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EP0302684A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Thin film deposition process

Assignee: BAE Systems Electronics Ltd
•
Filing: 1988-08-01
•
Granted: —
•
Expires: 2008-08-01
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Abstract

Abstract A thin film deposition process comprises the steps of providing a first target area on a magnetron electrode, sputtering particles from said area so that they fall onto a heated substrate body for forming the required deposit, simultaneously operating a sputtering gun such that further particles are dislodged from a second target area and directed towards the substrate, the two resulting particle plasmas mixing at the substrate surface such that a deposit of a predetermined chemical composition is produced. This allows a multicomponent material such as a PLZT ceramic to be deposited without a change in composition due to different volatilities etc. of the components.

Inventors

  • 👤 Christopher John Wort
  • 👤 Lynn Yvette Dorey

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 06:16
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/35; C23C14/352; C23C14/3457

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 82 words
A thin film deposition process, the process comprising the steps of providing a first target area on a magnetron electrode, sputtering particles from said first target area so that they fall onto a heated substrate body for forming the required deposit, simultaneously operating a sputtering gun such that particles are dislodged from a second target area and directed towards the substrate, the two resulting particle plasmas mixing at the substrate surface such that a deposit of a predetermined chemical composition is produced.
Claim 2
Dependent Claim 82 words
A thin film deposition process, the process comprising the steps of providing a first target area on a magnetron electrode, sputtering particles from said first target area so that they fall onto a heated substrate body for forming the required deposit, simultaneously operating a sputtering gun such that particles are dislodged from a second target area and directed towards the substrate, the two resulting particle plasmas mixing at the substrate surface such that a deposit of a predetermined chemical composition is produced.
Claim 3
Dependent Claim 19 words
A process as claimed in Claim 1, in which the said first target is of a ceramic PLZT material.
Claim 4
Dependent Claim 19 words
A process as claimed in Claim 1 or 2, in which the said second target is a metal body.
Claim 5
Dependent Claim 25 words
A process as claimed in Claim 3, in which the said metal body is formed with areas of two metals having a common dividing line.
Claim 6
Dependent Claim 9 words
A thin film deposition process, substantially as hereinbefore described.
Claim 7
Dependent Claim 9 words
A thin film deposition process, substantially as hereinbefore described.
Claim 8
Dependent Claim 21 words
Apparatus for depositing multicomponent materials by a thin film deposition process, substantially as hereinbefore described with reference to the accompanying drawings.
Claim 9
Dependent Claim 21 words
Apparatus for depositing multicomponent materials by a thin film deposition process, substantially as hereinbefore described with reference to the accompanying drawings.

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