EP0238267A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed circuit board capable of preventing electromagnetic interference
Assignee: Nintendo Co Ltd
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Filing: 1987-03-13
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Granted: —
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Expires: 2007-03-13
Abstract
Abstract A printed circuit board capable of preventing electro- magenetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer actrs as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.
Inventors
- 👤 Katsuya Nakagawa
- 👤 Kazumasa Tatsuta Electric Wire Eguchi
- 👤 Fumio Tatsuta Electric Wire Nakatani
- 👤 Shinichi Tatsuta Electric Wire Wakita
- 👤 Hisatoshi Tatsuta Electric Wire Murakami
- 👤 Tsunehiko Tatsuta Electric Wire Terada
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 22:15
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/3468; H05K3/46; H05K3/4644; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
102 words
A printed circuit board capable of preventing electromagnetic interference, comprising: a base plate, a first electric conductive layer formed on at least one of the main surfaces of said base plate, said first electric conductive layer including a signal electrode portion and a ground electrode portion in accordance with a desired circuit pattern, and a second electric conductive layer formed so as to cover said signal electrode portion of said first electric conductive layer while insulated from said signal electrode portion, and a part of which being connected to said ground electrode portion to act as a shield against the electromagnetic interference.
Claim 2
Dependent Claim
102 words
A printed circuit board capable of preventing electromagnetic interference, comprising: a base plate, a first electric conductive layer formed on at least one of the main surfaces of said base plate, said first electric conductive layer including a signal electrode portion and a ground electrode portion in accordance with a desired circuit pattern, and a second electric conductive layer formed so as to cover said signal electrode portion of said first electric conductive layer while insulated from said signal electrode portion, and a part of which being connected to said ground electrode portion to act as a shield against the electromagnetic interference.
Claim 3
Dependent Claim
57 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 1, further comprising an insulating layer formed on said base plate except for a part of said ground electrode portion of said first electric conductive layer for insulating said signal electrode portion of said first electric conductive layer from said second electric conductive layer.
Claim 4
Dependent Claim
41 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 1 or 2, wherein said second electric conductive layer is formed so as to cover nearly the whole area of said signal electrode portion on said base plate.
Claim 5
Dependent Claim
29 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 1 through claim 3, wherein said second electric conductive layer includes a copper layer.
Claim 6
Dependent Claim
38 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 4, wherein said copper ink layer is formed by a copper ink which is made by mixing metallic copper powder, a binder and a dispersant.
Claim 7
Dependent Claim
27 words
A printed circuit board capable.of preventing electromagnetic interference in accordance with claim 5, wherein said binder is composed of a resin mixture including at least thermosetting resin.
Claim 8
Dependent Claim
27 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 5 or 6, wherein said dispersant includes saturated fatty acid or unsaturated fatty acid.
Claim 9
Dependent Claim
70 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 5 through claim 7, wherein said copper ink is made by blending 15 - 45 PHR in weight of a mixture of resol type phenol resin and p-tert-butyl phenol resin and 0.5 - 7 PHR in weight of unsaturated fatty acid or alkali metallic salt thereof with 100 PHR in weight of metallic copper powder.
Claim 10
Dependent Claim
35 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 8, wherein the blending ratio in weight of said resol type phenol resin and said p-tert-butyl phenol resin is 65:35 - 97:3.
Claim 11
Dependent Claim
31 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 8 or 9, wherein the degree of polymerization of said p-tert-butyl phenol resin is not more than 50.
Claim 12
Dependent Claim
65 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 5 through claim 7, wherein said copper ink is made by blending 15 x 50 PHR in weight of a resin mixture and 1 - 8 PHR in weight of saturated fatty acid or unsaturated fatty acid or metallic salt thereof with 100 PHR in weight of metallic copper powder.
Claim 13
Dependent Claim
43 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 11, wherein said resin mixture is composed of 20 - 60 weight percent of melamine resin and 80 - 40 weight percent of polyol and polyester resin and/or alkyd resin.
Claim 14
Dependent Claim
36 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 12, wherein the blending ratio in weight of polyester resin and/or alkyd resin and said polyol is 95 - 50: 5 - 50.
Claim 15
Dependent Claim
38 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 1 through claim 3, wherein said second electric conductive layer includes a solderable layer and a solder layer formed on said solderable layer.
Claim 16
Dependent Claim
24 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 14, wherein said solderable layer is formed by a high-resistance material.
Claim 17
Dependent Claim
25 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 14, wherein said solderable layer is formed by an electric conductive material.
Claim 18
Dependent Claim
24 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 16, wherein said electric conductive material includes a copper ink layer.
Claim 19
Dependent Claim
51 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 17, wherein said copper ink layer is formed by a copper ink which is made by mixing metallic copper powder, resin mixture, saturated fatty acid or unsaturated fatty acid or metallic salt thereof and a metallic chelating agent.
Claim 20
Dependent Claim
24 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 18, wherein said copper ink further includes a soldering accelerating agent.
