EP0289102A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method and means for bonding of lead wires for an integrated circuit device
Assignee: LSI Corp
•
Filing: 1988-04-28
•
Granted: —
•
Expires: 2008-04-28
Abstract
Abstract Bonding of lead wires (14) between electrical contact points (15) of an integrated circuit and the conductive elements of a flexible tape-like structure (10) on which the integrated circuit (13) is seated is accomplished by means of a vacuum chuck (18) having distributed recesses through which a partial vacuum is applied to the flexible structure. Support elements are provided with the vacuum recesses to ensure that the flexible tape-like structure presents a planar orientation to a bonding tool. The tape-like structure is maintained in a substantially rigid position during the bonding process enabling precision bonding of lead wires.
Inventors
- 👤 Jon Long
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 06:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10P; H10P72/00; H10P72/70; H10P72/78; H10W72/0711; H10W72/07188; H10W72/07531; H10W72/07141; H10W72/07178; H10W72/07521; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T156/00; Y10T156/17; Y10T156/1702; Y10T156/1744; Y10T156/1768; Y10T279/00; Y10T279/11; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49155; Y10T29/49162; Y10T29/49204
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
62 words
Apparatus for bonding lead wires of an integrated circuit device comprising: a flexible tape-like structure; an integrated circuit formed on one surface of a die that is attached to said tape-like structure; and vacuum means for maintaining said tape-like structure in a substantially fixed position during bonding of lead wires to electrical contact points of said integrated circuit and said tape-like structure.
Claim 2
Dependent Claim
62 words
Apparatus for bonding lead wires of an integrated circuit device comprising: a flexible tape-like structure; an integrated circuit formed on one surface of a die that is attached to said tape-like structure; and vacuum means for maintaining said tape-like structure in a substantially fixed position during bonding of lead wires to electrical contact points of said integrated circuit and said tape-like structure.
Claim 3
Dependent Claim
28 words
An apparatus as in Claim 1, including bonding means for joining said lead wires to said contact points whereby said lead wires are bonded precisely at defined locations.
Claim 4
Dependent Claim
33 words
Apparatus as in Claim 1, wherein said vacuum means comprises a vacuum chuck and a plurality of vacuum cavities in one surface of said chuck for holding said tape in a fixed position.
Claim 5
Dependent Claim
28 words
Apparatus as in Claim 3, wherein said vacuum chuck is configured with a central cavity, a supporting shelf encompassing said central cavity, and a channel surrounding said shelf.
Claim 6
Dependent Claim
14 words
Apparatus as in Claim 4, further including support posts disposed within said central cavity.
Claim 7
Dependent Claim
26 words
Apparatus as in Claim 5, wherein the top surface of said support posts, said support shelf and said one surface of said chuck are substantially coplanar.
Claim 8
Dependent Claim
17 words
Apparatus as in Claim 3, including a heater disposed in heat exchange relation with said vacuum chuck.
Claim 9
Dependent Claim
37 words
Apparatus as in Claim 1, wherein said vacuum means comprises a source of vacuum connected to said vacuum chuck, and wherein said vacuum source provides a partial vacuum of about 22 inches mercury during the bonding process.
Claim 10
Dependent Claim
13 words
Apparatus as in Claim 1, including a microprocessor for controlling said bonding means.
Claim 11
Independent Claim
81 words
A method of bonding lead wires of an integrated circuit device supported on a flexible tape-like structure comprising the steps of: positioning said tape-like structure adjacent to a vacuum chuck having a vacuum cavity and vacuum channel and support elements disposed adjacent to said cavity and said channel; applying a partial vacuum to said vacuum chuck for generating a uniform suction force across the surface of said tape-like structure so that said structure is held fixedly in a substantially planar orientation.
Claim 12
Independent Claim
81 words
A method of bonding lead wires of an integrated circuit device supported on a flexible tape-like structure comprising the steps of: positioning said tape-like structure adjacent to a vacuum chuck having a vacuum cavity and vacuum channel and support elements disposed adjacent to said cavity and said channel; applying a partial vacuum to said vacuum chuck for generating a uniform suction force across the surface of said tape-like structure so that said structure is held fixedly in a substantially planar orientation.
Claim 13
Dependent Claim
23 words
A method as in Claim 10, including the step of heating said vacuum chuck for bonding gold wire to said integrated circuit device.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.