EP0255557A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Process for forming metal images
Assignee: Shipley Co Inc
•
Filing: 1986-09-12
•
Granted: —
•
Expires: 2006-09-12
Abstract
Abstract A method for coating a conductive surface with an organic coating where one discrete area of the organic coating is coated onto the surface in an image pattern by conventional means and another discrete area of the organic coating is electrophoretically deposited onto the surface. The process is useful for diverse applications including the fabrication of printed circuit boards.
Inventors
- 👤 Stephen S. Rodriquez
- 👤 Robert E. Hawkins
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 16:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; G; G03; G03F; G03F7/00; G03F7/16; G03F7/164; H05K3/10; H05K3/108; H05K3/22; H05K3/24; H05K3/243; H05K1/00; H05K1/02; H05K1/11; H05K1/117; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0582; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/0779; H05K2203/0783; H05K2203/13; H05K2203/1333; H05K2203/135
Claims Analysis
Total Claims: 56
Claim 1
Independent Claim
70 words
A process for coating a conductive substrate comprising the steps of applying a first organic coating over a surface of the conductive substrate in a relief image pattern whereby a part of the surface is coated with said first organic coating and a part of the surface is not coated with said first organic coating and electrophoretically depositing a second organic coating over the uncoated areas of the conductive coating.
Claim 2
Dependent Claim
70 words
A process for coating a conductive substrate comprising the steps of applying a first organic coating over a surface of the conductive substrate in a relief image pattern whereby a part of the surface is coated with said first organic coating and a part of the surface is not coated with said first organic coating and electrophoretically depositing a second organic coating over the uncoated areas of the conductive coating.
Claim 3
Dependent Claim
11 words
The process of claim 1 where the conductive substrate is metal.
Claim 4
Dependent Claim
11 words
The process of claim 1 where the conductive substrate is copper.
Claim 5
Dependent Claim
16 words
The process of claim 1 where the conductive substrate is a printed circuit board base material.
Claim 6
Dependent Claim
26 words
The process of claim 4 where the printed circuit board base material is a copper clad plastic and the organic coatings are applied over the copper.
Claim 7
Dependent Claim
23 words
The process of claim 1 where the first organic coating is a photoresist that is exposed and developed to yield a relief image.
Claim 8
Dependent Claim
15 words
The process of claim 6 where the photoresist is a negatively acting dry film resist.
Claim 9
Dependent Claim
15 words
The process of claim 6 where the photoresist is electrophoretically deposited over the conductive substrate.
Claim 10
Dependent Claim
32 words
The process of claim 1 where the first and second coatings are soluble in aqueous solutions and each coating is insoluble in an aqueous solution in which the other coating is soluble.
Claim 11
Dependent Claim
25 words
The process of claim 9 where one coating is soluble in an aqueous acid solution and the other is soluble in an aqueous alkaline solution.
Claim 12
Dependent Claim
79 words
A process for coating a printed circuit board substrate having a copper surface comprising the steps of applying a first organic coating over the copper surface of the base material in a relief image pattern whereby a part of the copper surface is coated with said first organic coating and a part of the copper surface is not coated with said first organic coating and electrophoretically depositing a second organic coating over the uncoated areas of the copper coating.
Claim 13
Dependent Claim
79 words
A process for coating a printed circuit board substrate having a copper surface comprising the steps of applying a first organic coating over the copper surface of the base material in a relief image pattern whereby a part of the copper surface is coated with said first organic coating and a part of the copper surface is not coated with said first organic coating and electrophoretically depositing a second organic coating over the uncoated areas of the copper coating.
Claim 14
Dependent Claim
23 words
The process of claim 11 where the first organic coating is a photoresist that is exposed and developed to yield a relief image.
Claim 15
Dependent Claim
15 words
The process of claim 12 where the photoresist is a negatively acting dry film resist.
Claim 16
Dependent Claim
15 words
The process of claim 12 where the photoresist is electrophoretically deposited over the conductive substrate.
Claim 17
Dependent Claim
32 words
The process of claim 11 where the first and second coatings are soluble in aqueous solutions and each coating is insoluble in an aqueous solution in which the other coating is soluble.
