EP0273392A2
Expired / Lapsed
EP
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Multi-layer structure and method of fabrication thereof
Assignee: International Business Machines Corp
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Filing: 1987-12-23
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Granted: —
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Expires: 2007-12-23
Abstract
Abstract A multi-layer structure that includes a transparent dielectric substrate, a layer of a nickel-containing steel alloy, and a layer of copper and/or chromium. The structure is used as multi-density photomasks for example. The process for fabricating multi-layer structure, like a multi-density photomask comprises: a) providing a transparent dielectric substrate having a steel layer and a layer of a metal, like of copper, thereon with the layer of said steel is deposited on top of said layer of a metal or vice versa; b) providing a layer of photoresist material on top of the structure provided in step (a); c) exposing and developing said layer of photoresist material; d) selectively etching exposed portion of said metal or said steel; e) selectively etching exposed portion of said metal or said steel not etched in step (d); f) exposing and developing photoresist on the said layer of said metal or said steel etched in step (d); g) selectively etching exposed portion of said metal or said steel of step (f); and h) removing the photoresist.
Inventors
- 👤 Donis George Flagello
- 👤 Jane Margaret Shaw
- 👤 David Frank Witman
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 17:48
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/54; G03F1/50; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12597; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/12847; Y10T428/12854; Y10T428/12861; Y10T428/12903; Y10T428/1291; Y10T428/12917; Y10T428/12924; Y10T428/12944
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
43 words
A multi-layer structure comprising a transparent dielectric substrate, preferably of glass or quartz, having a minimum transmittance of about 90%; a layer of a nickel-containing steel alloy; and a layer of a metal selected from the group of Cu, chromium, and mixtures thereof.
Claim 2
Dependent Claim
43 words
A multi-layer structure comprising a transparent dielectric substrate, preferably of glass or quartz, having a minimum transmittance of about 90%; a layer of a nickel-containing steel alloy; and a layer of a metal selected from the group of Cu, chromium, and mixtures thereof.
Claim 3
Dependent Claim
38 words
The multi-layer structure of claim 1 wherein each layer of nickel-containing steel alloy and layer of copper and/or chromium is provided in a predetermined pattern less than the entire area of the substrate to provide a multi-density photomask.
Claim 4
Dependent Claim
55 words
The structure of claim 1 or 2 wherein said layer of a nickel-containing steel alloy and said layer of a metal selected from the group of Cu, chromium, and mixtures thereof are located on top of said dielectric substrate with said layer of metal being provided on top of said steel layer or vice versa.
Claim 5
Dependent Claim
22 words
The structure according to any one of claims 1 to 3 wherein said steel alloy contains at least about 45% of Ni.
Claim 6
Dependent Claim
27 words
The structure according to any one of claims 1 to 4 wherein said steel further contains at least about 10% chromium, and preferably is an Inconel steel.
Claim 7
Dependent Claim
173 words
A process for fabricating multi-layer structure, like a multi-density photomask, which comprises: a) providing a transparent dielectric substrate preferably of glass or quartz, having a minimum transmittance of about 90% having a layer of a nickel-containing steel alloy and a layer of a metal, selected from the group of copper, chromium and mixtures thereof, thereon with the layer of said steel alloy is deposited on top of said layer of a metal or vice versa; b) providing a layer of photoresist material on top of the structure provided in step (a); c) exposing and developing said layer of photoresist material; d) selectively etching exposed portion of said metal or said nickel-containing steel alloy; e) selectively etching exposed portion of said metal or said nickel-containing steel alloy not etched in step (d); f) exposing and developing photoresist on the said layer of said metal or said nickel-containing steel alloy etched in step (d); g) selectively etching exposed portion of said metal or said nickel-containing steel alloy of step (f); and h) removing the photoresist.
Claim 8
Dependent Claim
173 words
A process for fabricating multi-layer structure, like a multi-density photomask, which comprises: a) providing a transparent dielectric substrate preferably of glass or quartz, having a minimum transmittance of about 90% having a layer of a nickel-containing steel alloy and a layer of a metal, selected from the group of copper, chromium and mixtures thereof, thereon with the layer of said steel alloy is deposited on top of said layer of a metal or vice versa; b) providing a layer of photoresist material on top of the structure provided in step (a); c) exposing and developing said layer of photoresist material; d) selectively etching exposed portion of said metal or said nickel-containing steel alloy; e) selectively etching exposed portion of said metal or said nickel-containing steel alloy not etched in step (d); f) exposing and developing photoresist on the said layer of said metal or said nickel-containing steel alloy etched in step (d); g) selectively etching exposed portion of said metal or said nickel-containing steel alloy of step (f); and h) removing the photoresist.
Claim 9
Dependent Claim
29 words
The process of claim 6 wherein the material etched in steps (d) and (g) is said metal and the material etched in step (e) is the nickel-containing steel alloy.
Claim 10
Dependent Claim
206 words
A process for fabricating multi-layer structure, like a multi-density photomask, which comprises: a) providing on a transparent dielectric substrate, preferably of glass or quartz, having a minimum transmittance of about 90% a first metallic layer of a nickel-containing steel alloy or a first metallic layer of a metal selected from the group of copper, chromium, and mixtures thereof; b) providing a first layer of photoresist material on said first metallic layer; c) exposing and developing said first layer of photoresist; d) etching the exposed portion of said first metallic layer; e) providing a second layer of photoresist material over said substrates and said first metallic layer; f) exposing and developing said second layer of photoresist, thereby removing the photoresist material from predetermined areas; g) providing over the substrate, first metallic layer and second layer of photoresist a second metallic layer of a nickel-containing steel alloy or a metal selected from the group of copper, chromium, and mixtures thereof; and being opposite of the metal of the first metallic layer; h) stripping the second layer of photoresist material, thereby removing the portion of said second metallic layer that was located above the second layer of photoresist material and leaving said second metallic layer in said predetermined areas.
Claim 11
Dependent Claim
206 words
A process for fabricating multi-layer structure, like a multi-density photomask, which comprises: a) providing on a transparent dielectric substrate, preferably of glass or quartz, having a minimum transmittance of about 90% a first metallic layer of a nickel-containing steel alloy or a first metallic layer of a metal selected from the group of copper, chromium, and mixtures thereof; b) providing a first layer of photoresist material on said first metallic layer; c) exposing and developing said first layer of photoresist; d) etching the exposed portion of said first metallic layer; e) providing a second layer of photoresist material over said substrates and said first metallic layer; f) exposing and developing said second layer of photoresist, thereby removing the photoresist material from predetermined areas; g) providing over the substrate, first metallic layer and second layer of photoresist a second metallic layer of a nickel-containing steel alloy or a metal selected from the group of copper, chromium, and mixtures thereof; and being opposite of the metal of the first metallic layer; h) stripping the second layer of photoresist material, thereby removing the portion of said second metallic layer that was located above the second layer of photoresist material and leaving said second metallic layer in said predetermined areas.
Claim 12
Dependent Claim
27 words
The process of claim 8 wherein said first metallic layer is said nickel-containing steel alloy and said second metallic layer is copper, or chromium, or mixtures thereof.
Claim 13
Dependent Claim
22 words
The process according to any one of claims 6 to 9 wherein said steel alloy contains at least about 45% of Ni.
Claim 14
Dependent Claim
27 words
The process according to any one of claims 6 to 10 wherein said steel further contains at least about 10% chromium and preferably is an Inconel steel.
References Cited (Backward Citations)
No citation records indexed.
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