EP0265367A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Variable width ic bond pad arrangement
Assignee: RTX Corp
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Filing: 1987-10-15
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Granted: —
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Expires: 2007-10-15
Abstract
Abstract The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic with the bond pad widths (47) increasing as a function of the distance (49) of each pad from the center of package mass (40) whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the center (40) of the package have the narrowest width.
Inventors
- 👤 Michael David Cusack
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 05:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H10W70/01; H10W70/05; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/094; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
159 words
The method of disposing a given number of metal bond pads on a pre-fired ceramic substrate having a known shrinkage tolerance, on a surface area thereof having a given length symmetrical about the ceramic substrate center of mass, to provide, in the substrate post-fired state, registration of the bond pads with corresponding leads of an integrated circuit (IC) die mounted to the substrate by a tape automated bonding (TAB) process, comprising the steps of: locating the center of symmetry of the surface area to the center of mass; marking off half length regions on each side of said center of symmetry; and disposing one half the number of bond pads in each said region, each pad with increasing bond pad width, from a minimum width for a first pad disposed adjacent to said center of symmetry, to a maximum value for a last pad disposed at the end of said half length region, furthest from said center of symmetry.
Claim 2
Independent Claim
159 words
The method of disposing a given number of metal bond pads on a pre-fired ceramic substrate having a known shrinkage tolerance, on a surface area thereof having a given length symmetrical about the ceramic substrate center of mass, to provide, in the substrate post-fired state, registration of the bond pads with corresponding leads of an integrated circuit (IC) die mounted to the substrate by a tape automated bonding (TAB) process, comprising the steps of: locating the center of symmetry of the surface area to the center of mass; marking off half length regions on each side of said center of symmetry; and disposing one half the number of bond pads in each said region, each pad with increasing bond pad width, from a minimum width for a first pad disposed adjacent to said center of symmetry, to a maximum value for a last pad disposed at the end of said half length region, furthest from said center of symmetry.
Claim 3
Dependent Claim
33 words
The method of claim 1, wherein said step of disposing includes the step of depositing the bond pads in each said length region with substantially equal spacing between adjacent edges of adjacent pads.
Claim 4
Dependent Claim
58 words
The method of claim 1, wherein the width of each bond pad is equal to the sum of a manufacturing tolerance factor and a shrinkage tolerance factor, said manufacturing tolerance factor being constant for each bond pad, said shrinkage tolerance factor varying from a minimum value for said first pad to a maximum value for said last pad.
Claim 5
Dependent Claim
137 words
The method of claim 3, wherein said step of disposing includes the step of: applying said first bond pad at a pad width substantially equal to said manufacturing tolerance value; measuring the coordinate distance value from said center of symmetry to the centerline of said first pad; depositing a present bond pad spaced from the preceding bond pad by a gap value, at a pad width equal to the sum of said manufacturing tolerance value and the product of said coordinate distance multiplied by the known shrinkage tolerance value; determining the present coordinate distance value from said preceding bond pad centerline to said present bond pad centerline and adding this to the sum total of all preceding coordinate distance values; and continuing said step of depositing and said step of determining up to said last bond pad.
References Cited (Backward Citations)
US4396971A
Cited
US3926746A
Cited
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