EP0247644A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Integrated circuit die-to-lead frame connection using an intermediate bridging member
Assignee: Advanced Micro Devices Inc
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Filing: 1987-03-19
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Granted: —
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Expires: 2007-03-19
Abstract
Abstract In order to prevent bonding wire sag and to allow high lead count an insulative bridging member is provided between the ends of inner leads of a lead frame and a centrally mounted integrated circuit die. The bridging member (30) of annular square configuration has transverse plated spaced conductive pathways (31 A first series of short bonding wires (40) connect selected die contact pads to an inner end of selected conductive pathways and a second concentric series of bonding wires (41) connect an outer end of the selective conductive pathways of the bridging member to selected ones of the inner leads of the lead frame. The above elements except for outer leads of the lead frame are encapsulated to form an overall die package with external leads or pin contacts.
Inventors
- 👤 Robert L. Comstock
- 👤 Steven L. Baburek
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 00:16
CPC Classifications
H; H10; H10W; H10W99/00; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W90/00; H10W90/701; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
181 words
An integrated circuit die-to-lead-frame interconnection assembly comprising: a lead frame of conductive metallic material having a first predetermined pattern of outer peripheral leads, a second predetermined pattern of inner leads connected to said first predetermined pattern of outer peripheral leads and converging to inwardly spaced positions, frame means for interconnecting said outer peripheral leads, and a central die-mounting surface extending from said frame means and spacedly extending inwardly from an inner terminus of said inner leads; an integrated circuit die having die contact pads on an exterior surface, said die being mounted on said central die-mounting surface; an insulative bridging member mounted on said central die-mounting surface spacedly between said die and an inner terminus of said inner leads, said bridging member having a transverse series of spaced conductive pathways thereon; a first series of bonding wires connecting selected ones of said die contact pads to an inner end of selected ones of-said conductive pathways; and a second series of bonding wires connecting an outer end of said selected ones of said conductive pathways to selected ones of said inner leads.
Claim 2
Dependent Claim
181 words
An integrated circuit die-to-lead-frame interconnection assembly comprising: a lead frame of conductive metallic material having a first predetermined pattern of outer peripheral leads, a second predetermined pattern of inner leads connected to said first predetermined pattern of outer peripheral leads and converging to inwardly spaced positions, frame means for interconnecting said outer peripheral leads, and a central die-mounting surface extending from said frame means and spacedly extending inwardly from an inner terminus of said inner leads; an integrated circuit die having die contact pads on an exterior surface, said die being mounted on said central die-mounting surface; an insulative bridging member mounted on said central die-mounting surface spacedly between said die and an inner terminus of said inner leads, said bridging member having a transverse series of spaced conductive pathways thereon; a first series of bonding wires connecting selected ones of said die contact pads to an inner end of selected ones of-said conductive pathways; and a second series of bonding wires connecting an outer end of said selected ones of said conductive pathways to selected ones of said inner leads.
Claim 3
Dependent Claim
28 words
The interconnection assembly of Claim 1 in which said first and second predetermined patterns each comprise sets of parallel leads extending from opposed sides of said lead frame.
Claim 4
Dependent Claim
25 words
The interconnection assembly of Claim 1 in which said bridging member comprises an annular square peripherally extending in spaced relation around said integrated circuit die.
Claim 5
Dependent Claim
18 words
The interconnection assembly of Claim 1 in which said conductive pathways on said bridging member are plated metal.
Claim 6
Dependent Claim
29 words
The interconnection assembly of Claim 1 in which said bridging member is spaced less than 100 mils from said die and less than 100 mils from said inner leads.
Claim 7
Dependent Claim
27 words
The interconnection assembly of Claim 1 in which each bonding wire of said first and second series of bonding wires are less than 100 mils in length.
Claim 8
Dependent Claim
36 words
The interconnection assembly of Claim 1 in which said transverse series of spaced conductive pathways on said bridging member converge from an outer periphery of said bridging member to an inner periphery of said bridging member.
Claim 9
Dependent Claim
43 words
The interconnection assembly of Claim 1 further comprising an insulating package encapsulating said integrated circuit die, said bridging member, said first and second series of bonding wires and said inner leads and wherein said outer peripheral leads extend exteriorly from said insulating package.
Claim 10
Independent Claim
132 words
The method of interconnecting an integrated circuit die having die contact pads thereon to.a lead frame comprising: providing a metallic lead frame having interconnected adjacent outer peripheral leads and inner leads and a central die-mounting surface extending inwardly of and spaced from said inner leads; affixing an integrated circuit die to said central die-mounting surface; affixing on said central die-mounting surface an insulative bridging member having transverse, spaced conductive pathways thereon, between said integrated circuit die and said inner leads; bonding a first series of bonding wires between selected ones of said die contacts and an inner end of selected ones of said conductive pathways; and bonding a second series of bonding wires between an outer end of said selected ones of said conductive pathways and selected ones of said inner leads.
Claim 11
Independent Claim
132 words
The method of interconnecting an integrated circuit die having die contact pads thereon to.a lead frame comprising: providing a metallic lead frame having interconnected adjacent outer peripheral leads and inner leads and a central die-mounting surface extending inwardly of and spaced from said inner leads; affixing an integrated circuit die to said central die-mounting surface; affixing on said central die-mounting surface an insulative bridging member having transverse, spaced conductive pathways thereon, between said integrated circuit die and said inner leads; bonding a first series of bonding wires between selected ones of said die contacts and an inner end of selected ones of said conductive pathways; and bonding a second series of bonding wires between an outer end of said selected ones of said conductive pathways and selected ones of said inner leads.
Claim 12
Dependent Claim
65 words
The method of Claim 9 further comprising: encapsulating said integrated circuit die, said insulative bridging member, said first and second series of bonding wires and said inner leads; and breaking the interconnection between said adjacent outer peripheral leads and inner leads such that a package having discrete external outer peripheral leads in electrical connection to selected contact pads of said integrated circuit die is formed.
Claim 13
Dependent Claim
23 words
The method of Claim 9 including the step of plating said insulative bridging member with a metal to form said spaced conductive pathways.
Claim 14
Dependent Claim
26 words
The method of Claim 11 in which said plating step comprises plating successive thin layers of copper, nickel and gold on a polyimide insulative bridging member.
References Cited (Backward Citations)
FR2564244A1
Cited
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