Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
239 words
A semiconductor laser (10) for emitting a continuous laser light of visible wavelength range comprising a semiconductor substrate (12) of a first conductivity type made of III-V compound semiconductor material, a first semiconductor cladding layer (18) of the first conductivity type provided above said substrate (12), an active layer (20) of semiconductor material formed on said cladding layer (18), and a plurality of semiconductor cladding layers of a second conductivity type formed on said active layer (20), thereby forming a double hetero- structure, characterized in that said cladding layer includes a second semiconductor cladding layer (22) formed directly on said active layer (20), and a third semiconductor cladding layer (26) which is formed on said second cladding layer (22) and is mesa-shaped to have slanted sides (26a, 26b) defining a waveguide channel, said first to third cladding layers (18, 22, 26) being made of compound semiconductor material comprising III-elements and V-elements, and that said laser (10) further comprises: a first semiconductive contact layer (30) of the second conductivity type formed on said third cladding layer (26), being mesa-shaped, and having slanted sides; and a semiconductive, current-blocking layer (34-1, 34-2) covering the slanted sides (26a, 26b) of said third cladding layer (26) and also the slanted sides of said first contact layer (30), said current-blocking layer (34-1, 34-2) being made of III-V compound semiconductor material which is substantially the same as the III-V compound semiconductor material of said substrate (12).
Claim 2
Dependent Claim
239 words
A semiconductor laser (10) for emitting a continuous laser light of visible wavelength range comprising a semiconductor substrate (12) of a first conductivity type made of III-V compound semiconductor material, a first semiconductor cladding layer (18) of the first conductivity type provided above said substrate (12), an active layer (20) of semiconductor material formed on said cladding layer (18), and a plurality of semiconductor cladding layers of a second conductivity type formed on said active layer (20), thereby forming a double hetero- structure, characterized in that said cladding layer includes a second semiconductor cladding layer (22) formed directly on said active layer (20), and a third semiconductor cladding layer (26) which is formed on said second cladding layer (22) and is mesa-shaped to have slanted sides (26a, 26b) defining a waveguide channel, said first to third cladding layers (18, 22, 26) being made of compound semiconductor material comprising III-elements and V-elements, and that said laser (10) further comprises: a first semiconductive contact layer (30) of the second conductivity type formed on said third cladding layer (26), being mesa-shaped, and having slanted sides; and a semiconductive, current-blocking layer (34-1, 34-2) covering the slanted sides (26a, 26b) of said third cladding layer (26) and also the slanted sides of said first contact layer (30), said current-blocking layer (34-1, 34-2) being made of III-V compound semiconductor material which is substantially the same as the III-V compound semiconductor material of said substrate (12).
Claim 3
Dependent Claim
25 words
The semiconductor laser according to claim 1, characterized in that said double hetero-structure comprises compound semiconductor material comprising a plurality of III-elements and one V-element.
Claim 4
Dependent Claim
59 words
The semiconductor laser according to claim 2, characterized in that said double hetero-structure is made of one material selected from the group consisting of In x Ga 1-x-y- AsyAs (0 < y < 1); In x G a1-x-y Aℓ y P (0 < y < 1); and ln x Ga 1-x-y Aℓ y As (0 < y < 1).
Claim 5
Dependent Claim
16 words
The semiconductor laser according to claim 3, characterized in that coefficient "y" is 0.8 or greater.
Claim 6
Dependent Claim
33 words
The semiconductor laser according to claim 3, characterized in that said substrate is made of GaAs, and said current-blocking layer is made of Ga 1-z Aℓ z As (0 < z i 1).
Claim 7
Dependent Claim
20 words
The semiconductor laser according to claim 5, characterized in that said substrate and said current-blocking layer are made of GaAs.
Claim 8
Dependent Claim
20 words
The semiconductor laser according to claim 3, characterized in that said substrate and said current-blocking layer are made of InP.
Claim 9
Dependent Claim
45 words
The semiconductor laser according to claim 1, characterized by further comprising: a second semiconductive contact layer (32) of the second conductivity type covering the top surfaces of said first contact layer and said current-blocking layer, and being thick enough to have a flat top surface.
Claim 10
Dependent Claim
47 words
The semiconductor laser according to claim 8, characterized by further comprising: a third semiconductive contact layer (30) of the second conductivity type covering the top surfaces of said third cladding layer (26), and interposed between said third cladding layer (26) and said first semiconductive contact layer (32).
Claim 11
Dependent Claim
30 words
The semiconductor laser according to claim 9, characterized in that said first and second contact layers (32, 36) are made of said lll-V compound semiconductor material like said substrate (12).
Claim 12
Dependent Claim
68 words
The semiconductor laser according to claim 10, characterized in that said third conductive contact layer (30) is made of compound semiconductor material comprising a plurality of III-elements and one V-element, like said first, second and third cladding layers, and reduces the rate of variation of the band gap between said third cladding layer (26) and said first semiconductive contact layer (32) to thereby lower the electrical resistance therebetween.
Claim 13
Dependent Claim
40 words
The semiconductor laser according to claim 11, characterized by further comprising: a fourth cladding layer (24) of the first conductivity type formed on said second cladding layer (22) and contacting said third cladding layer (26) and said current-blocking layer (34).
