EP0244772A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Wafer cassette transfer mechanismand method
Assignee: SVG Lithography Systems Inc
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Filing: 1987-04-30
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Granted: —
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Expires: 2007-04-30
Abstract
Abstract A wafer cassette transfer mechanism (18) is disclosed which transfers a wafer cassette (19) from a transfer arm (10) to an elevator (12). The elevator (12) moves vertically, up or down, so as to move the wafer cassette to a second transfer arm. The second transfer arm can then move the wafer cassette to after processing equipment.
Inventors
- 👤 Peter Kochersperger
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 21:03
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/30; H10P72/32; H10P72/3218; H10P72/34; H10P72/3411; H10P72/3412; H10P72/3206; H10P72/33; H10P72/3312; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/139; Y10S414/14
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
188 words
A wafer cassette transfer mechanism wherein a wafer cassette is automatically moved from a first level to processng equipment on a second level comprising: a first transfer platform having a top surface adapted to removably hold a wafer cassette; a first transfer mechanism preferably connected to said first transfer platform, to move said first transfer platform along a first line of travel; a second transfer platform having a top surface adapted to removably hold a wafer cassette; a second transfer mechanism, operably connected to said second transfer platform, to move said second transfer platform along a second line of travel; said first and second transfer platforms being in vertical spaced relation to each other and substantially parallel to each other an elevator mechanism; an elevator platform, preferably connected to said elevator mechanism, having a top surface adapted to removably hold a wafer cassette; said elevator mechanism adapted to move said elevator platform along a third line of travel intersecting said first line of travel and said second line of travel; and said first transfer platform and said second transfer platform being adapted to interdigitally engage said elevator platform.
Claim 2
Dependent Claim
188 words
A wafer cassette transfer mechanism wherein a wafer cassette is automatically moved from a first level to processng equipment on a second level comprising: a first transfer platform having a top surface adapted to removably hold a wafer cassette; a first transfer mechanism preferably connected to said first transfer platform, to move said first transfer platform along a first line of travel; a second transfer platform having a top surface adapted to removably hold a wafer cassette; a second transfer mechanism, operably connected to said second transfer platform, to move said second transfer platform along a second line of travel; said first and second transfer platforms being in vertical spaced relation to each other and substantially parallel to each other an elevator mechanism; an elevator platform, preferably connected to said elevator mechanism, having a top surface adapted to removably hold a wafer cassette; said elevator mechanism adapted to move said elevator platform along a third line of travel intersecting said first line of travel and said second line of travel; and said first transfer platform and said second transfer platform being adapted to interdigitally engage said elevator platform.
Claim 3
Dependent Claim
38 words
A wafer cassette transfer mechanism as claimed in Claim 1 wherein said first and second transfer platforms have mechanical stops fixedly disposed on the surfaces thereof adapted to removably hold said wafer cassette in fixed spatial relation thereto.
Claim 4
Dependent Claim
32 words
A wafer cassette transfer mechanism as claimed in Claim 1 wherein said first and second transfer mechanisms are adapted to move said first and second transfer arms, respectively, relative to said elevator.
Claim 5
Independent Claim
302 words
A method for transferring a wafer cassette from a first level to processing equipment at a second level comprising: providing a first transfer platform having a top surface adapted to removably hold a wafer cassette; providing a first transfer mechanism, operably connected to said first transfer platform, to move said first transfer platform along a first line of travel; providing a second transfer platform having a top surface adapted to removably hold a wafer cassette; providing a second transfer mechanism, operably connected to said second transer platform, to move said second transer platform along a second line of travel; providing an elevator platform, adapted to removably hold a wafer cassette, and interdigitally engage said first and second transfer platforms operable to controllably move along a third line of travel intersecting said first line of travel and said second line of travel; placing a wafer cassette on said first transfer platforms; moving said elevator platform into almost coplanar relation with said first transfer platform; energizing said first transfer mechanism to move said first transfer platform into interdigital relation to said elevator platform; moving said elevator platform above the level of said transfer platform so as to lift the wafer cassette off said first transfer platform; energizing said first transfer platform to move away from said elevator platform ; moving said elevator platform into almost the same plane as said second transfer platform; energizing said second transfer mechanism to move said second transfer platform into interdigital relation with said elevator platform; moving said elevator platform into coplanar relation with said second transfer platform; moving said elevator platform below the plane of said second transfer platform so as to transfer the wafer cassette to said second transfer platform; and energizing said second transfer mechanism to move said second transfer platform away from said elevator platform.
Claim 6
Independent Claim
302 words
A method for transferring a wafer cassette from a first level to processing equipment at a second level comprising: providing a first transfer platform having a top surface adapted to removably hold a wafer cassette; providing a first transfer mechanism, operably connected to said first transfer platform, to move said first transfer platform along a first line of travel; providing a second transfer platform having a top surface adapted to removably hold a wafer cassette; providing a second transfer mechanism, operably connected to said second transer platform, to move said second transer platform along a second line of travel; providing an elevator platform, adapted to removably hold a wafer cassette, and interdigitally engage said first and second transfer platforms operable to controllably move along a third line of travel intersecting said first line of travel and said second line of travel; placing a wafer cassette on said first transfer platforms; moving said elevator platform into almost coplanar relation with said first transfer platform; energizing said first transfer mechanism to move said first transfer platform into interdigital relation to said elevator platform; moving said elevator platform above the level of said transfer platform so as to lift the wafer cassette off said first transfer platform; energizing said first transfer platform to move away from said elevator platform ; moving said elevator platform into almost the same plane as said second transfer platform; energizing said second transfer mechanism to move said second transfer platform into interdigital relation with said elevator platform; moving said elevator platform into coplanar relation with said second transfer platform; moving said elevator platform below the plane of said second transfer platform so as to transfer the wafer cassette to said second transfer platform; and energizing said second transfer mechanism to move said second transfer platform away from said elevator platform.
References Cited (Backward Citations)
US4124132A
Cited
DE3418243A1
Cited
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