EP0245179A2
Expired / Lapsed
EP
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System for detachably mounting semiconductors on conductor substrate.
Assignee: Digital Equipment Corp
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Filing: 1987-05-06
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Granted: —
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Expires: 2007-05-06
Abstract
Abstract A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad (10) which is interposed between the semiconductor die (20) and the conductor substrate (22) The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resilient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semiconductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad.
Inventors
- 👤 James C.K. Lee
- 👤 Gene M. Amdahl
- 👤 Richard Beck
- 👤 Chune Lee
- 👤 Edward Hu
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 01:53
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W78/00; H10W40/20; H10W40/231; H10W40/233; H10W40/237; H10W40/242
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
112 words
A semiconductor die mounting system, said system comprising: a conductor substrate having an array of contacts on at least one face thereof; at least one semiconductor die having a plurality of contacts arranged in a pattern corresponding at least in part to the pattern of contacts on the conductor board; a resilient conductor pad capable of electrical conduction in one direction only; and means for holding the semiconductor die and resilient conductor pad in alignment with the contacts on the conductor substrate so that the resilient conductor pad is compressed between the die and the conductor substrate and the contacts on the die are aligned with corresponding contacts on the conductor substrate.
Claim 2
Dependent Claim
112 words
A semiconductor die mounting system, said system comprising: a conductor substrate having an array of contacts on at least one face thereof; at least one semiconductor die having a plurality of contacts arranged in a pattern corresponding at least in part to the pattern of contacts on the conductor board; a resilient conductor pad capable of electrical conduction in one direction only; and means for holding the semiconductor die and resilient conductor pad in alignment with the contacts on the conductor substrate so that the resilient conductor pad is compressed between the die and the conductor substrate and the contacts on the die are aligned with corresponding contacts on the conductor substrate.
Claim 3
Dependent Claim
40 words
A semiconductor die mounting system as in claim 1, wherein the resilient conductor pad comprises a block of resilient insulating material having two major parallel faces and a plurality of discrete conductor elements extending between said faces and perpendicular thereto.
Claim 4
Dependent Claim
34 words
A semiconductor die mounting system as in claim 2, wherein the maximum spacing of adjacent conductor elements in the conductor pad is less than the minimum spacing of adjacent contacts on the conductor board.
Claim 5
Dependent Claim
17 words
A semiconductor die mounting system as in claim 1, wherein the conductor substrate is a ceramic substrate.
Claim 6
Dependent Claim
26 words
A semiconductor die mounting system as in claim 4, wherein the ceramic substrate includes a pin grid on the face opposite the two-dimensional array of contacts.
Claim 7
Dependent Claim
20 words
A semiconductor die mounting system as in claim 4, wherein the ceramic substrate includes edge connectors formed about its periphery.
Claim 8
Dependent Claim
37 words
A semiconductor die mounting system as in claim 4, wherein the ceramic substrate includes a two dimensional array of contacts formed on two opposite faces and wherein at least one semiconductor die is mounted on each face.
Claim 9
Dependent Claim
56 words
A semiconductor die mounting system as in claim 1, wherein the means for holding the semiconductor die and resilient conductor pad includes a nest plate mounted over the conductor substrate for aligning the die and the pad and a cover mounted over the nest plate for compressing the die and conductor pad against the conductor substrate.
Claim 10
Dependent Claim
21 words
A semiconductor die mounting system as in claim 8, wherein the cover is sealed about its periphery to the conductor substrate.
Claim 11
Dependent Claim
16 words
A semiconductor die mounting system as in claim 8, wherein the cover is a heat sink.
Claim 12
Dependent Claim
25 words
A semiconductor die mounting system as in claim 10, further including a resilient heat conducting pad disposed between the semiconductor die and the heat sink.
Claim 13
Independent Claim
150 words
A system for mounting a plurality of semiconductor dies, said system comprising: a conductor substrate having a plurality of connector regions formed on at least one face thereof, wherein each connector region includes a two-dimensional array of contacts; a plurality of semiconductor dies, each die having a two-dimensional array of contacts arranged in a pattern corresponding at least in part to the pattern of contacts in the connector regions; a plurality of resilient conductor pads capable of electrical conduction in one direction only; a nest plate having a plurality of apertures arranged in a pattern corresponding to the pattern of connector regions on the conductor substrate; each of said apertures being shaped to receive a semiconductor die and a resilient conductor pad; and means for detachably holding the nesting plate on the conductor substrate and for compressing the die and conductor pads against corresponding conductor regions on the conductor plate.
Claim 14
Independent Claim
150 words
A system for mounting a plurality of semiconductor dies, said system comprising: a conductor substrate having a plurality of connector regions formed on at least one face thereof, wherein each connector region includes a two-dimensional array of contacts; a plurality of semiconductor dies, each die having a two-dimensional array of contacts arranged in a pattern corresponding at least in part to the pattern of contacts in the connector regions; a plurality of resilient conductor pads capable of electrical conduction in one direction only; a nest plate having a plurality of apertures arranged in a pattern corresponding to the pattern of connector regions on the conductor substrate; each of said apertures being shaped to receive a semiconductor die and a resilient conductor pad; and means for detachably holding the nesting plate on the conductor substrate and for compressing the die and conductor pads against corresponding conductor regions on the conductor plate.
Claim 15
Dependent Claim
37 words
A system as in claim 12, wherein the resilient conductor pads comprise a block of resilient insulating material having two major parallel faces and a plurality of discrete conductor elements extending between said faces and perpendicular thereto.
Claim 16
Dependent Claim
31 words
A system as in claim 13, wherein the maximum spacing of adjacent conductor elements in the conductor pad is less than the minimum spacing of adjacent contacts on the conductor board.
Claim 17
Dependent Claim
14 words
A system as in claim 12, wherein the conductor board is a ceramic substrate.
Claim 18
Dependent Claim
23 words
A system as in claim 15, wherein the ceramic substrate includes a pin grid on the face opposite the two-dimensional array of contacts.
Claim 19
Dependent Claim
17 words
A system as in claim 15, wherein the ceramic substrate includes edge connectors formed about its periphery.
Claim 20
Dependent Claim
37 words
A semiconductor die mounting system as in claim 15, wherein the ceramic substrate includes a two dimensional array of contacts formed on two opposite faces and wherein at least one semiconductor die is mounted on each face.
Claim 21
Dependent Claim
30 words
A semiconductor die mounting system as in claim 12, wherein the means for detachably holding the nesting plate comprises a cover having means for peripherally sealing against the conductor board.
Claim 22
Dependent Claim
16 words
A semiconductor die mounting system as in claim 19, wherein the cover is a heat sink.
Claim 23
Dependent Claim
27 words
A semiconductor die mounting system as in claim 20, further including a plurality of resilient heat conducting pads disposed between the semiconductor dies and the heat sink.
References Cited (Backward Citations)
No citation records indexed.
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