lead frame of claim 11 having electrically insulative material molded around said lead frame and openings in said material and said lead frame suitable for receiving pins to electrically connect each said region with a board for carrying circuit components.
Claim 12
Dependent Claim
17 words
The molded lead frame of claim 8 further comprising a capacitor electrically connected between said two regions.
Claim 13
Dependent Claim
11 words
An adapter or socket comprising the lead frame of claim 7.
Claim 14
Independent Claim
93 words
A method for producing a molded lead frame, said method comprising the steps of: providing a lead frame having a frame and a circuit comprising a plurality of electrical conducting elements, wherein said elements are held in position by said frame, and wherein each said element comprises an area within said element suitable for positioning a pin through said element to electrically connect said element with a board, and molding electrically insulative material around said lead frame to produce said molded lead frame having an opening positioned over at least one said area.
Claim 15
Independent Claim
93 words
A method for producing a molded lead frame, said method comprising the steps of: providing a lead frame having a frame and a circuit comprising a plurality of electrical conducting elements, wherein said elements are held in position by said frame, and wherein each said element comprises an area within said element suitable for positioning a pin through said element to electrically connect said element with a board, and molding electrically insulative material around said lead frame to produce said molded lead frame having an opening positioned over at least one said area.
Claim 16
Dependent Claim
21 words
The method of claim 11 further comprising the step of pushing a pin through said opening in said molded lead frame.
Claim 17
Dependent Claim
22 words
The method of claim 11 further comprising the step of molding insulating material between each said element prior to said molding step.
Claim 18
Dependent Claim
40 words
The method of claim 11 further comprising the step of placing said lead frame on an insulating film having sprocket openings along each edge for engaging sprockets of a drive wheel in an automated system prior to said molding step.
Claim 19
Dependent Claim
21 words
The method of claim 11, further comprising the step of trimming said lead frame from said circuit after said molding step.
Claim 20
Independent Claim
109 words
A method for producing a molded lead frame, said method comprising the steps of providing a lead frame having an electrical conducting element adapted to be mounted between two pins of a dual inline socket, said element having a removable bridge region to divide said element into two electrically separate regions, wherein a capacitor can be mounted between said regions, and wherein each said region comprises an area within said region suitable for positioning a pin through said region to electrically connect said region with a circuit board; and molding electrically non-conductive material around said lead frame to produce said molded lead frame having an opening over said area.
Claim 21
Independent Claim
109 words
A method for producing a molded lead frame, said method comprising the steps of providing a lead frame having an electrical conducting element adapted to be mounted between two pins of a dual inline socket, said element having a removable bridge region to divide said element into two electrically separate regions, wherein a capacitor can be mounted between said regions, and wherein each said region comprises an area within said region suitable for positioning a pin through said region to electrically connect said region with a circuit board; and molding electrically non-conductive material around said lead frame to produce said molded lead frame having an opening over said area.
Claim 22
Dependent Claim
26 words
The method of claim 16, further comprising the steps of removing said bridge region, and mounting a capacitor between said regions to electrically connect said regions.
Claim 23
Dependent Claim
99 words
A spider device, suitable for aiding in fastening a gull-wing device having connector leads to an adapter, said spider device comprising a plurality of elongated legs attached to an upper surface, said legs extending from said upper surface to a plane below said surface, each said leg touching said plane at a position corresponding to a said connector lead; wherein each said leg can be positioned over a different said connector lead, and wherein said legs are suitable for exerting a downward force on each said connector lead to allow contact of each said connector lead with said adapter.
Claim 24
Dependent Claim
99 words
A spider device, suitable for aiding in fastening a gull-wing device having connector leads to an adapter, said spider device comprising a plurality of elongated legs attached to an upper surface, said legs extending from said upper surface to a plane below said surface, each said leg touching said plane at a position corresponding to a said connector lead; wherein each said leg can be positioned over a different said connector lead, and wherein said legs are suitable for exerting a downward force on each said connector lead to allow contact of each said connector lead with said adapter.
