EP0228869A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of manufacturing an electronic component package
Assignee: AT&T Inc
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Filing: 1986-12-17
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Granted: —
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Expires: 2006-12-17
Abstract
Abstract Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads (l3, l4 - l6, l7) formed from an upper (l5) and lower (l2) lead frame. The lower lead frame includes a paddle (ll) for mounting the chip (l0). The upper lead frame initially has its leads tied together (30-33) and a center portion is punched out to fit the size of the particular chip. The two lead frames are preferably coplanar in the area around the boundaries of the package encapsulant.
Inventors
- 👤 Harold William Moyer
- 👤 Harry Robert Scholz
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 14:17
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/40; H10W70/411; H10W70/421; H10W70/442; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
90 words
An encapsulated electrical component package comprising: an electrical component (10) with contact areas (20) on a surface thereof; a first level of conductive leads (13,14) electrically coupled to associated contact areas (20,21) on the component; CHARACTERISED BY a second level of conductive leads (16,17) disposed above the leads of the first level in an area proximate to said component and electrically coupled to associated contact areas (29) on the component, said leads extending from an area proximate to said component within the encapsulant (26) to an area outside the encapsulant.
Claim 2
Dependent Claim
90 words
An encapsulated electrical component package comprising: an electrical component (10) with contact areas (20) on a surface thereof; a first level of conductive leads (13,14) electrically coupled to associated contact areas (20,21) on the component; CHARACTERISED BY a second level of conductive leads (16,17) disposed above the leads of the first level in an area proximate to said component and electrically coupled to associated contact areas (29) on the component, said leads extending from an area proximate to said component within the encapsulant (26) to an area outside the encapsulant.
Claim 3
Dependent Claim
28 words
The device according to claim 1 wherein the leads (16,17) of the second level include a portion which is coplanar with the leads (13,14) of the first level.
Claim 4
Dependent Claim
26 words
The device according to claim 1 wherein the leads of the first and second level are formed from lead frame (12,15) disposed one above the other.
Claim 5
Dependent Claim
20 words
The device according to claim 1 further comprising spacing elements (18,19) disposed between the upper and lower level of leads.
Claim 6
Dependent Claim
34 words
The device according to claim 2 wherein the component and a portion of the leads are encapsulated in a material (26) which extends to the coplanar portion of the leads of the two levels.
Claim 7
Dependent Claim
21 words
The device according to claim 1 wherein the leads of the upper level are interdigitated with those of the lower level.
Claim 8
Independent Claim
148 words
A method of forming an electronic component package comprising the steps of: providing a first lead frame (12) including a portion (11) for mounting a component (10) and conductive leads (13,14) extending radially inward from a perimeter of the frame to an area proximate the mounting portion; CHARACTERIZED BY providing a second lead frame (l5) with conductive leads (l6, l7) extending radially inward from a perimeter of the frame, the end of each lead occupying a central portion of the frame; removing a portion of each lead from the second lead frame in the central portion according to the size of the component; and disposing the second lead frame with respect to the first lead frame so that the conductive leads of the second lead frame are located at a level above the conductive leads of the first lead frame in the area proximate to the mounting portion.
Claim 9
Independent Claim
148 words
A method of forming an electronic component package comprising the steps of: providing a first lead frame (12) including a portion (11) for mounting a component (10) and conductive leads (13,14) extending radially inward from a perimeter of the frame to an area proximate the mounting portion; CHARACTERIZED BY providing a second lead frame (l5) with conductive leads (l6, l7) extending radially inward from a perimeter of the frame, the end of each lead occupying a central portion of the frame; removing a portion of each lead from the second lead frame in the central portion according to the size of the component; and disposing the second lead frame with respect to the first lead frame so that the conductive leads of the second lead frame are located at a level above the conductive leads of the first lead frame in the area proximate to the mounting portion.
Claim 10
Dependent Claim
45 words
The method according to claim 7 wherein a portion of the leads of the second lead frame is bent and the second lead frame is disposed above the first lead frame so that this portion is coplanar with the leads of the first lead frame.
Claim 11
Dependent Claim
49 words
The method according to claim 7 wherein, prior to removal of a portion of each lead, the leads of the second lead frame are mechanically tied together at the central portion of the lead frame and this tie is cut out along with a desired amount of each lead.
Claim 12
Dependent Claim
23 words
l0. The method according to claim 7 further comprising the step of depositing spacer elements on the leads of the first lead frame.
References Cited (Backward Citations)
No citation records indexed.
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