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EP0256368A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Testing device for the double-sided stepwise contacting of equipped printed circuit boards

Assignee: Siemens AG
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Filing: 1987-07-27
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Granted: —
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Expires: 2007-07-27
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Abstract

Abstract Translated from German Für die beidseitige, zweistufige Kontaktierung bestückter Leiterplatten (Lp) sind ein unterer Nadeladapter (Nau) mit unterschiedlich langen, ersten und zweiten gefederten Kontakt­nadeln (Kn1, Kn2) und ein oberer Nadeladapter (Nao) mit unter­schiedlich langen, dritten und vierten gefederten Kontaktna­deln (Kn3, Kn4) vorgesehen. Bei sämtlichen Stufen der Kontak­tierung sind die Leiterplatten (Lp) fest zwischen unteren und oberen, prüflingsspezifisch angeordneten Andruckstößeln (Asu bzw. Aso) eingespannt, wodurch insbesondere eine hohe Kontak­tiersicherheit gewährleistet wird. For the two-sided, two-stage contacting of printed circuit boards (Lp) are a lower needle adapter (Nau) with differently long, first and second spring-loaded contact needles (Kn1, Kn2) and an upper needle adapter (Nao) with differently long, third and fourth spring-loaded contact needles (Kn3 , Kn4) provided. At all stages of contacting, the printed circuit boards (Lp) are firmly clamped between the lower and upper pressure rams (Asu or Aso), which are specific to the test specimen, thereby ensuring in particular a high level of contact security.

Inventors

  • 👤 Wolfgang Hilz
  • 👤 Rudolf Dipl.-Ing. Schuster
  • 👤 Hans Schauflinger

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 21:18
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07314; G01R1/07328; G01R1/07335

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

US4115735A Cited
DE2657910B1 Cited
US4335350A Cited
EP0196149A1 Cited
DE3511821C1 Cited

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