EP0283306A2
Expired / Lapsed
EP
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Selective thin film etch process
Assignee: Applied Materials Inc
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Filing: 1988-03-18
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Granted: —
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Expires: 2008-03-18
Abstract
Abstract A plasma process using a reactant gas mixture of fluorinated etching gas and oxygen for selectively etching a thin film of material such as silicon nitride with high selectivity for a silicon oxide underlayer and, preferably, for a photoresist overlayer mask.
Inventors
- 👤 John S. Dunfield
- 👤 Bradley J. Taylor
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 09:27
CPC Classifications
C; C23; C23F; C23F4/00; H; H10; H10P; H10P50/00; H10P50/20; H10P50/24; H10P50/242; H10P50/26; H10P50/264; H10P50/266; H10P50/267; H10P50/268; H10P50/28; H10P50/282; H10P50/283; H10P50/69; H10P50/691; H10P50/71; H10P50/73
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
57 words
A process for selectively etching a silicon nitride layer of a body which includes the silicon nitride layer over a silicon oxide underlayer with controlled selectivity for the silicon oxide underlayer, the nitride layer having a photoresist mask formed thereon, comprising: exposing the body to a plasma formed from a gas flow of SiF₄, oxygen and NF₃.
Claim 2
Dependent Claim
57 words
A process for selectively etching a silicon nitride layer of a body which includes the silicon nitride layer over a silicon oxide underlayer with controlled selectivity for the silicon oxide underlayer, the nitride layer having a photoresist mask formed thereon, comprising: exposing the body to a plasma formed from a gas flow of SiF₄, oxygen and NF₃.
Claim 3
Dependent Claim
20 words
The process of Claim 1, the reactant gas flow further comprising a freon-containing gas for increasing the selectivity for photoresist.
Claim 4
Dependent Claim
22 words
The process of Claim 1, the reactant gas flow further comprising an inert gas selected from gases such as argon and helium.
Claim 5
Dependent Claim
23 words
A gas mixture for selectively etching silicon nitride with high selectivity for photoresist and silicon oxide, the mixture comprising SiF₄, oxygen and NF₃.
Claim 6
Dependent Claim
23 words
A gas mixture for selectively etching silicon nitride with high selectivity for photoresist and silicon oxide, the mixture comprising SiF₄, oxygen and NF₃.
Claim 7
Dependent Claim
17 words
The gas mixture of Claim 4, further comprising a freon-containing gas for increasing the selectivity for photoresist.
Claim 8
Dependent Claim
76 words
A process for etching a film with high selectivity relative to an underlying oxide layer or a masking oxide layer, comprising exposing the film to a plasma formed from a mixture of silicon-containing and fluorine-containing etchant-forming gas and an oxygen-containing gas, for etching the film and simultaneously depositing silicon oxide compounds on the underlayer or mask at a selected rate to offset inherent etching of the underlayer or mask by said etchant component of said plasma.
Claim 9
Dependent Claim
76 words
A process for etching a film with high selectivity relative to an underlying oxide layer or a masking oxide layer, comprising exposing the film to a plasma formed from a mixture of silicon-containing and fluorine-containing etchant-forming gas and an oxygen-containing gas, for etching the film and simultaneously depositing silicon oxide compounds on the underlayer or mask at a selected rate to offset inherent etching of the underlayer or mask by said etchant component of said plasma.
Claim 10
Dependent Claim
21 words
The process of Claim 6, wherein the thin film is silicon nitride and the reactant gas flow comprises SiF₄ and oxygen.
Claim 11
Dependent Claim
23 words
The process of Claim 7, the silicon nitride layer having a photoresist mask formed thereon and the reactant gas flow further comprising NF₃.
Claim 12
Dependent Claim
21 words
The process of Claim 7 or 8, the reactant gas flow further comprising an inert gas selected from argon and helium.
Claim 13
Dependent Claim
97 words
A process for selectively etching the silicon nitride layer constituent of a body comprising a layer of silicon nitride over a silicon oxide underlayer in a plasma etching chamber using a photoresist etch mask formed over the silicon nitride, with controlled high selectivity for the silicon oxide underlayer, comprising: positioning the masked body in the etch chamber; communicating into said chamber a reactive gas mixture comprising NF₃, SiF₄, and O₂ and energizing the reactive gas mixture to form a plasma for etching the silicon nitride with a high selectivity for the photoresist and for the oxide underlayer.
Claim 14
Dependent Claim
97 words
A process for selectively etching the silicon nitride layer constituent of a body comprising a layer of silicon nitride over a silicon oxide underlayer in a plasma etching chamber using a photoresist etch mask formed over the silicon nitride, with controlled high selectivity for the silicon oxide underlayer, comprising: positioning the masked body in the etch chamber; communicating into said chamber a reactive gas mixture comprising NF₃, SiF₄, and O₂ and energizing the reactive gas mixture to form a plasma for etching the silicon nitride with a high selectivity for the photoresist and for the oxide underlayer.
Claim 15
Dependent Claim
15 words
The process of Claim 10, further comprising an inert gas selected from argon and helium.
Claim 16
Dependent Claim
19 words
The process of Claim 10 or 11, the reactant gas flow comprising NF₃/SiF₄/O₂/He at flow rate ratios of ≦100/≦100/≦100/≦100.
Claim 17
Dependent Claim
19 words
The process of Claim 10 or 11, the reactant gas flow comprising NF₃/SiF₄/O₂/He at flow rate ratios of ≦50/10-50/10-50/20-50.
