EP0272187A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Plastic package for high frequency semiconductor devices
Assignee: Fairchild Semiconductor Corp
•
Filing: 1987-12-17
•
Granted: —
•
Expires: 2007-12-17
Abstract
Abstract A plastic semiconductor package suitable for high frequency operation includes an internal ground plane (40) connected to a ground ring (64) formed on the packaged semiconductor device. The ground plane is included as a portion of a lead frame strip adjacent to the individual lead frames. The ground plane is first folded underneath the paddle support of the lead frame, and the semiconductor die (60) subsequently mounted on the paddle. The ground plane includes a plurality of bumps (50) which protect upward between adjacent lead fingers (30) of the lead frame when the ground frame is folded. A ground frame on the semiconductor die is connected to the bumps, and the signal bonding pads (62) connected to the lead fingers, typically by wire or tape bonding. The package is then encapsulated in plastic by conventional means, and the package trimmed to its final desired configuration.
Inventors
- 👤 William S. Phy
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 22:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/01; H10W70/04; H10W70/411; H10W72/00; H10W72/01; H10W72/0198; H10W74/00; H10W74/01; H10W74/10; H10W74/131; H10W90/00; H10W90/811; H10W72/50; H10W72/541; H10W72/5449; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
67 words
An elongate lead frame comprising: a plurality of individual frames arranged in a row, each of said frames including a paddle, paddle supports, and a multiplicity of lead fingers circumscribing said paddle; and a plurality of ground plane members, each ground plane member attached to an adjacent frame so that the frame may be folded to lie parallel to and spaced-apart from the paddle of each frame.
Claim 2
Dependent Claim
67 words
An elongate lead frame comprising: a plurality of individual frames arranged in a row, each of said frames including a paddle, paddle supports, and a multiplicity of lead fingers circumscribing said paddle; and a plurality of ground plane members, each ground plane member attached to an adjacent frame so that the frame may be folded to lie parallel to and spaced-apart from the paddle of each frame.
Claim 3
Dependent Claim
33 words
A lead frame as in Claim 1, wherein the ground plane includes a plurality of bumps arranged so that the bumps project between adjacent lead fingers when the ground plane is folded over.
Claim 4
Dependent Claim
16 words
A lead frame as in Claim 2, wherein the bumps are impressed into the ground plane.
Claim 5
Dependent Claim
75 words
An elongate lead frame comprising: a first axial section including a plurality of individual frames, each frame including a paddle, a pair of paddle supports, and a multiplicity of lead fingers circumscribing the paddle; and a second axial section including a plurality of ground planes arranged so that each ground plane lies adjacent an individual frame, whereby each ground plane may be folded to lie parallel to and spaced-apart from the paddle of each frame.
Claim 6
Dependent Claim
75 words
An elongate lead frame comprising: a first axial section including a plurality of individual frames, each frame including a paddle, a pair of paddle supports, and a multiplicity of lead fingers circumscribing the paddle; and a second axial section including a plurality of ground planes arranged so that each ground plane lies adjacent an individual frame, whereby each ground plane may be folded to lie parallel to and spaced-apart from the paddle of each frame.
Claim 7
Dependent Claim
34 words
A lead frame as in Claim 4, wherein the ground plane includes a plurality of bumps arranged so that the bumps project between adjacent leads when the ground plane is folded underneath the paddle.
Claim 8
Dependent Claim
16 words
A lead frame as in Claim 5, wherein the bumps are impressed into the ground plane.
Claim 9
Dependent Claim
17 words
A lead frame as in Claim 4, wherein the two sections are separated by an axial bar.
Claim 10
Dependent Claim
37 words
A lead frame as in Claim 7, wherein the second section further includes a side bar disposed parallel to the axial bar, and wherein the ground planes are suspended between the axial bar and the side bar.
Claim 11
Dependent Claim
38 words
A lead frame as in Claim 4, wherein the ground plane includes a lock pin and one of the paddle supports includes a slot so that the pin inserts into the slot when the ground plane is folded.
Claim 12
Dependent Claim
77 words
A semiconductor package comprising: a paddle having two or more supports; a semiconductor die mounted on the paddle; a plurality of lead fingers circumscribing the paddle support; a ground plane parallel to and spaced-apart from the paddle support, said ground plane having a plurality of bumps on its surface, wherein said bumps are arranged to project between adjacent leads; and a solid matrix encapsulating the paddle support, semiconductor die, ground plane and a portion of each lead.
Claim 13
Dependent Claim
77 words
A semiconductor package comprising: a paddle having two or more supports; a semiconductor die mounted on the paddle; a plurality of lead fingers circumscribing the paddle support; a ground plane parallel to and spaced-apart from the paddle support, said ground plane having a plurality of bumps on its surface, wherein said bumps are arranged to project between adjacent leads; and a solid matrix encapsulating the paddle support, semiconductor die, ground plane and a portion of each lead.
Claim 14
Dependent Claim
17 words
A semiconductor package as in Claim 10, wherein the ground plane is electrically connected to the paddle.
Claim 15
Dependent Claim
17 words
A semiconductor package as in claim 10, wherein the ground plane is electrically isolated from the paddle.
Claim 16
Dependent Claim
36 words
A semiconductor package as in Claim 11, wherein the ground plane and the paddle are attached by a lock pin which remains after folding, said lock pin providing at least a part of the ground connection.
Claim 17
Dependent Claim
14 words
A semiconductor package as in Claim 10, wherein the solid matrix is a plastic.
Claim 18
Dependent Claim
26 words
A semiconductor package as in Claim 10, wherein the semiconductor die includes a ground connectiona and the ground plane is electrically connected to said ground connection.
Claim 19
Dependent Claim
41 words
A semiconductor package as in Claim 15, wherein the ground connection on the die is a ring formed about the periphery of the die, and wherein the ground ring is connected to the ground plane by a plurality of bond members.
Claim 20
Dependent Claim
29 words
A semiconductor package as in Claim 16, wherein the connections from the ground ring are made to the bumps on the ground plane and interdigitate between adjacent signal connections.
Claim 21
Independent Claim
65 words
A method for fabricating a semiconductor package, said method comprising: attaching a semiconductor die onto the paddle of a lead frame, said lead frame including a plurality of individual frames connected to ground plane members projecting laterally from the paddle supports; folding the ground planes over to lie parallel to and spaced apart from the paddle support; and encapsulating the die, lead frame, and paddle.
Claim 22
Independent Claim
65 words
A method for fabricating a semiconductor package, said method comprising: attaching a semiconductor die onto the paddle of a lead frame, said lead frame including a plurality of individual frames connected to ground plane members projecting laterally from the paddle supports; folding the ground planes over to lie parallel to and spaced apart from the paddle support; and encapsulating the die, lead frame, and paddle.
Claim 23
Dependent Claim
35 words
A method as in Claim 18, wherein the ground plane includes a plurality of bumps arranged in a determined pattern, and wherein the ground plane is folded so that the bumps project between adjacent leads.
Claim 24
Dependent Claim
18 words
A method as in Claim 18, wherein the die, lead frame, and paddle are encapsulated by transfer molding.
Claim 25
Dependent Claim
18 words
A method as in Claim 18, wherein the die, lead frame, and paddle are encapsulated by injection molding.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.