Multilayer ceramic package with high frequency connections

Claim 2

A ceramic package including a high frequency connector, said high frequency connector comprising: a signal conductor for providing a connection between a first device and a second device; CHARACTERIZED IN THAT the high frequency connector further comprises ceramic material disposed to surround the signal conductor; a plurality of vias formed through the ceramic material so as to enclose said signal conductor; and grounding means coupled to the plurality of vias to form, in combination with said plurality of vias, a ground plane insulator for said signal conductor.

Claim 3

A ceramic package as defined in claim 1 wherein the grounding means comprises a first layer of conductive material; and a second layer of conductive material disposed in a parallel relationship with the first layer; and the plurality of vias comprises a first set of vias formed through the ceramic material so as to form a first electrical connection between the first conductive layer and the second conductive layer; a second set of vias formed through said ceramic material so as to form a second electrical connection between said first conductive layer and said second conductive layer, the first and second sets of vias disposed in a spaced-­apart relationship such that the signal conductor is contained within the region bounded by said ground means and said plurality of vias and the signal path along said signal conductor is parallel with said first and second conductive layers.

Claim 4

The ceramic package of claim 2 wherein said package comprises a plurality of separate ceramic layers and the signal conductor comprises a strip of conductive material disposed longitudinally along a major surface of one of said plurality of ceramic layers.

Claim 5

The multilayer ceramic package of claim 2 wherein each set of vias is formed in an offset arrangement such that vias through adjacent ceramic layers are shifted to form a rounded profile high frequency interconnection when viewed along the direction of the signal path, the package further comprising electrical connection means disposed between adjacent layers of enclosed ceramic material to provide electrical connection between adjacent pluralities of vias.

Claim 6

The multilayer ceramic package of claim 4 wherein the electrical connection means comprises a plurality of conductive strips, each strip associated in a one-to-one relationship with each via of the plurality of vias.

Claim 7

The multilayer ceramic package of claim 4 wherein the electrical connection means comprises a single strip of conductive material disposed between adjacent layers of enclosed ceramic material so as to provide electrical contact between adjacent vias.

Claim 8

The multilayer ceramic package of claim 1 wherein each via comprises a predetermined diameter d , adjacent vias separated by a distance of 1.5d.

Claim 9

The multilayer ceramic package of claim 1 wherein each via comprises a predetermined diameter d , and adjacent vias are disposed in an overlapped pattern so that the overlapped vias essentially form a single section of conductive material between the top and bottom major surfaces of each ceramic layer.

Claim 10

The ceramic package of claim 2 wherein each set of vias is disposed in a linear arrangement.

Claim 11

The ceramic package of claim 2 wherein each set of vias is disposed in a nonlinear arrangement.

Claim 12

The ceramic package of claim 1 wherein the high frequency connector is formed through a sidewall of said package to provide connection between the first device, located external to said package, and the second device, located internal to said package.

Claim 13

The ceramic package of claim 1 wherein the high frequency connector is wholly contained within said package to provide connection between a first device located within said package to a second device located within said package.

Claim 14

The ceramic package of claim 1 wherein the high frequency connector is formed through the bottom of said package and the signal conductor is disposed perpendicular to the package bottom, the plurality of vias formed parallel to said signal conductor and disposed to surround said signal conductor.

Claim 15

The ceramic package of claim 13 wherein the plurality of vias is disposed in a non-circular pattern around the signal conductor.

Claim 16

The ceramic package of claim 13 wherein the plurality of vias is disposed in a circular pattern around the signal conductor.