Claim 18
Dependent Claim
20 words
The process of Claim 10 or 11, the reactant gas flow comprising NF₃/SiF₄/O₂/He at flow rate ratios of approximately 13/30/15/20.
Claim 19
Dependent Claim
85 words
A plasma process for selectively etching a film selected from silicon and silicon nitride, with high selectivity to a film of silicon dioxide, comprising: exposing the film to a plasma formed from a gas mixture comprising (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; and (3) an oxygenated gas selected from oxygen, CO and CO₂ for etching the film and simultaneously depositing silicon oxide on the oxide layer at a selected rate to offset etching of oxide layer by etchant component of plasma.
Claim 20
Dependent Claim
85 words
A plasma process for selectively etching a film selected from silicon and silicon nitride, with high selectivity to a film of silicon dioxide, comprising: exposing the film to a plasma formed from a gas mixture comprising (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; and (3) an oxygenated gas selected from oxygen, CO and CO₂ for etching the film and simultaneously depositing silicon oxide on the oxide layer at a selected rate to offset etching of oxide layer by etchant component of plasma.
Claim 21
Dependent Claim
19 words
The plasma process of Claim 15, the reactant gas mixture further comprising a gas selected from argon and helium.
Claim 22
Dependent Claim
17 words
The process of Claim 16, wherein the reactant gas mixture further comprising NF₃, SiF₄, oxygen and helium.
Claim 23
Dependent Claim
22 words
The plasma process of Claim 15 or 17, the reactant gas mixture further comprising a freon-containing gas for increasing selectivity for photoresist.
Claim 24
Dependent Claim
36 words
A gas mixture for etching silicon or silicon nitride with high selectivity to silicon dioxide, comprising (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; and (3) oxygenated gas selected from oxygen, CO and CO₂.
Claim 25
Dependent Claim
36 words
A gas mixture for etching silicon or silicon nitride with high selectivity to silicon dioxide, comprising (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; and (3) oxygenated gas selected from oxygen, CO and CO₂.
Claim 26
Dependent Claim
15 words
The gas mixture of Claim 19, further comprising (4) gas selected from argon and helium.
Claim 27
Dependent Claim
14 words
The gas mixture of Claim 19, the mixture comprising NF₃, SiF₄, oxygen and helium.
Claim 28
Dependent Claim
19 words
The gas mixture of Claim 19 or 20, further comprising (5) a freon-containing gas for increasing selectivity to photoresist.
Claim 29
Dependent Claim
56 words
A plasma for selectively etching a film selected from tungsten-containing films and polysilicon film with high selectivity to silicon oxide, comprising: exposing the film to a plasma formed from a gas flow comprising (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; (3) oxygenated gas selected from oxygen, CO and CO₂; and (4) freon-containing gas.
Claim 30
Dependent Claim
56 words
A plasma for selectively etching a film selected from tungsten-containing films and polysilicon film with high selectivity to silicon oxide, comprising: exposing the film to a plasma formed from a gas flow comprising (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; (3) oxygenated gas selected from oxygen, CO and CO₂; and (4) freon-containing gas.
Claim 31
Dependent Claim
41 words
A gas mixture for selectively etching tungsten-containing layers and polysilicon-containing layers with high selectivity to silicon oxide, comprising: (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; (3) oxygenated gas selected from oxygen, CO and CO₂; and (4) freon-containing gas.
Claim 32
Dependent Claim
41 words
A gas mixture for selectively etching tungsten-containing layers and polysilicon-containing layers with high selectivity to silicon oxide, comprising: (1) SiF₄; (2) fluorinated gas selected from NF₃ and SF₆; (3) oxygenated gas selected from oxygen, CO and CO₂; and (4) freon-containing gas.
Claim 33
Dependent Claim
16 words
The gas mixture of Claim 24, the mixture comprising NF₃, SiF₄, oxygen and a freon-containing gas.
Claim 34
Dependent Claim
83 words
A process for selectively etching in a reactor chamber the silicon nitride layer constituent of a body comprising a layer of silicon nitride and a layer of silicon oxide, comprising: generating in the reactor a plasma formed from a gas flow of oxygen and SiF₄ where the oxygen flow rate is at least 15 percent of the SiF₄ flow rate for etching the silicon nitride and simultaneously depositing silicon oxide on the silicon oxide layer to suppress etching of the silicon oxide layer.
Claim 35
Dependent Claim
83 words
A process for selectively etching in a reactor chamber the silicon nitride layer constituent of a body comprising a layer of silicon nitride and a layer of silicon oxide, comprising: generating in the reactor a plasma formed from a gas flow of oxygen and SiF₄ where the oxygen flow rate is at least 15 percent of the SiF₄ flow rate for etching the silicon nitride and simultaneously depositing silicon oxide on the silicon oxide layer to suppress etching of the silicon oxide layer.
Claim 36
Dependent Claim
15 words
The process of Claim 26, wherein the O₂/SiF₄ flow rate ratio is approximately 50 percent.
Claim 37
Dependent Claim
23 words
The process of Claim 26 or 27, wherein the flow rate ratio O₂/SiF₄ is greater than about 1/1 for effecting net oxide deposition.
Claim 38
Dependent Claim
24 words
The process of Claim 25 or 26, wherein the gas further comprises NF₃ for increasing the etch selectivity of the nitride to the oxide.
Claim 39
Dependent Claim
40 words
The process of Claim 25 or 26, wherein the nitride layer is masked with photoresist and the gas flow further comprises NF₃ for increasing the etch selectivity of the silicon nitride with respect to the photoresist and to the oxide.
References Cited (Backward Citations)
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