EP0272046A2
Expired / Lapsed
EP
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Circuit arrangement including a composite ceramic substrate
Assignee: Marconi Electronic Devices Ltd
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Filing: 1987-12-09
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Granted: —
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Expires: 2007-12-09
Abstract
Abstract A circuit arrangement consists of a number of ceramic layers (1 to 10) fired together to form a unitary multilayer structure, some of the layers carry conductive circuit patterns with conductive via connections (18) between different layers of circuit pattern. A recess (11) is formed through a number of the ceramic layers, and a semiconductor device is mounted in the recess within the thickness of the unitary structure. The recess is provided with a lid (19) to hermetically seal the enclosure.
Inventors
- 👤 Russell David Anderson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 13:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
91 words
A circuit arrangement including a planar substrate consisting of a plurality of insulating ceramic layers bonded together, some of which carry intermediate electrically conductive layers, a plurality of said layers being in the form of patterns of conductive tracks, a recess formed in the substrate and being constituted by apertures extending wholly through a plurality of ceramic layers, at least one of which carries an intermediate electrically conductive layer; and a semiconductor device mounted within said recess, and having electrical connections to at least one of said intermediate electrically conductive layers.
Claim 2
Dependent Claim
91 words
A circuit arrangement including a planar substrate consisting of a plurality of insulating ceramic layers bonded together, some of which carry intermediate electrically conductive layers, a plurality of said layers being in the form of patterns of conductive tracks, a recess formed in the substrate and being constituted by apertures extending wholly through a plurality of ceramic layers, at least one of which carries an intermediate electrically conductive layer; and a semiconductor device mounted within said recess, and having electrical connections to at least one of said intermediate electrically conductive layers.
Claim 3
Dependent Claim
20 words
An arrangement as claimed in Claim 1 and wherein the recess is provided with a lid to enclose the recess.
Claim 4
Dependent Claim
31 words
An arrangement as claimed in Claim 2 and wherein the lid is ceramic and is sealed to the substrate so as to provide a hermetically sealed enclosure for the semiconductor device.
Claim 5
Dependent Claim
20 words
An arrangement as claimed in any of the preceding claims and wherein the recess contains a plurality of circuit components.
Claim 6
Dependent Claim
24 words
An arrangement as claimed in any of the preceding claims and wherein a plurality of said recesses are present, each containing a circuit component.
Claim 7
Dependent Claim
41 words
An arrangement as claimed in any of the preceding claims and wherein an interconnection is provided through the thickness of at least one of said insulating ceramic layers so as to electrically connect at least two of said electrically conductive layers.
Claim 8
Independent Claim
88 words
A method of making a circuit arrangement including the steps of forming electrically conductive patterns on a plurality of flexible insulating ceramic substrates, at least some of which have apertures formed through their thickness; assembling the substrates into a composite structure such that the apertures cooperate together to form an open recess in the structure; firing the ceramic substrates to form a rigid composite structure having internal electrically conductive patterns; mounting a semiconductor device within the recess; and electrically connecting the device to an internal electrically conductive pattern.
Claim 9
Independent Claim
88 words
A method of making a circuit arrangement including the steps of forming electrically conductive patterns on a plurality of flexible insulating ceramic substrates, at least some of which have apertures formed through their thickness; assembling the substrates into a composite structure such that the apertures cooperate together to form an open recess in the structure; firing the ceramic substrates to form a rigid composite structure having internal electrically conductive patterns; mounting a semiconductor device within the recess; and electrically connecting the device to an internal electrically conductive pattern.
Claim 10
Dependent Claim
24 words
A method as claimed in Claim 7 and wherein the electrically conductive patterns are formed of conductive ink printed through appropriately patterned screen meshes.
Claim 11
Dependent Claim
40 words
A method as claimed in Claim 7 or 8, and wherein holes are made in those insulating layers through which via connections are to be formed, and the holes filled with conductive ink prior to the firing of the ceramic.
Claim 12
Independent Claim
37 words
A method as claimed in any of the Claims 7 to 9 wherein following the mounting of said semiconductor device within the recess, the recess is hermetically sealed by means of a lid to form an enclosure.
Claim 13
Dependent Claim
20 words
A method as claimed in Claim 10 and wherein the lid is formed of one or more fired ceramic layers.
References Cited (Backward Citations)
No citation records indexed.
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