Claim 21
Dependent Claim
31 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 18 or 19, wherein said resin mixture is made by mixing metal surface activating resin and thermosetting resin.
Claim 22
Dependent Claim
86 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 18 through claim 20, wherein said copper ink is composed of a total of 100 PHR in weight of 85 - 95 weight percent of metallic copper powder and 15 - 5 weight percent of resin mixture, 1 - 8 PHR in weight of fatty acid or metallic salt thereof, 1 - 50 PHR in weight of metallic chelating agent and 0.1 - 2.5 PHR in weight of soldering accelerating agent.
Claim 23
Dependent Claim
35 words
A printed circuit board capable of preventing electromagnetic interference in accordance with claim 22, wherein said resin mixture includes 2 - 30 weight percent of metal surface activating resin and the rest of thermosetting resin.
Claim 24
Dependent Claim
45 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 1 through claim 22, wherein said first electric conductive layer, said insulating layer and said second electric conductive layer are formed on the respective main surfaces of said base plate.
Claim 25
Dependent Claim
39 words
A printed circuit board capable of preventing electromagnetic interference in accordance with any of claim 1 through claim 23, further comprising a second insulating layer formed on said base plate so as to cover said second electric conductive layer.
Claim 26
Independent Claim
93 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference, comprising steps of: (a) forming a first electric conductive layer including a signal electrode portion and a ground electrode portion on at least one of the main surfaces of a base plate composed of an insulating material - in accordance with a-desired circuit pattern, and (b) forming a second electric conductive layer so as to cover said signal electrode portion on said first electric conductive layer while insulated therefrom and so as to be connected to said ground electrode portion.
Claim 27
Independent Claim
93 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference, comprising steps of: (a) forming a first electric conductive layer including a signal electrode portion and a ground electrode portion on at least one of the main surfaces of a base plate composed of an insulating material - in accordance with a-desired circuit pattern, and (b) forming a second electric conductive layer so as to cover said signal electrode portion on said first electric conductive layer while insulated therefrom and so as to be connected to said ground electrode portion.
Claim 28
Dependent Claim
64 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference in accordance with claim 25, further comprising step of (c) forming an insulating layer on said base plate except for a part of said ground electrode portion so as to cover said signal electrode portion of said first electric conductive layer, wherein said solderable layer is formed on said insulating layer.
Claim 29
Dependent Claim
69 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference in accordance with claim 25 or 26, wherein said step (b) includes a step of printing a copper ink made by mixing metallic copper powder, binder resin and a dispersant on said insulating layer and a step of forming a copper ink layer acting as a second electric conductive layer by curing the printed copper ink.
Claim 30
Dependent Claim
44 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference in accordance with claim 27, wherein said binder resin includes at least thermosetting resin, and said step of forming a copper ink layer includes a step of heating the printed copper-ink.
Claim 31
Independent Claim
104 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference comprising steps of: (a) forming a first electric conductive layer including a signal electrode portion and a ground electrode portion on at least one of the main surfaces of a base plate composed of an insulating material in accordance with a desired circuit pattern, (b) forming a solderable layer so as to cover said signal electrode portion on said first electric conductive layer while insulated therefrom and so as to be connected to said ground electrode portion, and (c) forming a solder layer on said solderable layer by means of soldering.
Claim 32
Independent Claim
104 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference comprising steps of: (a) forming a first electric conductive layer including a signal electrode portion and a ground electrode portion on at least one of the main surfaces of a base plate composed of an insulating material in accordance with a desired circuit pattern, (b) forming a solderable layer so as to cover said signal electrode portion on said first electric conductive layer while insulated therefrom and so as to be connected to said ground electrode portion, and (c) forming a solder layer on said solderable layer by means of soldering.
Claim 33
Dependent Claim
64 words
A method of manufacturing a printed circuit board capable of preventing electromagnetic interference in accordance with claim 29, further comprising step of (d) forming an insulating layer on said base plate except for a part of said ground electrode portion so as to cover said first electric conductive layer, wherein step (b) includes a step of forming said solderable layer on said insulating layer.
Claim 34
Dependent Claim
74 words
A printed circuit board comprising a base plate (12) a first conductive layer (14) formed on the base plate (12) and defining a desired circuit pattern, and a reference potential conductor layer (14a) on the base plate, characterised by a second electrically conductive layer (22) covering and electrically insulated from the first layer and connected to the reference potential conductor layer in such a manner to inhibit propogation of electrical inference from the board.
Claim 35
Dependent Claim
74 words
A printed circuit board comprising a base plate (12) a first conductive layer (14) formed on the base plate (12) and defining a desired circuit pattern, and a reference potential conductor layer (14a) on the base plate, characterised by a second electrically conductive layer (22) covering and electrically insulated from the first layer and connected to the reference potential conductor layer in such a manner to inhibit propogation of electrical inference from the board.
References Cited (Backward Citations)
No citation records indexed.
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