EP0278741A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic component parts and method for manufacturing the same
Assignee: Toshiba Corp
•
Filing: 1988-02-10
•
Granted: —
•
Expires: 2008-02-10
Abstract
Abstract The present invention provides an electronic component part (9) with terminal pins (4) very closely and very strongly bonded to a high thermal conductivity ceramics circuit board (1) and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins (4) bonded to a high thermal conductivity ceramics circuit board (1). According to the present invention, an electronic component part (9) is provided in which terminal pins (4) are bonded to a high thermal conductivity ceramics circuit board (1) by a brazing metal, containing at least one kind of Group IVa elements. In another aspect of the present invention a method is provided for manufacturing electronic component parts (9), which comprises the step of attaching terminal pins (4) to a high thermal conductivity ceramics circuit board (1) by a brazing paste layer (3) comprised of brazing metal powder containing at least one kind of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group and organic solvent, and heating the resultant structure in an atmosphere containing nitrogen as a principal element so that terminal pins are firmly bonded to a circuit board.
Inventors
- 👤 Kiyoshi C/O Patent Division Iyogi
- 👤 Takaaki C/O Patent Division Yasumoto
- 👤 Toshirou C/O Patent Division Yanazawa
- 👤 Nobuo§c/o Patent Division Iwage
- 👤 Masako C/O Patent Division Nakahashi
- 👤 Hiromitsu C/O Patent Division Takeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 21:28
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/099; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
42 words
An electronic component part comprising a high thermal conductivity ceramics circuit board (1) and terminal pins (4), characterized in that said board and pins are bonded by a metal brazing material (3) having at least one kind selected from Group IVa elements.
Claim 2
Dependent Claim
42 words
An electronic component part comprising a high thermal conductivity ceramics circuit board (1) and terminal pins (4), characterized in that said board and pins are bonded by a metal brazing material (3) having at least one kind selected from Group IVa elements.
Claim 3
Dependent Claim
30 words
The electronic component part according to claim 1, characterized in that said thermal conductivity ceramics circuit board (1) includes an insulating layer (5) comprised of an aluminum nitride sintered body.
Claim 4
Dependent Claim
34 words
The electronic component part according to claim 1, characterized in that said circuit board (32) has a recess (35) at a location at which a corresponding one of said terminal pins (36) is bonded.
Claim 5
Dependent Claim
42 words
The electronic component part according to claim 1, characterized in that said metal brazing material (3) is comprised of an alloy containing Ag and/or Cu as a principal element and 2 to 15 % by weight of Ti, Zr or their combination.
Claim 6
Dependent Claim
38 words
The electronic component part according to claim 1, characterized in that said brazing material (3) is comprised of Ag and/or Cu as a principal element and 2 to 10 % by weight of Ti, Zr or their combination.
Claim 7
Dependent Claim
34 words
The electronic component part according to claim 1, characterized in that said brazing material (3) is comprised of Ag as a principal element and 2 to 10 % by weight of Ti or Zr.
Claim 8
Dependent Claim
20 words
The electronic component part according to claim 1, characterized in that said electronic component (9) part is a ceramics package.
Claim 9
Dependent Claim
22 words
The electronic component part according to claim 1, characterized in that said electronic component (9) part is a pin grid array package.
Claim 10
Independent Claim
72 words
A method for manufacturing an electronic component part, comprising the step of attaching terminal pins (4) to a high thermal conductivity ceramics circuit board (1) by a brazing paste layer (3) consisting of metal brazing powder containing at least one of Group IVa elements, acrylic binder with a carboxyl group as a substituent group, and organic solvent; and heating a resultant structure to bond the pins (4) to said circuit board (1).
Claim 11
Independent Claim
72 words
A method for manufacturing an electronic component part, comprising the step of attaching terminal pins (4) to a high thermal conductivity ceramics circuit board (1) by a brazing paste layer (3) consisting of metal brazing powder containing at least one of Group IVa elements, acrylic binder with a carboxyl group as a substituent group, and organic solvent; and heating a resultant structure to bond the pins (4) to said circuit board (1).
Claim 12
Dependent Claim
24 words
The method according to claim 9, characterized in that said circuit board (1) includes an insulating layer (5) comprised of an aluminum sintered body.
Claim 13
Dependent Claim
31 words
The method according to claim 9, characterized in that said circuit board (31) includes a recess (35) at its location where a corresponding one of said terminal pins (36) is bonded.
Claim 14
Dependent Claim
24 words
The method according to claim 11, characterized in that said recess (35) is formed at a step of forming a green sheet of ceramics.
Claim 15
Dependent Claim
20 words
The method according to claim 9, characterized in that said Group IVa elements are Ti, Zr or a combination thereof.
Claim 16
Dependent Claim
19 words
The method according to claim 9, characterized in that said metal brazing powder consists principally of Ag and/or Cu.
Claim 17
Dependent Claim
19 words
The method according to claim 9, characterized in that said carboxylic group is 1 to 5 % by weight.
Claim 18
Dependent Claim
20 words
The method according to claim 9, characterized in that said acrylic binder has a molecular weight of 5000 to 15000.
Claim 19
Dependent Claim
19 words
The method according to claim 9, characterized in that said heating is performed substantially in a nitrogen gas atmosphere.
Claim 20
Dependent Claim
19 words
The method according to claim 9, characterized in that said atmosphere contains an impurity oxygen of below 20 ppm.
Claim 21
Dependent Claim
18 words
The method according to claim 9, characterized in that said electronic component part (9) is a ceramics package.
Claim 22
Dependent Claim
20 words
The method according to claim 9, characterized in that said electronic component part (9) is a pin grid array package.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.