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EP0280883A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Nonvolatile semiconductor memory

Assignee: Toshiba Corp
•
Filing: 1988-01-29
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Granted: —
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Expires: 2008-01-29
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Abstract

Abstract In a nonvolatile semiconductor memory according to the invention, a power source voltage of 5 V used in a ordinary read mode is applied to a read line (RL) in the data read mode without changing its value. If a write line (WL), a selection gate line (SG), a control gate line (CG), and a read line (RL) are respectively set at 0 V, 5 V, 0 V, and 5 V in the data read mode, the poten­tial at an n-type diffusion layer (12) becomes 0 V. In this case, the potential at the control gate line (CG) is 0 V, and the potential at a floating gate electrode (16) becomes substantially 0 V. That is, an electric field is not applied to a thin insulating film (17) located between the floating gate electrode (16) and the n-type diffusion layer (12). As a result, electron injection and discharge due to the tunnel effect do not occur.

Inventors

  • 👤 Tadashi C/O Patent Division Maruyama
  • 👤 Yukio C/O Patent Division Wada
  • 👤 Yasoji C/O Patent Division Suzuki
  • 👤 Tomohisa C/O Patent Division Shigematsu
  • 👤 Makoto C/O Patent Division Yoshizawa

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 21:22
CPC Classifications
G; G11; G11C; G11C17/00; G11C16/00; G11C16/02; G11C16/06; G11C16/26; G11C16/04; G11C16/0408; G11C16/0433; G11C16/10

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 256 words
A nonvolatile semiconductor memory, in which part of a floating gate electrode overlaps a diffusion layer through a thin insulting film, characterized by comprising: a substrate (10) of a first conductivity type; first, second, and third diffusion layer (11, 12, 13) of a second conductivity type formed in said substrate (10); a first channel region (14) in that portion of said substrate (10)s which extends between said first and second diffusion layers (11, 12); a second channel region (20) formed in that portion of said substrate (10) which extends between said second and third diffusion layers (12, 13); said floating gate electrode (16) formed above said first channel region (14), part of said floating gate electrode (16) being formed on said thin insulating film (17) formed on said second diffusion layer (12); a control gate electrode (19) formed above said floating gate electrode (16); a gate electrode (22) formed above said second channel region (20); a control gate line (CG) for applying predetermined voltages to said control gate electrode (19) in data erase, data write, and data read modes, respectively; a selection gate line (SG) for applying predeter­mined voltages to said gate electrode (22) in the data erase, data write, and data read modes, respectively; a write line (WL) for applying predetermined volt­ages to said third diffusion layer (13) in the data erase, data write, and data read modes, respectively; and a read line (RL) for applying predetermined volt­ages to said first diffusion layer (11) in the data erase, data write, and data read modes, respectively.
Claim 2
Dependent Claim 256 words
A nonvolatile semiconductor memory, in which part of a floating gate electrode overlaps a diffusion layer through a thin insulting film, characterized by comprising: a substrate (10) of a first conductivity type; first, second, and third diffusion layer (11, 12, 13) of a second conductivity type formed in said substrate (10); a first channel region (14) in that portion of said substrate (10)s which extends between said first and second diffusion layers (11, 12); a second channel region (20) formed in that portion of said substrate (10) which extends between said second and third diffusion layers (12, 13); said floating gate electrode (16) formed above said first channel region (14), part of said floating gate electrode (16) being formed on said thin insulating film (17) formed on said second diffusion layer (12); a control gate electrode (19) formed above said floating gate electrode (16); a gate electrode (22) formed above said second channel region (20); a control gate line (CG) for applying predetermined voltages to said control gate electrode (19) in data erase, data write, and data read modes, respectively; a selection gate line (SG) for applying predeter­mined voltages to said gate electrode (22) in the data erase, data write, and data read modes, respectively; a write line (WL) for applying predetermined volt­ages to said third diffusion layer (13) in the data erase, data write, and data read modes, respectively; and a read line (RL) for applying predetermined volt­ages to said first diffusion layer (11) in the data erase, data write, and data read modes, respectively.
Claim 3
Dependent Claim 180 words
A memory according to claim 1, characterized in that said control gate line (CG) applies a first voltage to said control gate electrode (19) in the data erase mode, and applies a second voltage lower than the first voltage to said control gate electrode (19) in the data write and data read modes, said selection gate line (SG) applies the first voltage to said gate electrode (22) in the data erase and data write modes, and applies a third voltage, which is lower than the first voltage and higher than the second voltage, to said gate electrode (22) in the data read mode, said write line (WL) applies the second voltage to said third diffusion layer (13) in the data erase and data read modes, and applies the first voltage to said third diffusion layer (13) in the data write mode, and said read line (RL) applies the second voltage to said first diffusion layer (11) in the data erase mode, and applies the third voltage to said first diffusion layer (11) in the data write and data read modes.
Claim 4
Dependent Claim 40 words
A memory according to claim 1, characterized in that said read line (RL) is connected to a power source via a load circuit (33, 34), and a signal from said read line (RL) is supplied to a sense amplifier (36).
Claim 5
Dependent Claim 22 words
A memory according to claim 3, characterized in that said load circuit comprises a MOS transistor (33) which is normally rendered conductive.
Claim 6
Dependent Claim 28 words
A memory according to claim 3, characterized in that said load circuit comprises a MOS transistor (33) which is temporarily rendered conductive in accordance with a clock signal.
Claim 7
Dependent Claim 30 words
A memory according to claim 5, characterized in that the voltage on said selection gate line (SG) is applied to said gate electrode (22) in synchronism with the clock signal.
Claim 8
Dependent Claim 16 words
A memory according to claim 3, characterized in that said sense amplifier includes an inverter (36).

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