EP0281404A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Cooling system for electronic equipment
Assignee: NEC Corp
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Filing: 1988-03-03
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Granted: —
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Expires: 2008-03-03
Abstract
Abstract A cooling system for electronic equipment includes a cooling pipe (50) through which a coolant flows, a heat dissipation plate (36) connected to the cooling pipe, a sheet (35) which has a high heat conductivity and is in surface contact with the heat dissipation plate, and a plurality of IC elements (33) mounted on the sheet (35) having a high heat conductivity.
Inventors
- 👤 Youichi C/O Nec Corporation Matsuo
- 👤 Tsukasa C/O Nec Corporation Mizuno
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 15:04
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20218; H05K7/20254
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
60 words
A cooling system for electronic equipment, comprising: a cooling pipe through which a coolant flows; a heat dissipation plate connected to said cooling pipe; a plate brought into surface contact with said heat dissipation plate and having a high heat conductivity; and a plurality of IC elements mounted so as to contact with said plate having the high thermal conductivity.
Claim 2
Dependent Claim
60 words
A cooling system for electronic equipment, comprising: a cooling pipe through which a coolant flows; a heat dissipation plate connected to said cooling pipe; a plate brought into surface contact with said heat dissipation plate and having a high heat conductivity; and a plurality of IC elements mounted so as to contact with said plate having the high thermal conductivity.
Claim 3
Dependent Claim
20 words
A system according to claim 1, wherein said heat dissipation plate is supported upright by at least two cooling pipes.
Claim 4
Dependent Claim
21 words
A system according to claim 1, wherein said heat dissipation plate is supported having an end fixed to said cooling pipe.
Claim 5
Dependent Claim
91 words
A cooling system for IC elements, comprising: at least two cooling pipes mounted on a circuit board and spaced apart from each other at a predetermined interval; a cooling plate supported by said at least two cooling pipes and extending upright on said circuit board; a semiconductor module mounted arranged near said cooling plate between said cooling pipes and having a large number of IC elements; and a heat dissipation sheet interposed between said semiconductor module and said cooling plate to be in tight contact with part of said semiconductor module.
Claim 6
Dependent Claim
91 words
A cooling system for IC elements, comprising: at least two cooling pipes mounted on a circuit board and spaced apart from each other at a predetermined interval; a cooling plate supported by said at least two cooling pipes and extending upright on said circuit board; a semiconductor module mounted arranged near said cooling plate between said cooling pipes and having a large number of IC elements; and a heat dissipation sheet interposed between said semiconductor module and said cooling plate to be in tight contact with part of said semiconductor module.
Claim 7
Dependent Claim
66 words
A cooling system for IC elements, comprising an SIP assembly including the IC elements on one surface thereof and mounted on a printed circuit board, and a heat dissipation plate, connected to a liquid cooling section, for cooling said SIP assembly, wherein said one surface of said SIP assembly is in tight contact with said heat dissipation plate through a member having a high heat conductivity.
Claim 8
Dependent Claim
66 words
A cooling system for IC elements, comprising an SIP assembly including the IC elements on one surface thereof and mounted on a printed circuit board, and a heat dissipation plate, connected to a liquid cooling section, for cooling said SIP assembly, wherein said one surface of said SIP assembly is in tight contact with said heat dissipation plate through a member having a high heat conductivity.
References Cited (Backward Citations)
No citation records indexed.
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