EP0229629A2
Expired / Lapsed
EP
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Photosensitive resin composition
Assignee: Hitachi Ltd
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Filing: 1987-01-07
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Granted: —
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Expires: 2007-01-07
Abstract
Abstract Disclosed herein is a photosensitive resin composition composed mainly of an alkali-soluble organometallic polymer and a photosensitive dissolution inhibitor. The composition is used as a positive type resist which can be developed with an alkali developing solution. The resist has high sensitivity, high resolution, and resistance to oxygen plasma.
Inventors
- 👤 Hisashi Sugiyama
- 👤 Kazuo Nate
- 👤 Takashi Inoue
- 👤 Akiko Mizushima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 18:45
CPC Classifications
G; G03; G03C; G03C1/00; G03C1/72; G03F; G03F7/00; G03F7/004; G03F7/075; G03F7/0757
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
21 words
A photosensitive resin composition which comprises containing therein an alkali-soluble organometallic polymer and a photosensitive dissolution inhibitor as the major constituents.
Claim 2
Dependent Claim
21 words
A photosensitive resin composition which comprises containing therein an alkali-soluble organometallic polymer and a photosensitive dissolution inhibitor as the major constituents.
Claim 3
Dependent Claim
34 words
A photosensitive resin composition as claimed in Claim 1, wherein said alkali-soluble organometallic polymer is one in which all or a part of the metallic element contained therein is present in the main chain.
Claim 4
Dependent Claim
32 words
A photosensitive resin composition as claimed in Claim 2, wherein said alkali-soluble organometallic polymer is one which contains at least one member of Si, Ge, Sn, and Ti as the metallic element.
Claim 5
Dependent Claim
19 words
A photosensitive resin composition as claimed in Claim 3, wherein said alkali-soluble organometallic polymer is an alkali-soluble organosilicon polymer.
Claim 6
Dependent Claim
33 words
A photosensitive resin composition as claimed in Claim 4, wherein said alkali-soluble organosilicon polymer is one in which all or a part of the side chains are organic groups having phenolic hydroxyl groups.
Claim 7
Dependent Claim
19 words
A photosensitive resin composition as claimed in Claim 5, wherein said alkali-soluble organosilicon polymer is an alkali-soluble silmethylene polymer.
Claim 8
Dependent Claim
67 words
A photosensitive resin composition as claimed in Claim 6, wherein said alkali-soluble silmethylene polymer is one in which the unit represented by the following formula (1) accounts for more than 40% in the polymer skeleton. (wherein R 1 , R 2 , R', and R" are monovalent organic groups, and at least one of the four side chains is an organic group having a phenolic hydroxyl group.)
Claim 9
Dependent Claim
32 words
A photosensitive resin composition as claimed in Claim 7, wherein R 1 and R 2 are methyl groups, R" is hydrogen, and R 4 is a p-hydroxyphenyl group in the formula (1).
Claim 10
Dependent Claim
19 words
A photosensitive resin composition as claimed in Claim 5, wherein said alkali-soluble organosilicon polymer is an alkali-soluble siloxane polymer.
Claim 11
Dependent Claim
64 words
A photosensitive resin composition as claimed in Claim 9, wherein said alkali-soluble siloxane polymer is one in which the unit represented by the following formula (2) accounts for more than 40% in the polymer skeleton. (wherein R 5 and R 6 are monovalent organic groups, and at least either of R 5 and R 6 is an organic group having a phenolic hydroxyl group.)
Claim 12
Dependent Claim
26 words
A photosensitive resin composition as claimed in Claim 10, wherein R 5 is a methyl group and R" is a p-hydroxybenzyl group in the formula (2).
Claim 13
Dependent Claim
19 words
A photosensitive resin composition as claimed in Claim 5, wherein said alkali-soluble organosilicon polymer is an alkali-soluble polyorganosilsesquioxane polymer.
Claim 14
Dependent Claim
45 words
A photosensitive resin composition as claimed in Claim 12, wherein said alkali-soluble polyorganosilsesquioxane is one in which the unit represented by the following formula (3) accounts for more than 40% in the polymer skeleton. (wherein R' is an organic group having a phenolic hydroxyl group.)
Claim 15
Dependent Claim
20 words
A photosensitive resin composition as claimed in Claim 13, wherein R 7 is a p-hydroxybenzyl group in the formula (3).
Claim 16
Dependent Claim
20 words
A photosensitive resin composition as claimed in Claim 8, 11, or 14, wherein said photosensitive dissolution inhibitor is an o-quinonediazide.
Claim 17
Dependent Claim
30 words
A photosensitive resin composition as claimed in Claim 15, wherein the o-quinonediazide is a 1,2-naphtho- quinoneazide represented by the formula (4) below. (where R 8 is a monovalent organic group.)
Claim 18
Dependent Claim
24 words
A process for forming a fine pattern on a substrate using the photosensitive resin composition as claimed in any of claims 1 to 16.
Claim 19
Dependent Claim
22 words
A process for forming a fine pattern on a substrate as claimed in Claim 17, wherein said substrate is a silicon wafer.
References Cited (Backward Citations)
No citation records indexed.
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