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EP0284489A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Process for depositing a superconducting thin film

Assignee: Sumitomo Electric Industries Ltd
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Filing: 1988-03-14
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Granted: —
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Expires: 2008-03-14
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Abstract

Abstract This invention relates to a process for producing a superconducting thin film, characterized in that a target made of a compound oxide containing Ba; one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb; and Cu is used for carrying out physical vapor deposition to produce a thin film of perovskite type oxide or quasi-­perovskite type oxide. The target may be made of preliminary sintered material which is obtained by preliminary sintering a power mixture including oxides, carbonates, nitrates or sulfates of Ba; one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb; and Cu, or of finally sintered material which is obtained by final sintering of preliminary sintered material at a temperature raging from 700 to 1,500 °C, preferably from 700 to 1,300 °C. The physical vapor deposition is performed by high-­frequency sputtering technique under Ar and O₂ containing atmosphere, at a partial pressure of Ar ranging from 1.0 x 10⁻³ to 1 x 10⁻¹ Torr, preferably 5.0 x 10⁻³ to 1 x 10⁻¹ Torr and at a partial pressure of O₂ ranging from 0.5 x 10⁻³ to 1 x 10⁻¹ Torr, preferably 1.0 x 10⁻³ to 1 x 10⁻¹ Torr. The obtained thin film may be further heat-treated at a temperature ranging from 250 °C to 1,700 °C, preferably from 250 °C to 1,200 °C.

Inventors

  • 👤 Nobuhiko Fujita
  • 👤 Naoji Fujimori
  • 👤 Hideo Itozaki
  • 👤 Saburo Tanaka
  • 👤 Keizo Harada
  • 👤 Tetsuji Jodai

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-07 18:12
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/3407; C23C14/3414; C04; C04B; C04B35/00; C04B35/01; C04B35/45; C04B35/4504; C23C14/06; C23C14/08; C23C14/087; H; H10; H10N; H10N60/00; H10N60/01; H10N60/0268; H10N60/0296; H10N60/0408; Y; Y10; Y10S; Y10S505/00; Y10S505/80; Y10S505/815; Y10S505/816; Y10S505/818; Y10S505/819