Claim 18
Dependent Claim
25 words
The process of claim 15 where one coating is soluble in an aqueous acid solution and the other is soluble in an aqueous alkaline solution.
Claim 19
Dependent Claim
15 words
The process of claim 11 where the second organic coating is free of a photoinitiator.
Claim 20
Dependent Claim
13 words
The process of claim 11 where the second organic coating is a photoresist.
Claim 21
Dependent Claim
29 words
The process of claim 16 where the first organic coating is soluble in an aqueous acid solution and the second organic coating is soluble in an aqueous alkaline solution.
Claim 22
Dependent Claim
29 words
The process of claim 16 where the first organic coating is soluble in an aqueous alkaline solution and the second organic coating is soluble in an aqueous acid solution.
Claim 23
Dependent Claim
116 words
A process for altering a conductive substrate comprising the steps of applying a first organic coating over a surface of the conductive substrate in a relief image pattern whereby a part of the conductive surface is coated with said first organic coating and a part of the conductive surface is not coated with said first organic coating, electrophoretically depositing a second organic coating over uncoated areas of the conductive coating, said first and second organic coating being soluble in different solvents, dissolving the first organic coating in a solvent that is not a solvent for the second organic coating, thereby exposing the underlying conductive surface in an image pattern, and permanently altering the exposed underlying surface.
Claim 24
Dependent Claim
116 words
A process for altering a conductive substrate comprising the steps of applying a first organic coating over a surface of the conductive substrate in a relief image pattern whereby a part of the conductive surface is coated with said first organic coating and a part of the conductive surface is not coated with said first organic coating, electrophoretically depositing a second organic coating over uncoated areas of the conductive coating, said first and second organic coating being soluble in different solvents, dissolving the first organic coating in a solvent that is not a solvent for the second organic coating, thereby exposing the underlying conductive surface in an image pattern, and permanently altering the exposed underlying surface.
Claim 25
Dependent Claim
11 words
The process of claim 21 where the conductive substrate is metal.
Claim 26
Dependent Claim
23 words
The process of claim 22 where the first organic coating is a photoresist that is exposed and developed to yield a relief image.
Claim 27
Dependent Claim
21 words
The process of claim 23 where the first organic coating is electrophoretically applied, exposed and developed to yield a relief image.
Claim 28
Dependent Claim
32 words
The process of claim 22 where the first and second coatings are soluble in aqueous solutions and each coating is insoluble in an aqueous solution in which the other coating is soluble.
Claim 29
Dependent Claim
37 words
The process of claim 21 where the substrate having said first and second organic coatings is blanket exposed to a source of activating radiation for the second organic coating prior to removal of the first organic coating.
Claim 30
Dependent Claim
25 words
The process of claim 25 where one coating is soluble in an aqueous acid solution and the other is soluble in an aqueous alkaline solution.
Claim 31
Dependent Claim
29 words
The process of claim 25 where the first organic coating is soluble in an aqueous alkaline solution and the second organic coating is soluble in an aqueous acid solution.
Claim 32
Dependent Claim
12 words
The process of claim 22 where the substrate is altered by etching.
Claim 33
Dependent Claim
15 words
The process of claim 22 where the substrate is altered by a metal plating process.
Claim 34
Dependent Claim
132 words
A process for forming a printed circuit board from a circuit board base material having a copper surface comprising the steps of applying a first organic coating over the copper surface of the base material in a relief image pattern whereby a part of the copper surface is coated with said first organic coating and a part of the copper surface is not coated with said first organic coating, electrophoretically depositing a second organic coating over uncoated areas of the copper surface, said first and second organic coatings being soluble in different solvents, dissolving the first organic coating in a solvent that is not a solvent for the second organic coating thereby exposing the underlying copper in an image pattern, removing the exposed underlying copper and removing the electrophoretically deposited organic coating.
Claim 35
Dependent Claim
132 words
A process for forming a printed circuit board from a circuit board base material having a copper surface comprising the steps of applying a first organic coating over the copper surface of the base material in a relief image pattern whereby a part of the copper surface is coated with said first organic coating and a part of the copper surface is not coated with said first organic coating, electrophoretically depositing a second organic coating over uncoated areas of the copper surface, said first and second organic coatings being soluble in different solvents, dissolving the first organic coating in a solvent that is not a solvent for the second organic coating thereby exposing the underlying copper in an image pattern, removing the exposed underlying copper and removing the electrophoretically deposited organic coating.
