EP0263277A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A flexible electrical connection and method of making same
Assignee: International Business Machines Corp
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Filing: 1987-08-21
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Granted: —
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Expires: 2007-08-21
Abstract
Abstract A flexible electrical connection, and method for making such a connection, for mounting an electronic device (20), such as a semiconductor chip made primarily of silicon, on an organic substrate (10), such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line (11) attached to the surface of the organic substrate and having a floating terminus (16) in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend (17), and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.
Inventors
- 👤 Michael James Canestaro
- 👤 William Joseph Summa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 11:12
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4092; H05K1/00; H05K1/02; H05K1/0271; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10742; H05K2201/1075; H05K2201/10757; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
45 words
A flexible electrical connection for mounting an electronic device (20) on a circuitized substrate (10), comprising: at least one circuit line (11) having a terminus (16) floating on a relatively low adhesive area of the circuitized substrate, said terminus having a stress relief bend (17).
Claim 2
Dependent Claim
45 words
A flexible electrical connection for mounting an electronic device (20) on a circuitized substrate (10), comprising: at least one circuit line (11) having a terminus (16) floating on a relatively low adhesive area of the circuitized substrate, said terminus having a stress relief bend (17).
Claim 3
Dependent Claim
35 words
A flexible electrical connection as recited in claim 1 wherein said circuit line further comprises a portion (19), extending from said terminus, which is fixed to a relatively high adhesive area of the circuitized substrate.
Claim 4
Dependent Claim
38 words
A flexible electrical connection as recited in claim 1 or 2 wherein said circuitized substrate (10) comprises a circuit board made primarily of an organic material, and said electronic device comprises a semiconductor chip made primarily of silicon.
Claim 5
Dependent Claim
23 words
A flexible electrical connection as recited in one of the claims 1 - 3 wherein said stress relief bend is generally "U" shaped.
Claim 6
Dependent Claim
56 words
A flexible electrical connection as recited in one of the claims 1 - 4 wherein said stress relief bend is generally "U" shaped, with the "U" having a height of approximately two to three times the width of said circuit line, and a width of approximately four to six times the width of said circuit line.
Claim 7
Independent Claim
68 words
A method for making a flexible electrical connection on a substrate (12) for carrying an electronic device, comprising the steps of: forming at least one relatively low adhesive area (2) on the substrate; and forming at least one circuit line (11) on the substrate, with said circuit line having a terminus (16) with a stress relief bend (17) floating on the relatively low adhesive area of the substrate.
Claim 8
Independent Claim
68 words
A method for making a flexible electrical connection on a substrate (12) for carrying an electronic device, comprising the steps of: forming at least one relatively low adhesive area (2) on the substrate; and forming at least one circuit line (11) on the substrate, with said circuit line having a terminus (16) with a stress relief bend (17) floating on the relatively low adhesive area of the substrate.
Claim 9
Dependent Claim
125 words
A method for making a flexible electrical connection as recited in claim 6 wherein the step of forming the relatively low adhesive area(s) on the substrate comprises: placing a layer (15) of copper on the substrate (12); covering all of the copper layer on the substrate with a mask, except for the area(s) of the substrate which is to have relatively high adhesion; removing all of the copper layer not covered by the mask; removing the mask from the substrate; and treating the surface of the substrate, including the part(s) of the copper layer left on the substrate, with a cationic surfactant whereby the part(s) of the copper layer left on the substrate and treated with the cationic surfactant form the relatively low adhesive area(s).
Claim 10
Dependent Claim
76 words
A method for making a flexible electrical connection as recited in claim 6 wherein the step of forming the relatively low adhesive area(s) on the substrate comprises: placing a layer of copper on the substrate; completely etching away the copper layer placed on the substrate; covering all of the substrate with a mask, except for the area(s) of the substrate which are to have relatively low adhesion; and smoothing the area(s) not covered by the mask.
Claim 11
Dependent Claim
102 words
A method for making a flexible electrical connection as recited in claim 6 wherein the step of forming the relatively low adhesive area(s) on the substrate comprises: selectively smoothing an area(s) on a layer of copper; laminating the copper layer to the substrate with the selectively smoothed side of the copper layer facing the surface of the substrate; and completely removing the copper layer from the substrate to form a smooth area(s) on the substrate replicating the smooth area(s) on the copper layer which is selected to match the relatively low adhesive area which it is desired to form on the substrate.
Claim 12
Independent Claim
69 words
A method for making a flexible electrical connection as recited in one of the claims 6 - 8 wherein the step of forming at least one circuit line on the substrate comprises: covering the substrate with a mask having a negative image of the circuit line(s) which it is desired to form on the substrate; and depositing a conductive material on the substrate to form the desired circuit line(s).
Claim 13
Dependent Claim
34 words
A method for making a flexible electrical connection as recited in claim 10 wherein the step of depositing a conductive material comprises: additively plating copper on the substrate to form the desired circuit line(s).
References Cited (Backward Citations)
No citation records indexed.
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