Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
33 words
A conductive copper paste composition comprising a copper metal powder, a resin component including a thermosetting resin, a fatty acid or a metal salt thereof, a metal chelating agent and a soldering accelerator.
Claim 2
Dependent Claim
33 words
A conductive copper paste composition comprising a copper metal powder, a resin component including a thermosetting resin, a fatty acid or a metal salt thereof, a metal chelating agent and a soldering accelerator.
Claim 3
Dependent Claim
71 words
A conductive copper paste composition according to Claim 1 which comprises 100 weight parts of a mixture of 85 to 95 weight percent of said copper metal powder and 15 to 5 weight percent of said resin component, 1 to 8 weight parts of said fatty acid or metal salt thereof, 1 to 50 weight parts of said metal chelating agent, and 0.1 to 2.5 weight parts of said soldering accelerator.
Claim 4
Dependent Claim
22 words
A conductive copper paste composition according to Claim 1 or 2 wherein said resin component is exclusively composed of said thermosetting resin.
Claim 5
Dependent Claim
38 words
A conductive copper paste composition according to Claim 1 or 2 wherein said resin component consists of 2 to 30 weight percent of a metal surface activator resin and 98 to 70 weight percent of said thermosetting resin.
Claim 6
Dependent Claim
48 words
A conductive copper paste composition according to Claim 1 or 2 wherein said resin component consists of 2 to 30 weight percent of a metal surface activator resin, 5 to 50 weight percent of a granular phenolic resin and 93 to 20 weight percent of said thermosetting resin.
Claim 7
Dependent Claim
36 words
A conductive copper paste composition comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or a metal salt thereof, and a metal chelating agent.
Claim 8
Dependent Claim
36 words
A conductive copper paste composition comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or a metal salt thereof, and a metal chelating agent.
Claim 9
Dependent Claim
62 words
A conductive copper paste composition according to Claim 6 which comprises 100 weight parts of a mixture of 85 to 95 weight percent of said copper metal powder and 15 to 5 weight percent of said resin component, 1 to 8 weight parts of said fatty acid or metal salt thereof, and 1 to 50 weight parts of said metal chelating agent.
Claim 10
Dependent Claim
38 words
A conductive copper paste composition according to Claim 6 or 7 wherein said resin component consists of 2 to 30 weight percent of said metal surface activator resin and 98 to 70 weight percent of said thermosetting resin.
Claim 11
Dependent Claim
46 words
A conductive copper paste composition according to Claim 6 or 7 wherein said resin component consists of 2 to 30 weight percent of p-tert-butylphenol resin, 2 to 30 weight percent of said metal surface activator resin and 96 to 40 weight percent of said thermosetting resin.