Claim 14
Dependent Claim
55 words
The semiconductor laser according to claim 12, characterized in that said first to fourth cladding layers (18, 22, 24, 26) are made of a material selected from group consisting of In x Ga 1-x-y Aℓ y P (0 i y i 1); and In x Ga 1-x-y Aℓ y As (0 i y s 1).
Claim 15
Dependent Claim
16 words
The semiconductor laser according to claim 13, characterized in that coefficient "y" is 0.8 or greater.
Claim 16
Dependent Claim
35 words
The semiconductor laser according to claim 14, characterized in that said substrate is made of GaAs, and said current-blocking layer is made of Ga 1 - z Ai z As (0 i z i 1).
Claim 17
Dependent Claim
17 words
The semiconductor laser according to claim 15, characterized in that said current-blocking layer is made of GaAs.
Claim 18
Dependent Claim
20 words
The semiconductor laser according to claim 14, characterized in that said substrate and said current-blocking layer are made of InP.
Claim 19
Independent Claim
277 words
A method of manufacturing a semiconductor laser for emitting a continuous laser beam of visible wavelength range, characterized by comprising the steps of: forming a double hetero-structure on a semiconductor substrate (12) of a first conductivity type made of a III-V compound semiconductor material by means of metal organic chemical vapor deposition, said double hetero-structure comprising a first semiconductive cladding layer (18) of the first conductivity type, an active layer (20) of semiconductor material formed on said first cladding layer, a second semiconductive cladding layer (22) of a second conductivity type formed on said active layer, and a third semiconductive cladding layer (26) of the second conductivity type formed on said second cladding layer and made of compound semiconductor material comprising a plurality of III-elements and one V-element; forming a first semiconductive contact layer (32) of the second conductivity type on said double hetero-structure; forming an insulative layer (40) on said first contact layer; applying selective etching to said first contact layer (32) by using said insulative layer (40) as a mask, thereby forming a mesa-shaped layer (32') having a flat top surface and slanted sides; applying selective etching to said third cladding layer (26) by using said mesa-shaped layer (32') as a mask, thereby forming a waveguide channel and also a mesa-shaped layer (26') having a flat top surface and slanted sides; and forming a semiconductive, current-blocking layer (34, 62) of the first conductivity type on the resultant structure, said current-blocking layer (34, 62) covering the slanted sides of said third cladding layer and also the slanted sides of said first contact layer and being made of substantially the same III-V compound semiconductor as said substrate.
Claim 20
Independent Claim
277 words
A method of manufacturing a semiconductor laser for emitting a continuous laser beam of visible wavelength range, characterized by comprising the steps of: forming a double hetero-structure on a semiconductor substrate (12) of a first conductivity type made of a III-V compound semiconductor material by means of metal organic chemical vapor deposition, said double hetero-structure comprising a first semiconductive cladding layer (18) of the first conductivity type, an active layer (20) of semiconductor material formed on said first cladding layer, a second semiconductive cladding layer (22) of a second conductivity type formed on said active layer, and a third semiconductive cladding layer (26) of the second conductivity type formed on said second cladding layer and made of compound semiconductor material comprising a plurality of III-elements and one V-element; forming a first semiconductive contact layer (32) of the second conductivity type on said double hetero-structure; forming an insulative layer (40) on said first contact layer; applying selective etching to said first contact layer (32) by using said insulative layer (40) as a mask, thereby forming a mesa-shaped layer (32') having a flat top surface and slanted sides; applying selective etching to said third cladding layer (26) by using said mesa-shaped layer (32') as a mask, thereby forming a waveguide channel and also a mesa-shaped layer (26') having a flat top surface and slanted sides; and forming a semiconductive, current-blocking layer (34, 62) of the first conductivity type on the resultant structure, said current-blocking layer (34, 62) covering the slanted sides of said third cladding layer and also the slanted sides of said first contact layer and being made of substantially the same III-V compound semiconductor as said substrate.
Claim 21
Dependent Claim
25 words
The method according to claim 18, characterized in that said mesa-shaped first contact layer (32') is subjected to selective etching to have a reduced width.
Claim 22
Dependent Claim
56 words
The method according to claim 19, characterized in that said second semiconductive contact layer (36) of the second conductivity type is formed on said current-blocking layer (34), said second contact layer covering the top surface of said first contact layer and also covering said current-blocking layer, and being thick enough to have a flat top surface.
Claim 23
Dependent Claim
23 words
The method according to claim 20, characterized in that said insulative layer (40) is removed after said current-blocking layer (34) has been formed.
Claim 24
Dependent Claim
40 words
The method according to claim 19, characterized in that said insulative layer (40) is removed before said current-blocking layer (62) is formed, and said current-blocking layer (62) completely covers said third cladding layer (26) and said first contact layer (32).
Claim 25
Dependent Claim
40 words
The method according to claim 22, characterized in that a diffusion layer (64) of the second conductivity type is formed in said current-blocking layer (62) in such a manner that said diffusion layer partially overlaps said first contact layer (32).
Claim 26
Dependent Claim
24 words
The method according to claim 19, characterized in that said metal organic chemical vapor deposition is performed in an atmosphere of a reduced pressure.