EP0266210A2
Expired / Lapsed
EP
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Electronic apparatus comprising a ceramic substrate
Assignee: Toshiba Corp
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Filing: 1987-10-29
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Granted: —
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Expires: 2007-10-29
Abstract
Abstract Disclosed electronic apparatus comprises a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of the ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on the multilayered wiring portion (12) and electrically connected to the conductor patterns of the multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of the ceramic substrate (5), connection conductor patterns (7) formed on the main surface of the ceramic substrate (5) astride the gap between the line patterns of the multilayered wiring portion (12) and the input and output conductor pads (6), an inorganic insulation layer (8) formed annularly on the main surface of the ceramic substrate (5) across over at least part of the connection conductor patterns (7) around the multilayered wiring portion (12), a metallized layer (9) formed on the inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on the metallized layer (9). Since the metallic cap can be fixed hermetically to the annular metallized layer (9) and moreover since the inorganic insulation layer (8) outside the seal ring patterns is formed of a ceramic material, this electronic apparatus produces a highly reliable operation without entailing the dangers of closed-circuit failure, corrosion, and formation of dew.
Inventors
- 👤 Yoshitaka C/O Patent Division Fukuoka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 22:56
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W70/00; H10W70/60; H10W70/611; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
191 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of said ceramic substrate (5), connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said metallized layer (9).
Claim 2
Dependent Claim
191 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of said ceramic substrate (5), connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said metallized layer (9).
Claim 3
Dependent Claim
192 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed in the peripheral portion of the main surface of said ceramic substrate (5), connection conductor patterns (7) formed astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12) both by the thick-film method using a conductive composition, an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said metallized layer (9).
Claim 4
Dependent Claim
192 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed in the peripheral portion of the main surface of said ceramic substrate (5), connection conductor patterns (7) formed astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12) both by the thick-film method using a conductive composition, an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said metallized layer (9).
Claim 5
Dependent Claim
29 words
The apparatus according to claim 2, wherein said input and output conductor pads (6) and said connection conductor patterns (7) are formed of one and the same conductive composition.
Claim 6
Independent Claim
32 words
The apparatus according to any of claims 1 through 3, wherein said metallized layer (9) formed annularly on said inorganic insulation layer (8) is produced by the thick-film method using conductive composition.
Claim 7
Dependent Claim
199 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of said ceramic substrate (5) by the thin-film method using a conductive metal, connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said metallized layer (9).
Claim 8
Dependent Claim
199 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of said ceramic substrate (5) by the thin-film method using a conductive metal, connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said metallized layer (9).
Claim 9
Dependent Claim
35 words
The apparatus according to claim 5, wherein said connection conductor patterns (7) and said metallized layer (9) formed annularly on said inorganic insulation layer (8) are produced by the thick-film method using a conductive composition.
Claim 10
Dependent Claim
235 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of said ceramic substrate (5) by the thin-film method using a conductive composition, connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8) by the thick-film method using a conductive composition, a conductive metal pattern formed annularly on said metallized layer by the thin-film method using a conductive metal in such a manner as to cover said metallized layer, and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said conductive metal pattern.
Claim 11
Dependent Claim
235 words
An electronic apparatus, comprising; a ceramic substrate (5), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the periphery of the main surface of said ceramic substrate (5) by the thin-film method using a conductive composition, connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8) by the thick-film method using a conductive composition, a conductive metal pattern formed annularly on said metallized layer by the thin-film method using a conductive metal in such a manner as to cover said metallized layer, and a moistureproof cap (19) having the edge thereof hermetically fixed by soldering on said conductive metal pattern.
Claim 12
Dependent Claim
250 words
An electronic apparatus, comprising; a ceramic substrate (15), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the peripheral portion of the main surface of said ceramic substrate (5) with a conductive coat produced by the thickfilm method using a conductive composition and a conductive coat superposed on said conductive coat by the thin-film method using a conductive metal, connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), a conductive metal pattern formed annularly on said metallized layer by the thin-film method using a conductive metal in such a manner as to cover said metallized layer, and a moistureproof (19) cap having the edge thereof hermatically fixed by soldering on said conductive metal pattern.
