EP0259816A2
Expired / Lapsed
EP
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Method for bonding semiconductor laser element and apparatus therefor
Assignee: Panasonic Holdings Corp
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Filing: 1987-09-07
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Granted: —
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Expires: 2007-09-07
Abstract
Abstract A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).
Inventors
- 👤 Akihiro Yamamoto
- 👤 Yutaka Makino
- 👤 Shinji Kaino
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 15:25
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/02326; H05; H05K; H05K3/00; H01S3/00; H01S3/02; H01S5/0235; H01S5/02355; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
141 words
A method for bonding semiconductor laser element comprising: a step (7) for mounting a laser chip on a stem of a semiconductor laser device, a step (14) for supplying an electric power to said laser chip to make it emit a laser light, a step (14) for examining intensity of said emitted laser light, a step (15) for detecting a central axis of a light beam of said emitted laser light and measuring a difference between direction of said central axis and a predetermined direction, a step (16) for adjusting said laser chip until said difference between the direction of said central axis and the predetermined direction becomes within a predetermined range, and a step (17) for bonding said laser chip on the stem when said difference between of said central axis and the predetermined direction becomes within said predetermined range.
Claim 2
Independent Claim
141 words
A method for bonding semiconductor laser element comprising: a step (7) for mounting a laser chip on a stem of a semiconductor laser device, a step (14) for supplying an electric power to said laser chip to make it emit a laser light, a step (14) for examining intensity of said emitted laser light, a step (15) for detecting a central axis of a light beam of said emitted laser light and measuring a difference between direction of said central axis and a predetermined direction, a step (16) for adjusting said laser chip until said difference between the direction of said central axis and the predetermined direction becomes within a predetermined range, and a step (17) for bonding said laser chip on the stem when said difference between of said central axis and the predetermined direction becomes within said predetermined range.
Claim 3
Independent Claim
151 words
An apparatus for bonding semiconductor laser element comprising: a means (24) for mounting a laser chip (4) on a stem (1) of a semiconductor laser device, a means (33) for supplying an electric power to said laser chip (4) to make emit a laser light, a means (34) for examinig intensity of said emitted laser light, a means (35, 36) for detecting a central axis of a light beam of said emitted laser light and measuring a difference between direction of said central axis and a predetermined direction (40), a means (68) for adjusting said laser chip until said difference between the direction of said central axis and the predetermined direction (0) becomes within a predetermined range (ϑ), and a means (28) for bonding said laser chip (4) on the stem (1) when said difference between of said central axis and the predetermined direction (0) becomes within said predetermined range (ϑ).
Claim 4
Independent Claim
151 words
An apparatus for bonding semiconductor laser element comprising: a means (24) for mounting a laser chip (4) on a stem (1) of a semiconductor laser device, a means (33) for supplying an electric power to said laser chip (4) to make emit a laser light, a means (34) for examinig intensity of said emitted laser light, a means (35, 36) for detecting a central axis of a light beam of said emitted laser light and measuring a difference between direction of said central axis and a predetermined direction (40), a means (68) for adjusting said laser chip until said difference between the direction of said central axis and the predetermined direction (0) becomes within a predetermined range (ϑ), and a means (28) for bonding said laser chip (4) on the stem (1) when said difference between of said central axis and the predetermined direction (0) becomes within said predetermined range (ϑ).
References Cited (Backward Citations)
No citation records indexed.
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