EP0272390A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Packages for a semiconductor device
Assignee: Toshiba Corp
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Filing: 1987-10-06
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Granted: —
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Expires: 2007-10-06
Abstract
Abstract A semiconductor chip (5) is mounted and fixed onto a stem (1). A wiring substrate (7) is mounted and fixed around said semiconductor chip (5) on said stem (1). A number of through-holes (1b, 7a) are provided so as to penetrate the stem and the wiring substrate, and a number of lead-pins (3) are inserted into said respective through-holes to extrude from the lower surface of said stem (1). Said semiconductor chip and said wiring substrate are covered by and hermetically sealed to metallic shell (10). The input-output terminals of the electric circuits formed on the semiconductor chip(5) are connected respectively to said lead-pins (3) through wiring layer formed on said wiring substrate (7). In such construction, it is possible to obtain a positive hermetic sealing which is adaptable to multi-pin construction, thereby to reduce the manufacturing cost of semiconductor packages.
Inventors
- 👤 Masamichi Shindo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 04:12
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/6875; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W90/00; H10W90/701; H10W90/731; H10W90/737; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
176 words
A semiconductor package which hermetically seals the corresponding semiconductor chip while the input and output terminals of the electric circuit formed on said semiconductor chip are held in the electrical connection with the outer circuits, characterized by comprising: a metal stem (1) having a semiconductor chip (5) mounted at the center portion thereof and having a number of through-holes (1b) around said semiconductor chip; a wiring substrate (7) attached on the upper surface of said stem, said substrate having a wiring layer (6) of a predetermined pattern formed on the surface thereof and through-holes (7a) each corresponding to said through-holes (1b) of the stem; lead-pins (3) passing through said through-holes (1b, 7a) of said stem and said wiring substrate and protruding below said stem; and a shell (10) for covering and hermetically sealing said semiconductor chip (5) and said wiring substrate (7), wherein the input and output terminals of the electronic circuits formed on said semiconductor chip (5) are connected with said wiring layer (6) and this wiring layer (6) is connected with said lead-pins (3).
Claim 2
Dependent Claim
176 words
A semiconductor package which hermetically seals the corresponding semiconductor chip while the input and output terminals of the electric circuit formed on said semiconductor chip are held in the electrical connection with the outer circuits, characterized by comprising: a metal stem (1) having a semiconductor chip (5) mounted at the center portion thereof and having a number of through-holes (1b) around said semiconductor chip; a wiring substrate (7) attached on the upper surface of said stem, said substrate having a wiring layer (6) of a predetermined pattern formed on the surface thereof and through-holes (7a) each corresponding to said through-holes (1b) of the stem; lead-pins (3) passing through said through-holes (1b, 7a) of said stem and said wiring substrate and protruding below said stem; and a shell (10) for covering and hermetically sealing said semiconductor chip (5) and said wiring substrate (7), wherein the input and output terminals of the electronic circuits formed on said semiconductor chip (5) are connected with said wiring layer (6) and this wiring layer (6) is connected with said lead-pins (3).
Claim 3
Dependent Claim
16 words
The semiconductor package as claimed in claim 1, wherein said stem (1) is made of ferroalloys.
Claim 4
Dependent Claim
29 words
The semiconductor package as claimed in claim 1, wherein the portion of stem (1) mounting thereon semiconductor chip (5) is made of metal materials having a high heat radiation.
Claim 5
Dependent Claim
19 words
The semiconductor package as claimed in claim 3, wherein said metal material having a high heat radiation is copper.
Claim 6
Dependent Claim
27 words
The semiconductor package as claimed in claim 1, wherein said lead-pins (3) are fixed in said through-holes (1b) by filling therein sealing materials (4) consisting of glass.
Claim 7
Dependent Claim
23 words
The semiconductor package as claimed in claim 1, wherein said wiring substrate (7) comprises a monolayer or laminate substrate consisting of glass-epoxy resin.
Claim 8
Dependent Claim
23 words
The semiconductor package as claimed in claim 1, wherein said wiring substrate (7) comprises a monolayer or laminate substrate consisting of polyimide resin.
Claim 9
Dependent Claim
24 words
The semiconductor package as claimed in claim 1, wherein said stem (1) and said shell (10) are connected with each other by electric welding.
Claim 10
Dependent Claim
26 words
The semiconductor package as claimed in claim 1, wherein said stem (1) and said shell (10) are hermetically sealed with each other by filling glass therebetween.
References Cited (Backward Citations)
No citation records indexed.
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