EP0295459A2
Expired / Lapsed
EP
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Electronic assembly and method of making it
Assignee: International Business Machines Corp
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Filing: 1988-05-24
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Granted: —
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Expires: 2008-05-24
Abstract
Abstract An electronic assembly and the method of making it is disclosed. A semiconductor device (10) is back bonded to a first lead frame (14). An adhesive insulative tape (24) is placed on the first lead frame and the device. A second lead frame (28) is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.
Inventors
- 👤 Douglas Wallace Phelps, Jr.
- 👤 Robert James Redmond
- 👤 William Carroll Ward
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 20:02
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
106 words
An electronic assembly comprising: a first lead frame (14) having a number of projecting leads; an electronic device (10) mounted on said first lead frame, said electronic device having a series of peripheral (22) and center contact pads (26), means (18) to establish electric contact between said first lead frame and said peripheral contact pads; an adhesive insulative tape (24) on both said first lead frame and said electronic device; a second lead frame (28) having a number of projecting leads and mounted on said tape, and means (32) to establish electric contact between said center contact pads and the leads of said second lead frame.
Claim 2
Dependent Claim
106 words
An electronic assembly comprising: a first lead frame (14) having a number of projecting leads; an electronic device (10) mounted on said first lead frame, said electronic device having a series of peripheral (22) and center contact pads (26), means (18) to establish electric contact between said first lead frame and said peripheral contact pads; an adhesive insulative tape (24) on both said first lead frame and said electronic device; a second lead frame (28) having a number of projecting leads and mounted on said tape, and means (32) to establish electric contact between said center contact pads and the leads of said second lead frame.
Claim 3
Dependent Claim
25 words
The assembly of claim 1, wherein said first lead frame has a recess (12) and said electronic device is back bond mounted in said recess.
Claim 4
Dependent Claim
21 words
The assembly of claim 2, wherein said leads of said first lead frame and said peripheral contact pads are substantially co-planar.
Claim 5
Dependent Claim
24 words
The assembly of claim 1, wherein said adhesive tape is applied in parallel strips on both said first lead frame and said electronic device.
Claim 6
Dependent Claim
24 words
The assembly of claim 4, wherein strips of adhesive are applied on said electronic device between said center contact pads and said peripheral pads.
Claim 7
Dependent Claim
29 words
The assembly of claim 1, wherein said first and second lead frames further comprise outwardly extending contact leads adapted to contact pads (36, 38) on an external circuit board.
Claim 8
Dependent Claim
27 words
The assembly of claim 6, further comprising a package (34) encapsulating said electronic device and said first and second lead frames excluding said outwardly extending contact leads.
Claim 9
Dependent Claim
18 words
The assembly of claim 1, wherein said leads of said second lead frame extend over said electronic device.
Claim 10
Dependent Claim
23 words
The assembly of claim 1, wherein said adhesive insulative tape comprises a laminated structure having a polyimide center and outer adhesive tape layers.
Claim 11
Dependent Claim
77 words
An electronic assembly comprising: first and second lead frames stacked and separated from each other by an insulative adhesive material; an electronic device (10) mounted on said first lead frame, said electronic device having center and peripheral contact pads, said electronic device further having insulative adhesive tape material applied thereto to separate said second lead frame from said electronic device; and means to establish electric contact between said electronic device and said first and second lead frames.
Claim 12
Dependent Claim
77 words
An electronic assembly comprising: first and second lead frames stacked and separated from each other by an insulative adhesive material; an electronic device (10) mounted on said first lead frame, said electronic device having center and peripheral contact pads, said electronic device further having insulative adhesive tape material applied thereto to separate said second lead frame from said electronic device; and means to establish electric contact between said electronic device and said first and second lead frames.
Claim 13
Independent Claim
87 words
The method of making an electronic assembly according to one or more of claims 1 to 10 comprising the steps of: mounting an electronic device (10) on a first lead frame (14); establishing electrical contact between said first lead frame and said electronic device; affixing an insulative adhesive tape material (24) to portions of said first lead frame and said electronic device; mounting a second lead frame (28) over said first lead frame; and establishing electric contact between said said electronic device and said second lead frame.
Claim 14
Dependent Claim
15 words
The method of claim 11, wherein said insulative adhesive material is applied in parallel strips.
Claim 15
Dependent Claim
23 words
The method of claim 11, further comprising the step of encapsulating said electronic device and portions of said first and second lead frames.
Claim 16
Dependent Claim
25 words
The method of claim 11, further comprising the step of mounting comprises back bonding said electronic device in a recess of said first lead frame.
Claim 17
Dependent Claim
33 words
The method of claim 11, wherein the step of affixing said insulative adhesive tape material occurs prior to the step of establishing electrical contact between said first lead frame and said electronic device.
Claim 18
Dependent Claim
38 words
The method of claim 11, further comprising the steps of applying to said second lead frame said insulative tape adhesive material and said affixing step occurs when said second lead frame is mounted over said first lead frame.
References Cited (Backward Citations)
No citation records indexed.
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