Claim 36
Dependent Claim
27 words
The process of claim 31 including the step of electrolytically depositing copper over uncoated areas of the copper prior to electrophoretic deposition of the second organic coating.
Claim 37
Dependent Claim
23 words
The process of claim 32 where the first organic coating is a photoresist that is exposed and developed to yield a relief image.
Claim 38
Dependent Claim
15 words
The process of claim 33 where the photoresist is a negatively acting dry film resist.
Claim 39
Dependent Claim
15 words
The process of claim 33 where the photoresist is electrophoretically deposited over the conductive substrate.
Claim 40
Dependent Claim
25 words
The process of claim 33 where one coating is soluble in an aqueous acid solution and the other is soluble in an aqueous alkaline solution.
Claim 41
Dependent Claim
29 words
The process of claim 33 where the first organic coating is soluble in an aqueous alkaline solution and the second organic coating is soluble in an aqueous acid solution.
Claim 42
Dependent Claim
14 words
The process of claim 33 where the second organic coating is not photo imageable.
Claim 43
Dependent Claim
13 words
The process of claim 16 where the second organic coating is a photoresist.
Claim 44
Dependent Claim
53 words
The process of claim 33 where the relief pattern comprising the first organic coating includes tabs and the process includes the steps of blanket exposing the second organic coating to a band of activating radiation in an area immediately adjacent to and above the tabs, removing the unexposed coating and electroplating said tabs.
Claim 45
Dependent Claim
66 words
A process for plating the tabs of a printed circuit board comprising conductive signal lines and including conductive tabs, said process comprising electrophoretically depositing a light sensitive organic coating over the conductive signal lines, exposing the coating to activating radiation in a band immediately above the tabs and adjacent thereto, developing the coating to remove the eletrophoretically deposited coating from the tabs and plating said tabs.
Claim 46
Dependent Claim
66 words
A process for plating the tabs of a printed circuit board comprising conductive signal lines and including conductive tabs, said process comprising electrophoretically depositing a light sensitive organic coating over the conductive signal lines, exposing the coating to activating radiation in a band immediately above the tabs and adjacent thereto, developing the coating to remove the eletrophoretically deposited coating from the tabs and plating said tabs.
Claim 47
Dependent Claim
15 words
The process of claim 41 where the organic coating is deposited over copper conductor lines.
Claim 48
Dependent Claim
18 words
The process of claim 41 where the organic coating is deposited over copper conductor lines coated with solder.
Claim 49
Dependent Claim
75 words
An article of manufacture comprising a conductive surface coated with an organic coating comprising discrete areas of two different coating compositions where a. one discrete area is in a negative image of the other; b. one coating composition is capable of being stripped in a solvent that is not a solvent for the other coating composition; and c. one coating composition is capable of electrophoretic deposition from a liquid solution and the other is not.
Claim 50
Dependent Claim
75 words
An article of manufacture comprising a conductive surface coated with an organic coating comprising discrete areas of two different coating compositions where a. one discrete area is in a negative image of the other; b. one coating composition is capable of being stripped in a solvent that is not a solvent for the other coating composition; and c. one coating composition is capable of electrophoretic deposition from a liquid solution and the other is not.
Claim 51
Dependent Claim
31 words
The article of claim 44 where each discrete area of organic coating is soluble in aqueous solutions and each is insoluble in an aqueous solution in which the other is soluble.
Claim 52
Dependent Claim
28 words
The article of claim 44 where one area of the coating is soluble in an aqueous acid solution and the other is soluble in an aqueous alkaline solution.
Claim 53
Dependent Claim
16 words
The article of claim 44 where at least one area of the coating is a photoresist.
Claim 54
Dependent Claim
14 words
The article of claim 44 where each area of the coating is a photoresist.
Claim 55
Dependent Claim
10 words
The article of claim 44 where the coating is planar.
Claim 56
Dependent Claim
11 words
The article of claim 44 where the coating is non planar.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.