EP0287274A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor hybrid device
Assignee: Abaco Systems Ltd
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Filing: 1988-04-07
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Granted: —
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Expires: 2008-04-07
Abstract
Abstract A semiconductor hybrid device comprising a ceramic substrate body 2 in the shape of a plane, which body 2 on a first side carries a thick film resistor arrangement 3 and on a second side supports a TTL logic device together with a capacitor, the device having a first set 7 of connection leads which are located in a plane parallel to the body plane and a second set 8 which are offset from said first set.
Inventors
- 👤 David John Watts
- 👤 Christopher Llewellyn Yates
- 👤 William Barry Mallett
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 07:23
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K3/00; H05K3/36; H05K3/366; H10; H10W; H10W90/00; H05K1/0213; H05K1/0216; H05K1/023; H05K1/0231; H05K1/03; H05K1/0306; H05K1/16; H05K1/167; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/10; H05K2201/10227; H05K2201/10386; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
75 words
A semiconductor hybrid device comprising a non-electrically conductive substrate body in the shape of a plane, which body on a first side carries a thick film resistor arrangement and on a second side supports a TTL logic device together with a capacitor, the device having a first set of connection leads which are located in a plane parallel to the plane of the body and a second set which are offset from said first set.
Claim 2
Dependent Claim
75 words
A semiconductor hybrid device comprising a non-electrically conductive substrate body in the shape of a plane, which body on a first side carries a thick film resistor arrangement and on a second side supports a TTL logic device together with a capacitor, the device having a first set of connection leads which are located in a plane parallel to the plane of the body and a second set which are offset from said first set.
Claim 3
Dependent Claim
23 words
A device as claimed in Claim 1, in which one set of said connection leads lies in the plane of said substrate body.
Claim 4
Dependent Claim
36 words
A device as claimed in Claim 1 or 2, in which the leads are arranged such that the offset leads are positioned alternately with the leads of the other set along one side of the body.
Claim 5
Independent Claim
52 words
A device as claimed in any one of Claims 1 to 3, in which those components which are mounted on the substrate body such that they protrude a significant distance from the substrate surface, are located on the same side of the substrate as that towards which the offset leads are directed.
Claim 6
Independent Claim
34 words
A device as claimed in any one of Claims 1 to 3, in which the resistor arrangement comprises two or more resistors, one end of each resistor being connected to a common output lead.
Claim 7
Independent Claim
31 words
A device as claimed in any one of Claims 1 to 4, in which the substrate body together with the components supported thereon is provided with an electrically insulating surface coating.
Claim 8
Dependent Claim
14 words
A semiconductor hybrid device substantially as hereinbefore described with reference to the accompanying drawing.
Claim 9
Dependent Claim
14 words
A semiconductor hybrid device substantially as hereinbefore described with reference to the accompanying drawing.
Claim 10
Dependent Claim
19 words
A printed circuit board including a semiconductor hybrid device as claimed in any one of Claims 1 to 6.
References Cited (Backward Citations)
No citation records indexed.
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