EP0232026A2
Expired / Lapsed
EP
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Multilayer systems and their method of production
Assignee: Imperial Chemical Industries Ltd
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Filing: 1987-01-15
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Granted: —
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Expires: 2007-01-15
Abstract
Abstract A method of producing a multilayer system comprising the sequential steps of: l. adhering a continuous cohesive pattern of electrically conductive oxidisable material (e.g. copper) to an electrically insulating surface of a substrate. 2. oxidising the outer layer of the pattern, 3. coating the pattern and the parts of the substrate surface not adhering to the pattern with a firable dielectric, and 4. firing the dielectric to a temperature sufficient to cause fusion of the dielectric, whereby a bond is formed between the fused dielectric and the oxidised part of the pattern, and a multilayer system having the features of one so formed.
Inventors
- 👤 Peter Leslie Moran
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 20:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; H05K3/38; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/03; H05K2203/0315; H05K3/10; H05K3/108; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
119 words
A method of producing a multilayer system comprising the sequential steps of: a. adhering a pattern of electrically conductive oxidisable material to an electrically insulating surface of a substrate, b. oxidising part of the pattern, and c. coating the pattern and the parts of the substrate surface not adhering to the pattern with a firable dielectric, and then d. firing the dielectric to a temperature sufficient to cause fusion of the dielectric, whereby a bond is formed between the fused dielectric and the oxidised part of the pattern, characterised in that the pattern is solid and bonded to the substrate in step (a) and only the outer layer of the pattern (that not adhering to the substrate) is oxidised.
Claim 2
Independent Claim
119 words
A method of producing a multilayer system comprising the sequential steps of: a. adhering a pattern of electrically conductive oxidisable material to an electrically insulating surface of a substrate, b. oxidising part of the pattern, and c. coating the pattern and the parts of the substrate surface not adhering to the pattern with a firable dielectric, and then d. firing the dielectric to a temperature sufficient to cause fusion of the dielectric, whereby a bond is formed between the fused dielectric and the oxidised part of the pattern, characterised in that the pattern is solid and bonded to the substrate in step (a) and only the outer layer of the pattern (that not adhering to the substrate) is oxidised.
Claim 3
Independent Claim
96 words
A method according to claim l wherein step a. comprises forming a seed layer of an electrically conductive material on the surface by electroless deposition, forming a resist layer corresponding to a negative of the desired pattern onto the seed layer, electroplating a pattern comprising copper onto the exposed seed layer, and then removing the resist, step c. comprises screen printing an air-firing dielectric comprising particles of dielectric held together with a binder onto the pattern and any seed layer not covered by the pattern, and in step d. the firing is carried out in air.
Claim 4
Independent Claim
24 words
A method according to claim l wherein step a. also includes subsequently removing the seed layer selectively from area not covered by the pattern.
Claim 5
Independent Claim
67 words
A method of producing a multilayer system comprising the sequential steps of: a. oxidising part of a pattern of an electrically conductive oxidisable material b. burying the pattern in a firable dielectric, and then c. firing the dielectric to intimately bond the fired dielectric to the oxidised part of the pattern, characterised in that the pattern is solid, and only the surface of the pattern is oxidised.
Claim 6
Independent Claim
67 words
A method of producing a multilayer system comprising the sequential steps of: a. oxidising part of a pattern of an electrically conductive oxidisable material b. burying the pattern in a firable dielectric, and then c. firing the dielectric to intimately bond the fired dielectric to the oxidised part of the pattern, characterised in that the pattern is solid, and only the surface of the pattern is oxidised.
Claim 7
Dependent Claim
69 words
A method according to claim 4 wherein the pattern is formed by sputtering or evaporation through a mask or as a uniform coat with subsequent selective removal of the conductive material, by uniform plating with subsequent selective removal of the conductive material, by resist-guided electroless plating, or by directly chemically bonding a sheet of conductive material to a substrate at high temperature with subsequent selective removal of the material.
Claim 8
Independent Claim
79 words
A method of producing a multilayer system characterised by sequentially: a. coating an electrically insulating substrate with a seed layer of an electrically conductive oxidisable material which on oxidation is non-conductive and glass-forming, b. depositing a pattern of solid conductor on the seed layer, c. oxidising the parts of the seed layer not in contact with the pattern to their full depth, d. coating the whole with a firable dielectric e. firing the system to to fuse the dielectric.
Claim 9
Independent Claim
79 words
A method of producing a multilayer system characterised by sequentially: a. coating an electrically insulating substrate with a seed layer of an electrically conductive oxidisable material which on oxidation is non-conductive and glass-forming, b. depositing a pattern of solid conductor on the seed layer, c. oxidising the parts of the seed layer not in contact with the pattern to their full depth, d. coating the whole with a firable dielectric e. firing the system to to fuse the dielectric.
Claim 10
Dependent Claim
63 words
A multilayer structure comprising a substrate having at least one surface composed of an electrically insulating material, a solid pattern of an oxidisable electrically conductive material bonded to said surface and having an oxidised outer layer (that not adhering to the substrate), and a coating of fired dielectric both on said pattern and that part of said surface not bonded to said pattern.
Claim 11
Dependent Claim
63 words
A multilayer structure comprising a substrate having at least one surface composed of an electrically insulating material, a solid pattern of an oxidisable electrically conductive material bonded to said surface and having an oxidised outer layer (that not adhering to the substrate), and a coating of fired dielectric both on said pattern and that part of said surface not bonded to said pattern.
Claim 12
Dependent Claim
11 words
A structure according to claim 7 wherein the patern comprises copper.
Claim 13
Dependent Claim
18 words
A structure according to claim 7 wherein the seed layer and pattern comprise a material common to both.
Claim 14
Dependent Claim
28 words
l0. A structure according to claim 7 wherein the substrate comprises a ceramic, a glass or a glass-ceramic which does not fuse at temperatures at or below 900°C.
References Cited (Backward Citations)
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