EP0298345A2
Expired / Lapsed
EP
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Method for preparing substrates for subsequent electroless metallization
Assignee: International Business Machines Corp
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Filing: 1988-06-28
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Granted: —
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Expires: 2008-06-28
Abstract
Abstract A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer.
Inventors
- 👤 Thomas Carl Clarke
- 👤 Caroline Ann Kovac
- 👤 Dae Young Jung
- 👤 Jae Myung Park
- 👤 Richard Ronald Thomas
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 03:56
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/2006; C23C18/2026; C23C18/2033; C23C16/00; C23C16/04; C23C16/06; C23C16/18; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1607; C23C18/1608; C23C18/1851; C23C18/1862; C23C18/1865; C23C18/1872; C23C18/1886; C23C18/1893; C23C18/2046; C23C18/2073; C23C18/2086; C23C18/28; C23C18/30; C23C18/31; C23C18/32; C23C18/38; C23C18/42; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/14; H05K3/146; H05K3/182; H05K3/184
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
83 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites being capable of decomposing a volatile organometallic compound exposed to said sites to a species of the metal constituent of said compound and, contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient to decompose said compound to said species, said species adhering to the substrate surface.
Claim 2
Independent Claim
83 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites being capable of decomposing a volatile organometallic compound exposed to said sites to a species of the metal constituent of said compound and, contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient to decompose said compound to said species, said species adhering to the substrate surface.
Claim 3
Dependent Claim
22 words
Method according to claim 1 further including the step of transforming said species to said constituent metal adhering to the substrate surface.
Claim 4
Dependent Claim
14 words
Method according to claim 1 or 2 wherein said species is said constituent metal.
Claim 5
Dependent Claim
29 words
Method according to any one of claims 1 to 3 wherein the constituent metal of said organometallic compound is selected from the group consisting of nickel, copper and palladium.
Claim 6
Dependent Claim
27 words
Method according to any one of claims 1 to 4 wherein said active chemical sites are selected from the group consisting of acidic sites and ammonia functionals.
Claim 7
Dependent Claim
42 words
Method according to any one of claims 1 to 5 wherein said organometallic compound is selected from the group consisting of a (cyclopentadienyl) (allyl)palladium(II) compound, a bis(allyl) palladium(II) compound, a nickel carbonyl compound, a diallynickel(II) compound and a (cyclopentadienyl) (triethylphosphine) copper(I) compound.
Claim 8
Dependent Claim
25 words
Method according to any one of claims 1 to 6 wherein said substrate is selected from the group consisting of polymers, epoxies, semiconductors and ceramics.
Claim 9
Dependent Claim
64 words
Method according to any one of claims 1 to 7 wherein said step of contacting a portion of the substrate surface includes the steps of, prior to contacting the substrate surface with the organometallic vapor, covering the substrate with a resist-type material and selectively removing said resist material, where said vapor contacts active chemical sites only in said exposed portion of said substrate surface.
Claim 10
Dependent Claim
31 words
Method according to any one of claims 1 to 8 further including the step of electrolessly depositing a metal onto those areas of the substrate to which said constituent metal adheres.
Claim 11
Dependent Claim
24 words
Method according to claim 9 wherein the electrolessly deposited metal is selected from the group consisting of copper, cobalt, palladium, nickel, silver and gold.
References Cited (Backward Citations)
No citation records indexed.
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