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EP0254948A2
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EP
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Microelectronic device and thick film hybrid circuit
Assignee: BASF SE
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Filing: 1987-07-14
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Granted: —
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Expires: 2007-07-14
Abstract
Abstract Translated from German Mikroelektronische Bauelemente sowie Dickschicht-Hybridschaltungen, bei denen die Mehrschichtensubstrate der mikroelektronischen Bauelemente sowie die Substrate der Dickschicht-Hybridschaltungen unter Verwendung von thermoplastisch verarbeitbaren flüssigkristallinen Polymeren hergestellt worden sind. Microelectronic components and thick-film hybrid circuits in which the multilayer substrates of the microelectronic components and the substrates of the thick-film hybrid circuits have been produced using thermoplastically processable liquid-crystalline polymers.
Inventors
- 👤 Michael Dr. Portugall
- 👤 Hans-Josef Dr. Sterzel
- 👤 Gerd Dr. Blinne
- 👤 Heinz-Dieter Vondenhagen
- 👤 Erhard Dr. Seiler
- 👤 Hans-Friedrich Dr. Schmidt
- 👤 Sybille Von Tomkewitsch
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-24 05:53
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31786
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