Integrated circuit chips cooling module having coolant leakage prevention device

Claim 2

An integrated circuit chips cooling module (100) comprising integrated circuit chips (2) mounted on a wiring substrate (3); cooling members (1) having an internal space through which a coolant flows, said cooling members (1) being thermally coupled with said integrated circuit chips (2); and a coolant flow system (7, 5, 10) which allows a coolant to flow into and out of said internal space of the cooling member (1), characterized by being provided with coated portions for each portion of the surface of said coolant circulating system (7, 5, 10) where the leakage of the coolant may possibly take place, the coating of said coated portions comprising an organic or inorganic high-­molecular compound (14) curable by reacting with the coolant to keep the latter from leakage.

Claim 3

An integrated circuit chips cooling module according to claim 1, characterized in that the coated portion is a coating layer comprising the high-molecular compound (14) which is applied to the surface of the coolant flow system (5, 7, 10).

Claim 4

An integrated circuit chips cooling module according to claim 1, characterized in that the surface of a portion of the coolant flow system has a double-wall structure filled with the high-molecular compound (14).

Claim 5

An integrated circuit chips cooling module according to claim 2 or 3, characterized in that the coolant is water and the high-molecular compound (14) is a polymer formed by the reaction under anhydrous conditions between a reactive polysiloxane and a polyfunctional silane compound having a hydrolyzable group.

Claim 6

An integrated circuit chips cooling module according to claim 1, 2 or 3, characterized in that the coolant is water and the high-molecular compound (14) is a polymer which is formed by reacting under anhydrous conditions a reactive polysiloxane having a hydroxyl group at both ends with a polyfunctional silane compound and which, upon reacting with the water, undergoes a condensation reaction of the alcohol elimination type and becomes hardened, thereby yielding an organic silicone rubber and a by-product alcohol.

Claim 7

An integrated circuit chips cooling module according to any of claims 1 to 5, characterized in that there is provided a means (15) for detecting the coolant leakage by detecting the by-product formed in the curing reaction of the high-molecular compound (14) with the leaked coolant.

Claim 8

An integrated circuit chips cooling module according to claim 6, characterized in that the coolant leakage detection means comprises (a) a detection sensor (15) for detecting the by-product formed in the curing reaction of the high-molecular compound (14) curable upon reaction with the coolant and (b) a circuit which, in response to the signal from said detection sensor (15), transmits at least either a leak detection alarm or a leak detection display (16).

Claim 9

An integrated circuit chips cooling module according to claim 7, characterized in that the detection sensor (15) is a sensor for detecting an alcohol.

Claim 10

An integrated circuit chips cooling module comprising a plurality of integrated circuit chips (2) mounted on a wiring substrate (3); a plurality of cooling members (1) which allow a coolant to flow inside them and which are thermally coupled with each of said integrated circuit chips (2); and a coolant flow system (5, 7, 10) which allows the coolant to flow through a plurality of said cooling members (1), characterized by being provided with coated portions for each portion of the surface of said coolant flow system (5, 7, 10) where the leakage of the coolant may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular compound (14) which is curable by reacting with the coolant keep the latter from leakage.

Claim 11

An integrated circuit chips cooling module comprising a plurality of integrated circuit chips (2) mounted on a wiring substrate (3); a plurality of cooling members (1) which allow a coolant to flow inside them and which are thermally coupled with each of said integrated circuit chips (2); and a coolant flow system (5, 7, 10) which allows the coolant to flow through a plurality of said cooling members (1), characterized by being provided with coated portions for each portion of the surface of said coolant flow system (5, 7, 10) where the leakage of the coolant may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular compound (14) which is curable by reacting with the coolant keep the latter from leakage.

Claim 12

An integrated circuit chips cooling module according to claim 9, characterized in that the coated portion is a coating layer comprising the high-molecular compound (14) which is applied to the surface of the coolant flow system.

Claim 13

An integrated circuit chips cooling module according to claim 9, characterized in that the surface of a portion of the coolant flow system has a double-wall structure (17, 10) filled with the high-molecular compound.