Claims Analysis

Total Claims: 26
Claim 1
Independent Claim 59 words
A process for producing a superconducting thin film, characterized in that a target made of a compound oxide containing Ba; one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb; and Cu is used for carrying out physical vapor deposition to produce a thin film of perovskite type oxide or quasi-perovskite type oxide.
Claim 2
Dependent Claim 59 words
A process for producing a superconducting thin film, characterized in that a target made of a compound oxide containing Ba; one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb; and Cu is used for carrying out physical vapor deposition to produce a thin film of perovskite type oxide or quasi-perovskite type oxide.
Claim 3
Dependent Claim 19 words
A process claimed in Claim 1, characterized in that said target contains perovskite type oxide or quasi-perovskite type oxide.
Claim 4
Dependent Claim 76 words
A process claimed in Claim 1 or 2, characterized in that said target is a preliminary sintered mass which is obtained by sintering a power mixture of an oxide, carbonate, nitrate or sulfate of Ba; an oxide, carbonate, nitrate or sulfate of one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb; and an oxide, carbonate, nitrate or sulfate of Cu, at a temperature raging from 250 to 1,200 °C.
Claim 5
Dependent Claim 100 words
A process claimed in Claim 1 or 2, characterized in that said target is a finally sintered mass which is obtained by final sintering of a preliminary sintered material which is obtained by preliminary sintering a power mixture of an oxide, carbonate, nitrate or sulfate of Ba; an oxide, carbonate, nitrate or sulfate of one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb; and an oxide, carbonate, nitrate or sulfate of Cu, said final sintering being carried out at a temperature raging from 700 to 1,500 °C, preferably from 700 to 1,300 °C.
Claim 6
Dependent Claim 35 words
A process claimed in any one of Claim 1 to 4, characterized in that said target is in a form of sintered powder material obtained from said preliminary sintered mass or said finally sintered mass.
Claim 7
Dependent Claim 34 words
A process claimed in any one of Claim 1 to 4, characterized in that said target is in a form of sintered block obtained from said preliminary sintered mass or said finally sintered mass.
Claim 8
Dependent Claim 24 words
A process claimed in any one of Claim 1 to 6, characterized in that said target is composed of a plurality of target segments.
Claim 9
Dependent Claim 45 words
A process claimed in Claim 7, characterized in that each of said target segments is composed of an oxide of Ba, an oxide of one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb, or an oxide of Cu.
Claim 10
Dependent Claim 54 words
A process claimed in Claim 7, characterized in that said target is composed of two target segments each consisting of (Ba, M)O x and CuO, wherein M stands for one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb and x represents a number of 1 ≦ x.
Claim 11
Dependent Claim 49 words
10 A process claimed in any one of Claim 1 to 9, characterized in that an atom ratio of Ba/(Ba+M) is within a range of from 0.04 to 0.97, wherein M stands for one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb.
Claim 12
Dependent Claim 58 words
A process claimed in any one of Claim 1 to 9, characterized in that an atom ratio of Ba/(Ba+M) is within a range of an atom ratio of Ba/(Ba+M) is within a range of from 0.1 to 0.7, wherein M stands for one element M selected from a group consisting of Y, La, Gd, Ho Er and Yb.
Claim 13
Dependent Claim 57 words
A process claimed in any one of Claim 1 to 11, characterized in that an atom ratio of Ba, M and Cu in said target is adjusted in the function of evaporation rates of Ba, M and Cu on the basis of the atom ratio of Ba, M and Cu in a thin film to be produced.
Claim 14
Dependent Claim 48 words
A process claimed in any one of Claim 1 to 12, characterized in that Ar and O₂ are contained in an atmosphere of vaporization, the partial pressure of Ar ranging from 1.0 x 10⁻³ to 1 x 10⁻¹ Torr, preferably 5.0 x 10⁻³ to 1 x 10⁻¹ Torr.
Claim 15
Dependent Claim 45 words
A process claimed in any one of Claim 1 to 13, characterized in that the O₂ in the atmosphere of vaporization have the partial pressure ranging from 0.5 x 10 ⁻³ to 1 x 10⁻¹ Torr, preferably 1.0 x 10⁻³ to 1 x 10⁻¹ Torr.
Claim 16
Dependent Claim 39 words
A process claimed in any one of Claim 1 to 14, characterized in that said physical vapor deposition is performed by high-frequency sputtering technique, the power of the high-frequency being less than 115 W/cm⁻², preferably less than 15 W/cm⁻².
Claim 17
Dependent Claim 18 words
A process claimed in Claim 15, characterized in that said physical vapor deposition is performed by magnetron sputtering.
Claim 18
Dependent Claim 21 words
A process claimed in any one of Claim 1 to 16, characterized in that the obtained thin film is further heat-­treated.
Claim 19
Dependent Claim 30 words
A process claimed in 17, characterized in that said heat-treatment is carried out at a temperature ranging from 250 °C to 1,700 °C, preferably from 250 °C to 1,200 °C.
Claim 20
Dependent Claim 30 words
A process claimed in 17 or 18, characterized in that said heat-treatment is carried out under a partial pressure of O₂ which is not higher than 0.5 x 10⁻¹ Torr.
Claim 21
Dependent Claim 25 words
A process claimed in any one of Claim 1 to 19, characterized in that a substrate is heated by a heater during the sputtering operation.
Claim 22
Dependent Claim 32 words
A process claimed in 20, characterized in that said substrate is heated at a temperature ranging from 184 °C to 1,520 °C, preferably 184 °C to 1,000 °C during the sputtering operation.
Claim 23
Dependent Claim 35 words
A process claimed in any one of Claim 1 to 21, characterized in that said substarate is made of one of materials selected from a group consisting of glass, quartz, silicon, stainless steel and ceramics.
Claim 24
Dependent Claim 39 words
A process claimed in any one of Claim 1 to 22, characterized in that the distance between said substrate and said target is adjusted at a value of from 3 to 300 mm, preferably from 15 to 300 mm.
Claim 25
Dependent Claim 24 words
A process claimed in any one of Claim 1 to 14, characterized in that said physical vapor deposition is performed by ion plating technique.
Claim 26
Dependent Claim 32 words
A process claimed in any one of Claim 1 to 14, characterized in that said physical vapor deposition is performed by one of vacuum deposition, ion beam deposition or molecular beam deposition.

References Cited (Backward Citations)

US3914389A Cited
US4107163A Cited

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