Claim 25
Dependent Claim
16 words
The device of claim 18 wherein the undersurface of each said leg comprises an insulating material.
Claim 26
Dependent Claim
59 words
A method for fastening a gull-wing device having connector leads to a mating footprint of said adapter with the spider device of claim 18, comprising the steps of: positioning said gull-wing device over said footprint, positioning said spider device over said connector leads, and exerting downward pressure on said spider device to fasten said connector leads to said footprint.
Claim 27
Dependent Claim
19 words
The method of claim 20 further comprising providing an insulating material between said connector leads and said spider device.
Claim 28
Dependent Claim
56 words
An adaptor for electrically connecting a plurality of terminals of a circuit chip to a circuit board, comprising; a plurality of lead pins corresponding to each said plurality of terminals for electrically connecting said circuit chip to said circuit board, and an insulated board having at least one hole for accepting each of said lead pins.
Claim 29
Dependent Claim
56 words
An adaptor for electrically connecting a plurality of terminals of a circuit chip to a circuit board, comprising; a plurality of lead pins corresponding to each said plurality of terminals for electrically connecting said circuit chip to said circuit board, and an insulated board having at least one hole for accepting each of said lead pins.
Claim 30
Dependent Claim
35 words
The adaptor of claim 22 wherein one of said plurality of lead pins comprises a solder clad, a pin extending from said solder clad, and means for friction fitting said pin to said insulating board.
Claim 31
Dependent Claim
25 words
The adaptor of claim 23 wherein said lead pin comprises an elbow along said pin for aligning said pin for connection with said circuit board.
Claim 32
Dependent Claim
72 words
The adaptor of claim 22 wherein said lead pin comprises a solder clad having an area having an aperture, a pin connected to said solder clad and extending through said hole in said insulator board, and a contact pin for press fitting into said aperture of said solder clad and a second hole of said insulator board, wherein said contact pin comprises means for receiving a terminal of said plurality of terminals.
Claim 33
Dependent Claim
95 words
An adaptor comprising a plurality of lead frames, wherein each lead frame comprises an area having at least one hole suitably positioned for receiving a pin through each said plurality of lead frames for selectively connecting at least one of said lead frames electrically with said pin, a pin extending from each of said plurality of lead frames for electrically connecting each of said lead frames with a board, and electrically non-conductive material molded around said area of said plurality of lead frames to produce a molded lead frame having an opening over said area.
Claim 34
Dependent Claim
95 words
An adaptor comprising a plurality of lead frames, wherein each lead frame comprises an area having at least one hole suitably positioned for receiving a pin through each said plurality of lead frames for selectively connecting at least one of said lead frames electrically with said pin, a pin extending from each of said plurality of lead frames for electrically connecting each of said lead frames with a board, and electrically non-conductive material molded around said area of said plurality of lead frames to produce a molded lead frame having an opening over said area.
Claim 35
Dependent Claim
23 words
The adaptor of claim 24 wherein said pin comprises a groove for receiving a solder donut for soldering said pin to said board.
Claim 36
Dependent Claim
29 words
A lead pin for electrically connecting a chip to a printed circuit board, said lead pin comprising a solder clad and a pin electrically connected to said solder clad.
Claim 37
Dependent Claim
29 words
A lead pin for electrically connecting a chip to a printed circuit board, said lead pin comprising a solder clad and a pin electrically connected to said solder clad.
Claim 38
Dependent Claim
24 words
The lead pin of claim 28 wherein said lead pin comprises an elbow for aligning said pin for connection with said printed circuit board.
Claim 39
Dependent Claim
31 words
The molded lead frame of claim 2, wherein said elements extend beyond said insulative material and are adpated to be bent at about 90° to allow soldering with a J-lead chip.
References Cited (Backward Citations)
No citation records indexed.
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