Patent US4235502A successfully refreshed from Google Patents.
EP0264892A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Cooling objects, for example semiconductor devices
Assignee: Fujitsu Ltd
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Filing: 1987-10-19
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Granted: —
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Expires: 2007-10-19
Abstract
Abstract A heat transfer medium having a composition such that it is in the form of a phase mixture of solid and liquid phases at the appropriate temperature. The phases may be a solid solution and a liquid mixture of two or more components, providing the medium as a metal sherbet. For instance, in an In-Ga binary system solids of In-Ga solid solution are dispersed in an In and Ga liquid. The medium may be placed between a cooling unit and an object, e.g. a semiconductor device, to be cooled, exhibiting the solid and liquid phase mixture form at the normal operating temperature of the device and cooling unit.
Inventors
- 👤 Katsuhide Fujitsu Ltd. Kosugi Fujitsu B. Natori
- 👤 Isao Fujitsu Ltd. Kosugi Fujitsu B. Watanabe
- 👤 Koji Fujitsu Ltd. Kosugi Fujitsu B. Katsuyama
- 👤 Isao Fujitsu Ltd. Kosugi Fujitsu B. Kawamura
- 👤 Haruhiko Fujitsu Ltd. Kosugi Fujitsu B. Yamamoto
- 👤 Takeshi Fujitsu Ltd. Kosugi Fujitsu B. Nagai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 14:51
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W40/735; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
71 words
A method of cooling an object, for example a semiconductor device, using a cooling unit, the method comprising providing between the object and the cooling unit, for transferring heat from the object to the cooling unit, a heat conducting body that is in the state of a solid phase and a liquid phase when the cooling unit, and the object when the object is a operable device, is in operation .
Claim 2
Independent Claim
71 words
A method of cooling an object, for example a semiconductor device, using a cooling unit, the method comprising providing between the object and the cooling unit, for transferring heat from the object to the cooling unit, a heat conducting body that is in the state of a solid phase and a liquid phase when the cooling unit, and the object when the object is a operable device, is in operation .
Claim 3
Dependent Claim
26 words
A method as claimed in claim 1, wherein the heat conducting body is a mixture comprising 50 to 94 weight percent indium and the balance gallium.
Claim 4
Dependent Claim
26 words
A method as claimed in claim 1, wherein the heat conducting body is a mixture comprising 20 to 60 weight percent tin and the balance gallium.
Claim 5
Dependent Claim
30 words
A method as claimed in claim 1, 2, or 3, wherein the heat conducting body has a coefficient of viscosity more than 3000 centipoise at a temperature less than 40°C.
Claim 6
Dependent Claim
54 words
A combination of an object, for example a semiconductor device, and a cooling unit, with a heat transfer medium between them, characterised in that the heat transfer medium has a composition such that it is in the form of a mixture of solid and liquid phases at the normal operating temperature of the combination.
Claim 7
Dependent Claim
54 words
A combination of an object, for example a semiconductor device, and a cooling unit, with a heat transfer medium between them, characterised in that the heat transfer medium has a composition such that it is in the form of a mixture of solid and liquid phases at the normal operating temperature of the combination.
Claim 8
Dependent Claim
30 words
A combination as claimed in claim 5, characterised in that the said solid and liquid phases are respectively a solid solution and a liquid mixture of two or more components.
Claim 9
Dependent Claim
28 words
A combination as claimed in claim 5 or 6, wherein the heat conducting body is a mixture comprising 50 to 94 weight percent indium and the balance gallium.
Claim 10
Dependent Claim
28 words
A combination as claimed in claim 5 or 6, wherein the heat conducting body is a mixture comprising 20 to 60 weight percent tin and the balance gallium.
Claim 11
Dependent Claim
32 words
A combination as claimed in claim 5, 6, 7 or 8, wherein the heat conducting body has a coefficient of viscosity more than 3000 centipoise at a temperature less than 40° C.
Claim 12
Dependent Claim
14 words
The use of a metal sherbet as a heat transfer medium between two bodies.
Claim 13
Dependent Claim
14 words
The use of a metal sherbet as a heat transfer medium between two bodies.
References Cited (Backward Citations)
No citation records indexed.
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