EP0265927A2
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Wire stacked bonding method
Assignee: Hitachi Ltd
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Filing: 1987-10-28
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Granted: —
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Expires: 2007-10-28
Abstract
Abstract The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad (1), and a second wire (3) is bonded on the position where the first wire (2) has been bonded. Bonding of a subsequent wire (4) is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad (1) area is very small.
Inventors
- 👤 Hiroshi Hasegawa
- 👤 Koichi Sugimoto
- 👤 Takeshi Yano
- 👤 Tositada Netsu
- 👤 Mitsukiyo Tani
- 👤 Tosaku Kojima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:20
CPC Classifications
H; H01; H01R; H01R4/00; H01R4/02; B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H10; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/5366; H10W72/541; H10W72/5434; H10W72/547; H10W72/5475; H10W72/90; H10W72/931; H10W72/932
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
31 words
A wire stacked bonding method wherein a wire for connecting wires between electronic parts is bonded characterized in that a plurality of wires are stacked and bonded on one bonding pad.
Claim 2
Dependent Claim
31 words
A wire stacked bonding method wherein a wire for connecting wires between electronic parts is bonded characterized in that a plurality of wires are stacked and bonded on one bonding pad.
Claim 3
Dependent Claim
40 words
A wire stacked bonding method as set forth in claim 1, wherein the top end of a wire is melted to form a ball, and the ball is heated and pressed thereby deformed into a disc-like form and then stacked.
Claim 4
Dependent Claim
32 words
A wire stacked bonding method as set forth in claim 2, wherein bonding is performed so that the wire is drawn in the same direction from the circumference of the disc-like form.
Claim 5
Dependent Claim
115 words
A wire stacked bonding method wherein a terminal of an electric torch device approaches the top end of a wire projecting from a capillary, and is discharged between the wire and the terminal thereby the top end of the wire is melted to form a ball and the wire is positioned so that the formed ball comes on a bonding pad, the ball is heated and pressed by a heater chip thereby the ball is deformed into a disc-like form and then bonded to the bonding pad, and the next wire is similarly bonded on the end of the bonded disc-like form thereby a plurality of wires are stacked and bonded on the bonding pad.
Claim 6
Dependent Claim
115 words
A wire stacked bonding method wherein a terminal of an electric torch device approaches the top end of a wire projecting from a capillary, and is discharged between the wire and the terminal thereby the top end of the wire is melted to form a ball and the wire is positioned so that the formed ball comes on a bonding pad, the ball is heated and pressed by a heater chip thereby the ball is deformed into a disc-like form and then bonded to the bonding pad, and the next wire is similarly bonded on the end of the bonded disc-like form thereby a plurality of wires are stacked and bonded on the bonding pad.
Claim 7
Dependent Claim
32 words
A wire stacked bonding method as set forth in claim 4, wherein bonding is performed so that the wire is drawn in the same direction from the circumference of the disc-like form.
Claim 8
Dependent Claim
29 words
A wire suitable for applying the stocked bonding method according to one of the preceding claims, characterized in that the top end of said wire has a disk-like form.
References Cited (Backward Citations)
No citation records indexed.
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