Claim 13
Dependent Claim
250 words
An electronic apparatus, comprising; a ceramic substrate (15), a multilayered wiring portion (12) disposed at a distance from the periphery of the main surface of said ceramic substrate (5) and produced by alternately repeating a conductor pattern (10) formed by the thin-film method using a conductive metal and a polyimide layer (11), electronic devices mounted on said multilayered wiring portion (12) and electrically connected to the conductor patterns of said multilayered wiring portion (12), input and output conductor pads (6) formed on the peripheral portion of the main surface of said ceramic substrate (5) with a conductive coat produced by the thickfilm method using a conductive composition and a conductive coat superposed on said conductive coat by the thin-film method using a conductive metal, connection conductor patterns (7) formed on the main surface of said ceramic substrate (5) astride the gap between said input and output conductor pads (6) and the line patterns of said multilayered wiring portion (12), an inorganic insulation layer (8) formed annularly on the main surface of said ceramic substrate (5) across over at least part of said connection conductor patterns (7) around said multilayered wiring portion (12), a metallized layer (9) formed annularly on said inorganic insulation layer (8), a conductive metal pattern formed annularly on said metallized layer by the thin-film method using a conductive metal in such a manner as to cover said metallized layer, and a moistureproof (19) cap having the edge thereof hermatically fixed by soldering on said conductive metal pattern.
Claim 14
Dependent Claim
32 words
The apparatus according to claim 8, wherein said conductive coat produced by said thick-film method to form said input and output conductor pads (6) uses a Au paste as a material thereof.
Claim 15
Dependent Claim
25 words
The apparatus according to claim 8 or claim 9, wherein said connection conductor patterns (7) are formed by the thick-film method using a conductive composition.
Claim 16
Dependent Claim
46 words
The apparatus according to claim 8 through claim 10, wherein said conductive metal used in said thin-film method for the formation of said input and output pads or annular conductor patterns is a metal selected from the group consisting of Cr/Cu, Ti/Cu, Ti/Cu/Cr, Cr/Cu/Au, and Ti/Cu/Au.
Claim 17
Independent Claim
19 words
The apparatus according to any of claims 1 through 11, wherein said ceramic substrate (5) is an alumina substrate.
Claim 18
Independent Claim
48 words
The apparatus according to any of claims 1 through 12, wherein said conductor patterns of said multilayered wiring portion (12) is formed by photolithographically etching a thin film formed by evaporating or spattering a metal selected from the group consisting of Cr/Cu, Ti/Cu, Cr/CuCr, Ti/Cu/Ti, Cr/Cu/Au, and Ti/Cu/Au.
Claim 19
Independent Claim
36 words
The apparatus according to any of claims 1 through 13, wherein said polyimide layer (11) of said multilayered wiring portion (12) is formed by photolighographically etching a thin film formed by spin coating a polyimide resin.
Claim 20
Dependent Claim
13 words
The apparatus according to claim 14, wherein said polyimide is a photosensitive polyimide.
Claim 21
Independent Claim
53 words
The apparatus according to any of claims 1 through 15, wherein of the conductor patterns making up said multilayered wiring portion (12), the conductor pattern forming the lowermost layer has the terminal portions of the line patterns thereof superposed on the inner edges of said connection conductor patterns (7) and electrically connected thereto.
Claim 22
Independent Claim
35 words
The apparatus according to any of claims 1 through 16, wherein said annular inorganic insulation layer is formed by printing crystallized glass paste, and drying and firing the applied layer of said crystallized glass paste.
Claim 23
Independent Claim
36 words
The apparatus accordisng to any of claims 1 through 17, wherein said conductive composition for forming said connection conductor patterns (7) is selected from among Au paste, Cu paste, Ag-Pt paste, Au-Pt paste, and Ag-Pd paste.
Claim 24
Independent Claim
22 words
The apparatus according to any of claims 1 through 18, wherein said moistureproof cap (19) is made of Kovar or Fe/Ni42 Alloy.
References Cited (Backward Citations)
No citation records indexed.
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