EP0280295A2
Expired / Lapsed
EP
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A heat-resistant photosensitive resin composition
Assignee: Tokyo Ohka Kogyo Co Ltd
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Filing: 1988-02-25
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Granted: —
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Expires: 2008-02-25
Abstract
Abstract The photosensitive resin composition comprises (a) a ternary copolymer of an ethylenically unsaturated amide, carboxyl-containing monomer and third monomer, (b) an esterified resin by the reaction of an unsaturated carboxylic acid and a novolac-type epoxy resin, (c) a photopolymerizable monomer, (d) a photopolymerization initiator and (e) a powder such as a finely divided silica filler. The resist layer formed from the composition is capable of being developed with an alkaline aqueous solution and has excellent heat resistance in addition to other desirable properties when the patterned resist layer by the pattern-wise exposure to ultraviolet light and development is subjected to a heat treatment to effect thermal curing.
Inventors
- 👤 Kenji Tazawa
- 👤 Akira Iwata
- 👤 Tomoki Horigome
- 👤 Hioryuki Touda
- 👤 Toshimi 45-402 Komayose-Danchi Aoyama
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:28
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
159 words
A heat-resistant photosensitive resin composition which comprises: (a) a copolymer obtained by the copolymerization of a monomer mixture comprising from 10 to 30% by weight of an unsaturated amide compound represented by the general formula CH₂=CX-CO-NH-Y-OZ, in which X is a hydrogen atom or a methyl group, Y is an alkylene group having 1 to 4 carbon atoms and Z is an alkyl group having 1 to 4 carbon atoms or a benzyl group as a first essential monomer, and from 10 to 30% by weight of an ethylenically unsaturated compound having at least one carboxyl group in a molecule as a second essential monomer; (b) an esterified resin which is a reaction product of a novolac-type epoxy resin and an ethylenically unsaturated carboxylic acid in an amount of 0.8 to 1.1 equivalents relative to the epoxy groups in the novolac-type epoxy resin; (c) a photopolymerizable monomer; (d) a photopolymerization initiator; and (e) a solid powder as a filler.
Claim 2
Dependent Claim
159 words
A heat-resistant photosensitive resin composition which comprises: (a) a copolymer obtained by the copolymerization of a monomer mixture comprising from 10 to 30% by weight of an unsaturated amide compound represented by the general formula CH₂=CX-CO-NH-Y-OZ, in which X is a hydrogen atom or a methyl group, Y is an alkylene group having 1 to 4 carbon atoms and Z is an alkyl group having 1 to 4 carbon atoms or a benzyl group as a first essential monomer, and from 10 to 30% by weight of an ethylenically unsaturated compound having at least one carboxyl group in a molecule as a second essential monomer; (b) an esterified resin which is a reaction product of a novolac-type epoxy resin and an ethylenically unsaturated carboxylic acid in an amount of 0.8 to 1.1 equivalents relative to the epoxy groups in the novolac-type epoxy resin; (c) a photopolymerizable monomer; (d) a photopolymerization initiator; and (e) a solid powder as a filler.
Claim 3
Dependent Claim
58 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the first monomer for the component (a) is selected from the group consisting of N-methoxymethyl acrylamide, N-methoxymethyl methacrylamide, N-ethoxymethyl acrylamide, N-ethoxymethyl methacrylamide, N-propoxymethyl acrylamide, N-propoxymethyl methacrylamide, N-n-butoxymethyl acrylamide, N-n-butoxymethyl methacrylamide, N-isobutoxymethyl acrylamide, N-isobutoxymethyl methacrylamide, N-benzyloxymethyl acrylamide, N-benzyloxymethyl methacrylamide, N-n-butoxyethyl acrylamide, N-n-butoxyethyl methacrylamide, N-isobutoxyethyl acrylamide and N-isobutoxyethyl methacrylamide.
Claim 4
Dependent Claim
24 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the second monomer for the component (a) is acrylic acid or methacrylic acid.
Claim 5
Dependent Claim
42 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the ethylenically unsaturated carboxylic acid for the component (b) is selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid, monomethyl maleate, monopropyl maleate, monobutyl maleate and sorbic acid.
Claim 6
Dependent Claim
73 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the photopolymerizable monomer as the component (c) is selected from the group consisting of methyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 1,6-hexanediol diacrylate, trimethylol propane triacrylate, trimethylol propane trimethacrylate, trimethylol propane diacrylate, trimethylol propane dimethacrylate, tetramethylol propane tetraacrylate, tetramethylol propane tetramethacrylate, pentaerithritol triacrylate, pentaerithritol trimethacrylate, dipentaerithritol pentaacrylate, dipentaerithritol pentamethacrylate, 1,1,1-tri(acryloxypropoxypropoxymethyl) propane, melamine acrylates and carboxyl-containing esterified resins.
Claim 7
Dependent Claim
44 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the amount of the esterified resin as the component (b) is in the range from 20 to 200 parts by weight per 100 parts by weight of the copolymer as the component (a).
Claim 8
Dependent Claim
44 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the amount of the photopolymerizable monomer as the component (c) is in the range from 25 to 200 parts by weight per 100 parts by weight of the copolymer as the component (a).
Claim 9
Dependent Claim
54 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the photopolymerization initiator as the component (d) is selected from the group consisting of benzophenone, 4,4ʹ-dimethylamino benzophenone, 4,4ʹ-diethylamino benzophenone, 2-ethyl anthraquinone, tert-butyl anthraquinone, benzoin ethyl ether, benzoin propyl ether, 2,2-dimethoxy-2-phenyl acetophenone, 2,2-diethoxy acetophenone, 2-chloro thioxanthone, diethyl thioxanthone, 2-hydroxy-2-methyl propiophenone, 4ʹ-isopropyl-2-hydroxy-2-methyl propiophenone and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone.
Claim 10
Dependent Claim
58 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the amount of the photopolymerization initiator as the component (d) is in the range from 0.1 to 20% by weight based on the total amount of the copolymer as the component (a), the esterified resin as the component (b) and the photopolymerizable monomer as the component (c).
Claim 11
Dependent Claim
48 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the solid powder as the component (e) is selected from the group consisting of finely divided silica filler, mica flakes, talc, aluminum oxide, aluminum hydroxide, antimony oxide, spherical benzoguanidine resin, powdery polyimide resin and powdery polyamide resin.
Claim 12
Dependent Claim
58 words
The heat-resistant photosensitive resin composition as claimed in claim 1 wherein the amount of the solid powder as the component (e) is in the range from 1 to 70% by weight based on the total amount of the copolymer as the component (a), the esterified resin as the component (b) and the photopolymerizable monomer as the component (c).
Claim 13
Dependent Claim
53 words
The heat-resistant photosensitive resin composition as claimed in claim 1 which further comprises a solvent selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, dipropylene glycol monomethyl ether, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone.
References Cited (Backward Citations)
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