Claim 14

An integrated circuit chips cooling module according to claim 9, characterized in that the coated portion is provided on the surface of a bellows-like pipe member (10) which allows the coolant to flow into and from each of the cooling members (1).

Claim 15

An integrated circuit chips cooling module according to any of Claims 9 to 12, characterized in that the coolant is water and the high-molecular compound (14) is a polymer formed by the reaction under anhydrous conditions between a reactive polysiloxane and a polyfunctional silane compound having a hydrolyzable group.

Claim 16

An integrated circuit chips cooling module according to any of Claims 9 to 12, characterized in that the coolant is water and the high-molecular compound (14) is a polymer which is formed by the reaction under anhydrous conditions between a reactive polysiloxane having a hydroxyl group at both ends and a polyfunctional silane compound having an alkoxyl group and which, upon reacting with the water, undergoes a condensation reaction of the alcohol elimination type and becomes cured, thereby yielding an organic silicone rubber and a by-product alcohol.

Claim 17

An integrated circuit chips cooling module according to any of Claims 9 to 14, characterized in that there is provided a means (15) for detecting the coolant leakage by detecting the by-product formed in the curing reaction of the high-molecular compound with the leaked coolant.

Claim 18

An integrated circuit chips cooling module according to Claim 15, characterized in that the coolant leakage detection means comprises (1) a detection sensor (15) for detecting the by-product formed in the curing reaction of the high-molecular compound which is curable upon reaction with the coolant and (b) a circuit which, in response to the signal from said detection sensor (15), transmits at least either a leak detection alarm or a leak detection display (16).

Claim 19

An integrated circuit chips cooling module according to Claim 16, characterized in that the detection sensor (15) is a sensor for detecting an alcohol.

Claim 20

An integrated circuit chips cooling module (100) comprising a plurality of integrated circuit chips (2) mounted on a wiring substrate (3); a plurality of cooling members (1) which allow a coolant to flow inside them and which are thermally coupled with each of said integrated circuit chips (2); a hut member (5) which, jointly with said wiring substrate (3), seals off said integrated circuit chips (2) and cooling members (1); and a coolant flow system (5, 7, 10) which allows a coolant to flow into and from each of said cooling members as well as to circulate through the cooling members (1) and which has bellows-like members (10) to connect coolant channels (7) to each cooling member (1) enclosed in said hut member (5), characterized by being provided with a coated portion on the surface of each of said bellows-like members (10), said coated portion comprising an organic or inorganic high-molecular compound (14) which is curable upon reaction with the coolant to keep the latter from leakage.

Claim 21

An integrated circuit chips cooling module (100) comprising a plurality of integrated circuit chips (2) mounted on a wiring substrate (3); a plurality of cooling members (1) which allow a coolant to flow inside them and which are thermally coupled with each of said integrated circuit chips (2); a hut member (5) which, jointly with said wiring substrate (3), seals off said integrated circuit chips (2) and cooling members (1); and a coolant flow system (5, 7, 10) which allows a coolant to flow into and from each of said cooling members as well as to circulate through the cooling members (1) and which has bellows-like members (10) to connect coolant channels (7) to each cooling member (1) enclosed in said hut member (5), characterized by being provided with a coated portion on the surface of each of said bellows-like members (10), said coated portion comprising an organic or inorganic high-molecular compound (14) which is curable upon reaction with the coolant to keep the latter from leakage.

Claim 22

An integrated circuit chips cooling module according to Claim 18, characterized in that the coolant is water and the high-molecular compound (14) is a polymer which is formed by the reaction under anhydrous conditions between a reactive polysiloxane having a hydroxyl group at both ends and polyfunctional silane compound having an alkoxyl group and which, upon reacting with the water, undergoes a condensation reaction of the alcohol elimination type and becomes cured, thereby yielding an organic silicone rubber and a by-product alcohol.

Claim 23

An integrated circuit chips cooling module according to Claim 18, wherein there is provided a means for detecting (15) the coolant leakage by detecting the by-­product formed in the curing reaction of the high-­molecular compound with the leaked coolant.