EP0308134A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Specular machining apparatus for peripheral edge portion of wafer
Assignee: SpeedFam Co Ltd
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Filing: 1988-09-08
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Granted: —
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Expires: 2008-09-08
Abstract
Abstract There is provided a specular machining apparatus for a peripheral edge portion of a semiconductor wafer comprising a chuck table having a chuck means for holding a wafer whose peripheral edge portion is chamfered and being rotatable for rotating a wafer held by the chuck means around the axis of the wafer, and a polishing member for specular machining of the chamfered edge portion of the wafer held on the chuck table, said polishing member comprising at least one ring having a polishing surface formed on its outer peripheral surface, said ring being rotatable around an axis perpendicular to the axis of the wafer and being movable into and out of polishing contact with the chamfered edge portion of the wafer.
Inventors
- 👤 Seiichi Maeda
- 👤 Isao Nagahashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 21:33
CPC Classifications
B; B24; B24B; B24B9/00; B24B9/02; B24B9/06; B24B9/065
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
118 words
A specular machining apparatus for a peripheral edge portion of a semiconductor wafer comprising: a chuck table having a chuck means for holding a wafer whose peripheral edge portion is chamfered and being rotatable for rotating a wafer held by the chuck means around the axis of the wafer, and a polishing member for specular machining of the chamfered edge portion of the wafer held on the chuck table, said polishing member comprising at least one ring having a polishing surface formed on its outer peripheral surface, said ring being rotatable around an axis perpendicular to the axis of the wafer and being movable into and out of polishing contact with the chamfered edge portion of the wafer.
Claim 2
Dependent Claim
118 words
A specular machining apparatus for a peripheral edge portion of a semiconductor wafer comprising: a chuck table having a chuck means for holding a wafer whose peripheral edge portion is chamfered and being rotatable for rotating a wafer held by the chuck means around the axis of the wafer, and a polishing member for specular machining of the chamfered edge portion of the wafer held on the chuck table, said polishing member comprising at least one ring having a polishing surface formed on its outer peripheral surface, said ring being rotatable around an axis perpendicular to the axis of the wafer and being movable into and out of polishing contact with the chamfered edge portion of the wafer.
Claim 3
Dependent Claim
80 words
A specular machining apparatus as claimed in Claim 1, wherein said polishing member comprises a front polishing ring for polishing a chamfered portion on the front face of the wafer and a rear polishing ring for polishing a chamfered portion on the rear face of the wafer, said polishing rings being arranged so as to be rotatable in mutually opposite directions with their axes displaced vertically with respect to each other and the distance between said axes being freely adjustable.
Claim 4
Dependent Claim
76 words
A specular machining apparatus as claimed in Claim 1 or Claim 2, wherein the diameter of the or each polishing ring is sufficiently large compared with the width of the chamfered portion of the wafer which it is to polish, and the width of the polishing ring is sufficiently small compared with the diameter of the wafer, whereby the polishing ring is adapted to contact the entire width of the chamfered portion over its entire width.
Claim 5
Dependent Claim
67 words
A specular machining apparatus as claimed in any preceding claim, comprising also a polishing drum for giving a specular machining to the peripheral flank of the wafer, said polishing drum being disposed so as to be freely rotatable around an axis parallel to the axis of the wafer and to be freely movable into and out of contact with respect to the peripheral flank of the wafer.
Claim 6
Dependent Claim
30 words
A specular machining apparatus as claimed in Claim 4, comprising means for bringing the polishing ring and the polishing drum, respectively, into contact with the wafer under a constant force.
Claim 7
Dependent Claim
21 words
A specular machining apparatus as claimed in Claim 5, wherein the force setting means comprises the gravitational force of a weight.
Claim 8
Dependent Claim
92 words
A specular machining apparatus as claimed in any preceding claim, comprising also a transporting device for removing a wafer on the chuck table after machining to a takeout position and for bringing an unmachined wafer from a supply position onto the chuck table; a supply means for passing unmachined wafers housed in a carrier to the supply position one-by-one; a takeout means for transporting a machined wafer from the takeout position to a carrier for housing the machined wafer; and a washing device for washing the machined wafer prior to housing it.
Claim 9
Dependent Claim
34 words
A specular machining apparatus as claimed in any preceding claim, wherein the polishing surface of the or each said polishing ring is provided by a polishing cloth adhered around the periphery of the ring.
References Cited (Backward Citations)
No citation records indexed.
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