EP0240333A2
Expired / Lapsed
EP
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Thermosetting resin compositions
Assignee: DuPont Toray Specialty Materials KK
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Filing: 1987-04-01
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Granted: —
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Expires: 2007-04-01
Abstract
Abstract Curable thermosetting resin compositions comprise a continuous phase of a curable thermosetting organic or a curable thermosetting silicone resin containing dispersed finely divided particles of a cured composition prepared by reacting 1) an organopolysiloxane, 2) a curing agent for the organopolysiloxane, 3) an alkoxy group-containing organosilicon compound and 4) a compound of aluminum or zirconium where this compound is an alkoxide, phenoxide, carboxylate or a derivative of a beta- dicarbonyl compound or o-hydroxyketone. Ingredients 3) and 4) can be prereacted and the cured composition optionally contains a filler. The presence of ingredients 3) and 4) imparts improved adhesion between the continuous and dispersed phases of the composition.
Inventors
- 👤 Yoshitsugu Morita
- 👤 Schoichi Shida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 16:57
CPC Classifications
C; C08; C08L; C08L83/00; C08L83/04; C08L101/00; C08L61/00; C08L61/04; C08G; C08G77/00; C08G77/04; C08G77/12; C08G77/20
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
170 words
A curable thermosetting resin composition comprising (A) 100 parts by weight of either a curable thermosetting organic resin or a curable thermosetting silicone resin, and (B) from 0.1 to 100 parts by weight of the cured product of a curable composition comprising (a) 100 parts by weight of an organopolysiloxane exhibiting a viscosity of at least 0.010 Pa.s at 25 degrees C, (b) from 0 to 100 parts by weight of a filler, (c) from 0.3 to 40 parts by weight of a curing agent for said organopolysiloxane, (d) from 0.1 to 20 parts by weight of an alkoxy group-containing organosilicon compound, and (e) from 0.001 to 5 parts by weight of (1) a compound of either aluminum or zirconium, where said compound is an alkoxide, a phenoxide, a carboxylate or a derivative of either a beta-diketone or a o- hydroxyketone, or (2) a reaction product of said compound with said alkoxy group-containing organosilicon compound. wherein ingredient (B) is dispersed in the form of very small particles in ingredient (A).
Claim 2
Dependent Claim
170 words
A curable thermosetting resin composition comprising (A) 100 parts by weight of either a curable thermosetting organic resin or a curable thermosetting silicone resin, and (B) from 0.1 to 100 parts by weight of the cured product of a curable composition comprising (a) 100 parts by weight of an organopolysiloxane exhibiting a viscosity of at least 0.010 Pa.s at 25 degrees C, (b) from 0 to 100 parts by weight of a filler, (c) from 0.3 to 40 parts by weight of a curing agent for said organopolysiloxane, (d) from 0.1 to 20 parts by weight of an alkoxy group-containing organosilicon compound, and (e) from 0.001 to 5 parts by weight of (1) a compound of either aluminum or zirconium, where said compound is an alkoxide, a phenoxide, a carboxylate or a derivative of either a beta-diketone or a o- hydroxyketone, or (2) a reaction product of said compound with said alkoxy group-containing organosilicon compound. wherein ingredient (B) is dispersed in the form of very small particles in ingredient (A).
Claim 3
Dependent Claim
24 words
A composition according to claim 1 wherein the thermosetting resin comprising ingredient (A) is an epoxy resin, phenolic resin, imide resin or silicone resin.
Claim 4
Dependent Claim
32 words
A composition according to claim 2 wherein the cured product comprising ingredient (B) is elastomeric and cured by means of a platinum catalyzed addition reaction or a peroxide initiated free radical reaction.
Claim 5
Dependent Claim
46 words
A composition according to claim 3 wherein said curable composition is a liquid that is curable by a platinum catalyzed addition reaction, said organopolysiloxane is a diorganovinyl terminated diorganopolysiloxane, and the curing agent is an organohydrogenpolysiloxane containing at least two silicon bonded hydrogen atoms per molecule.
Claim 6
Dependent Claim
25 words
A composition according to claim 4 where the silicon-bonded hydrocarbon radicals other than vinyl that are present in said diorganopolysiloxane and said organohydrogenpolysiloxane are methyl.
Claim 7
Dependent Claim
50 words
A composition according to claim 1 where said alkoxy group-containing organosilicon compound corresponds to the formula R¹ a Si(OR²) 4-a where each R¹ individually represents a monovalent hydrocarbon radical or a monovalent organofunctional group, R² is an alkyl group or alkoxy-substituted alkyl group, and a is 1, 2 or 3.
Claim 8
Dependent Claim
51 words
A composition according to claim 6 where at least one of the R¹ substituents is methyl, ethyl, propyl, vinyl, allyl or phenyl, the functional portion of the organofunctional group is epoxy, amino, methacryloxy or mercapto and is bonded to the silicon atom of the organoalkoxysilane through at least one carbon atom.
Claim 9
Dependent Claim
31 words
A composition according to claim 6 where said alkoxy group-containing organosilicon compound is present at a concentration of from 0.5 to 10 parts by weight per 100 parts of said organopolysiloxane.
Claim 10
Dependent Claim
33 words
A composition according to claim 7 where said alkoxy group-containing organosilicon compound is a silane selected from the group consisting of vinyltrimethoxysilane vinyltriethoxysilane methylvinyldimethoxysilane vinyltris(2-methoxyethoxy)silane gamma-methacryloxypropyltrimethoxysilane gamma-methacryloxypropylmethyldiethoxysilane gamma-glycidoxypropyltrimethoxysilane 2-(3,4-epoxycyclohexylethyl)trimethoxysilane gamma-mercaptopropyltriethoxysilane gamma-aminopropyltrimethoxysilane and gamma-(2-aminoethylamino)propyltrimethoxysilane
Claim 11
Dependent Claim
17 words
A composition according to claim 1 where said compound is aluminum acetylacetonate, zirconium acetylacetonate, or dibutoxyaluminum triethoxysilane.
Claim 12
Dependent Claim
20 words
A compositions according to claim 1 wherein the average particle size of ingredient (B) is no larger than 300 microns.
References Cited (Backward Citations)
No citation records indexed.
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